Inventor · disambiguated record
Michael Doelle
Also filed as: DOELLE MICHAEL · DOELLE MICHAEL B
9 granted patents·1 pending application·49 citations·filing 2004–2015
85Inventor score
Files withBURCHARD BERND2DOELLE MICHAEL B2SILICON MICROSTRUCTURES INC2AUGUST RICHARD J1DOELLE MICHAEL1
Top patents by PatentIndex Score
10 records- 0188US9403677B2Micro-electromechanical semiconductor componentELMOS SEMICONDUCTOR AG·Filed 2015·Granted Aug 2, 2016·5 cites·5 claims
- 0286US8132465B1Sensor element placement for package stress compensationDOELLE MICHAEL B·Filed 2008·Granted Mar 13, 2012·26 cites·21 claims
- 0385US9399572B2Microelectromechanical component and method for testing a microelectromechanical componentBURCHARD BERND·Filed 2012·Granted Jul 26, 2016·6 cites·20 claims
- 0476US9013015B2Micro-electromechanical semiconductor componentDOELLE MICHAEL·Filed 2011·Granted Apr 21, 2015·4 cites·2 claims
- 0574US8402835B2Compensation of stress effects on pressure sensor componentsAUGUST RICHARD J·Filed 2011·Granted Mar 26, 2013·5 cites·27 claims
- 0655US8916944B2Stress-sensitive micro-electromechanical device and use thereofBURCHARD BERND·Filed 2011·Granted Dec 23, 2014·1 cites·10 claims
- 0751US8820169B2Compensation of stress effects on pressure sensor componentsSILICON MICROSTRUCTURES INC·Filed 2013·Granted Sep 2, 2014·0 cites·38 claims
- 0850US8082796B1Temperature extraction from a pressure sensorDOELLE MICHAEL B·Filed 2009·Granted Dec 27, 2011·2 cites·20 claims
- 0942US2013008255A1Temperature extraction from a pressure sensorSILICON MICROSTRUCTURES INC·Filed 2011·Application pending·0 cites
- 1038US7567663B2Telephone call processingSIEMENS AG·Filed 2004·Granted Jul 28, 2009·0 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Michael Doelle files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →