Inventor · disambiguated record
Mingang Feng
Also filed as: FENG MINGANG
1 granted patent·3 pending applications·0 citations·filing 2021–2021
7Inventor score
Top patents by PatentIndex Score
4 records- 0143US11971446B2Interface system for interconnected die and MPU and communication method thereof58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Granted Apr 30, 2024·0 cites·8 claims
- 0230US2022276671A1The Clock Domain System of Interconnected Dies and Its Management Methods58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Application pending·0 cites
- 0330US2022276973A1Data transmission event used for interconnected dies58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Application pending·0 cites
- 0426US2022276677A1An Inter-Die High-Speed Expansion System And An Expansion Method Thereof58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →