Inventor · disambiguated record
Michele Derai
Also filed as: DERAI MICHELE
16 granted patents·12 pending applications·6 citations·filing 2018–2025
86Inventor score
Top patents by PatentIndex Score
28 records- 0191US11721614B2Method of manufacturing semiconductor devices and corresponding semiconductor device having vias and pads formed by laserST MICROELECTRONICS SRL·Filed 2020·Granted Aug 8, 2023·3 cites·18 claims
- 0278US11152289B2Semiconductor device and corresponding methodST MICROELECTRONICS SRL·Filed 2019·Granted Oct 19, 2021·2 cites·20 claims
- 0377US12381121B2Method of manufacturing semiconductor devices and corresponding deviceST MICROELECTRONICS SRL·Filed 2024·Granted Aug 5, 2025·0 cites·18 claims
- 0471US10818578B2Method of manufacturing semiconductor devices, corresponding device and circuitST MICROELECTRONICS SRL·Filed 2018·Granted Oct 27, 2020·1 cites·19 claims
- 0569US11626355B2Semiconductor device and corresponding methodST MICROELECTRONICS SRL·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 0669US2023411258A1Semiconductor device and corresponding methodST MICROELECTRONICS SRL·Filed 2023·Application pending·0 cites
- 0767US12424521B2Method of manufacturing semiconductor devices and corresponding semiconductor device having vias and pads formed by laserST MICROELECTRONICS SRL·Filed 2023·Granted Sep 23, 2025·0 cites·16 claims
- 0866US11901250B2Method of manufacturing semiconductor devices and corresponding deviceST MICROELECTRONICS SRL·Filed 2021·Granted Feb 13, 2024·0 cites·24 claims
- 0964US11133242B2Method of manufacturing semiconductor devices, corresponding device and circuitST MICROELECTRONICS SRL·Filed 2020·Granted Sep 28, 2021·0 cites·20 claims
- 1063US2025105024A1Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2024·Application pending·0 cites
- 1162US2024413120A1Semiconductor device and corresponding method of manufactureST MICROELECTRONICS SRL·Filed 2024·Application pending·0 cites
- 1260US11749588B2Semiconductor device and corresponding methodST MICROELECTRONICS SRL·Filed 2020·Granted Sep 5, 2023·0 cites·14 claims
- 1356US12211763B2Enhanced thermal dissipation in flip-chip semiconductor devices using laser direct structuring (LDS) technologyST MICROELECTRONICS SRL·Filed 2021·Granted Jan 28, 2025·0 cites·13 claims
- 1455US12165880B2Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2021·Granted Dec 10, 2024·0 cites·16 claims
- 1555US12068276B2Semiconductor device and corresponding method of manufactureST MICROELECTRONICS SRL·Filed 2021·Granted Aug 20, 2024·0 cites·13 claims
- 1654US2024332033A1Method of manufacturing semiconductor devices, corresponding semiconductor device and mounting assemblyST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1754US2023143539A1Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Application pending·0 cites
- 1852US11552024B2Method of manufacturing quad flat no-lead semiconductor devices and corresponding quad flat no-lead semiconductor deviceST MICROELECTRONICS SRL·Filed 2020·Granted Jan 10, 2023·0 cites·20 claims
- 1952US2023005803A1Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Application pending·0 cites
- 2052US2024178178A1Semiconductor device and corresponding methodST MICROELECTRONICS INT NV·Filed 2023·Application pending·0 cites
- 2151US12500148B2Method of coupling semiconductor dice, tool for use therein and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Granted Dec 16, 2025·0 cites·13 claims
- 2250US2023386980A1Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2023·Application pending·0 cites
- 2348US2022238473A1Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Application pending·0 cites
- 2447US11521861B2Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2020·Granted Dec 6, 2022·0 cites·23 claims
- 2546US11887959B2Chip-on-lead semiconductor device, and corresponding method of manufacturing chip-on-lead semiconductor devicesST MICROELECTRONICS SRL·Filed 2021·Granted Jan 30, 2024·0 cites·18 claims
- 2646US2025167058A1Enhanched thermal dissipation in flip-chip semiconductor devices using laser direct (lds) structuring technologyST MICROELECTRONICS SRL·Filed 2025·Application pending·0 cites
- 2746US2024038650A1Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2023·Application pending·0 cites
- 2841US2021187663A1Method of cutting semiconductor substrates and corresponding semiconductor productST MICROELECTRONICS SRL·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →