Inventor · disambiguated record
Michimasa Funabashi
Also filed as: FUNABASHI MICHIMASA
11 granted patents·7 pending applications·251 citations·filing 1992–2018
92Inventor score
Top patents by PatentIndex Score
18 records- 0190US5734188ASemiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the sameHITACHI LTD·Filed 1996·Granted Mar 31, 1998·73 cites·13 claims
- 0273US5917211ASemiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the sameHITACHI LTD·Filed 1997·Granted Jun 29, 1999·37 cites·11 claims
- 0372US6727187B2Fabrication method for semiconductor deviceRENESAS TECH CORP·Filed 2001·Granted Apr 27, 2004·15 cites·22 claims
- 0466US6774047B2Method of manufacturing a semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2001·Granted Aug 10, 2004·8 cites·13 claims
- 0565US5264712ASemiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the sameHITACHI LTD·Filed 1992·Granted Nov 23, 1993·27 cites·10 claims
- 0664US6277749B1Method of manufacturing a semiconductor integrated circuit deviceHIATCHI LTD·Filed 1999·Granted Aug 21, 2001·22 cites·8 claims
- 0764US5482524AAtmospheric pressure, elevated temperature gas desorption apparatusHITACHI LTD·Filed 1994·Granted Jan 9, 1996·28 cites·12 claims
- 0861US6794305B2Method of manufacturing a semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2001·Granted Sep 21, 2004·6 cites·10 claims
- 0960US6029679ASemiconductor cleaning and production methods using a film repulsing fine particle contaminantsHITACHI LTD·Filed 1996·Granted Feb 29, 2000·17 cites·44 claims
- 1052US6326255B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Dec 4, 2001·4 cites·3 claims
- 1151US6284625B1Method of forming a shallow groove isolation structureHITACHI LTD·Filed 1999·Granted Sep 4, 2001·14 cites·7 claims
- 1247US2018254201A1Method for processing a substrate having a disk-shape with a single-wafer type process deviceJ E T CO LTD·Filed 2018·Application pending·0 cites
- 1341US2012257181A1Substrate treatment deviceFUNABASHI MICHIMASA·Filed 2010·Application pending·0 cites
- 1439US2005274694A1Manufacturing method of semiconductor deviceFUNABASHI MICHIMASA·Filed 2005·Application pending·0 cites
- 1538US2005067101A1Semiconductor manufacturing apparatus and manufacturing method of semiconductor deviceTRECENTI TECHNOLOGIES INC·Filed 2004·Application pending·0 cites
- 1637US2004063263A1Manufacturing method of semiconductor devicesFiled 2003·Application pending·0 cites
- 1737US2004262265A1Wet processing apparatus, wet processing method and manufacturing method of semiconductor deviceTRECENTI TECHNOLOGIES INC·Filed 2004·Application pending·0 cites
- 1836US2005233554A1Manufacturing method for semiconductor device and semiconductor manufacturing apparatusTSUGA TOSHIHITO·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →