Inventor · disambiguated record
Michael A. Gaynes
Also filed as: ACKARET JERRY D · GAYNES MICHAEL · GAYNES MICHAEL A · GAYNES MICHAEL ANTHONY
148 granted patents·3 pending applications·4,834 citations·filing 1993–2020
99Inventor score
Top patents by PatentIndex Score
151 records- 0199US6165885AMethod of making components with solder ballsIBM·Filed 1998·Granted Dec 26, 2000·265 cites·7 claims
- 0298US7808781B2Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirementsIBM·Filed 2008·Granted Oct 5, 2010·47 cites·14 claims
- 0398US6236115B1High density integrated circuit packaging with chip stacking and via interconnectionsIBM·Filed 1999·Granted May 22, 2001·342 cites·3 claims
- 0498US6187678B1High density integrated circuit packaging with chip stacking and via interconnectionsIBM·Filed 1999·Granted Feb 13, 2001·274 cites·16 claims
- 0598US6002177AHigh density integrated circuit packaging with chip stacking and via interconnectionsIBM·Filed 1995·Granted Dec 14, 1999·408 cites·20 claims
- 0696US8693200B2Semiconductor device cooling moduleCOLGAN EVAN G·Filed 2012·Granted Apr 8, 2014·31 cites·17 claims
- 0796US5744863AChip carrier modules with heat sinks attached by flexible-epoxyIBM·Filed 1995·Granted Apr 28, 1998·243 cites·34 claims
- 0895US9472789B2Thin, flexible microsystem with integrated energy sourceIBM·Filed 2014·Granted Oct 18, 2016·9 cites·19 claims
- 0995US5672548AMethod for attaching heat sinks directly to chip carrier modules using flexible-epoxyIBM·Filed 1996·Granted Sep 30, 1997·191 cites·36 claims
- 1094US8411444B2Thermal interface material application for integrated circuit coolingGAYNES MICHAEL ANTHONY·Filed 2010·Granted Apr 2, 2013·40 cites·14 claims
- 1194US6559666B2Method and device for semiconductor testing using electrically conductive adhesivesIBM·Filed 2001·Granted May 6, 2003·80 cites·16 claims
- 1294US5847929AAttaching heat sinks directly to flip chips and ceramic chip carriersIBM·Filed 1996·Granted Dec 8, 1998·164 cites·16 claims
- 1393US8115303B2Semiconductor package structures having liquid coolers integrated with first level chip package modulesBEZAMA RASCHID JOSE·Filed 2008·Granted Feb 14, 2012·28 cites·11 claims
- 1492US6740959B2EMI shielding for semiconductor chip carriersIBM·Filed 2001·Granted May 25, 2004·97 cites·28 claims
- 1592US6069023AAttaching heat sinks directly to flip chips and ceramic chip carriersIBM·Filed 1998·Granted May 30, 2000·115 cites·46 claims
- 1691US8772927B2Semiconductor package structures having liquid cooler integrated with first level chip package modulesBEZAMA RASCHID JOSE·Filed 2011·Granted Jul 8, 2014·12 cites·10 claims
- 1791US6695623B2Enhanced electrical/mechanical connection for electronic devicesIBM·Filed 2001·Granted Feb 24, 2004·54 cites·10 claims
- 1891US6251707B1Attaching heat sinks directly to flip chips and ceramic chip carriersIBM·Filed 2000·Granted Jun 26, 2001·63 cites·5 claims
- 1990US8026730B2Process for measuring heat spreader tiltIBM·Filed 2010·Granted Sep 27, 2011·10 cites·10 claims
- 2090US8008122B1Pressurized underfill cureIBM·Filed 2010·Granted Aug 30, 2011·13 cites·24 claims
- 2189US8963340B2No flow underfill or wafer level underfill and solder columnsFEGER CLAUDIUS·Filed 2011·Granted Feb 24, 2015·8 cites·16 claims
- 2289US6104093AThermally enhanced and mechanically balanced flip chip package and method of formingIBM·Filed 1998·Granted Aug 15, 2000·92 cites·15 claims
- 2389US5543585ADirect chip attachment (DCA) with electrically conductive adhesivesIBM·Filed 1994·Granted Aug 6, 1996·103 cites·21 claims
- 2488US6410988B1Thermally enhanced and mechanically balanced flip chip package and method of formingIBM·Filed 2000·Granted Jun 25, 2002·45 cites·18 claims
- 2587US7764069B2Process for measuring bond-line thicknessIBM·Filed 2007·Granted Jul 27, 2010·14 cites·12 claims
- 2687US6893591B2Thermoplastic adhesive preform for heat sink attachmentIBM·Filed 2002·Granted May 17, 2005·34 cites·9 claims
- 2787US6744132B2Module with adhesively attached heat sinkIBM·Filed 2002·Granted Jun 1, 2004·46 cites·9 claims
- 2887US6111323AReworkable thermoplastic encapsulantIBM·Filed 1997·Granted Aug 29, 2000·76 cites·10 claims
- 2987US5545465ACircuit board having a defined volume of solder or conductive adhesive deposited at interconnection sites for electrical circuitsIBM·Filed 1995·Granted Aug 13, 1996·71 cites·17 claims
- 3086US8651359B2Flip chip bonder head for forming a uniform filletGAYNES MICHAEL A·Filed 2010·Granted Feb 18, 2014·9 cites·12 claims
- 3186US8589102B2Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structuresCHAINER TIMOTHY J·Filed 2011·Granted Nov 19, 2013·6 cites·15 claims
- 3286US6545226B2Printed wiring board interposer sub-assemblyIBM·Filed 2001·Granted Apr 8, 2003·28 cites·8 claims
- 3386US6219238B1Structure for removably attaching a heat sink to surface mount packagesIBM·Filed 1999·Granted Apr 17, 2001·61 cites·15 claims
- 3486US5565033APressurized injection nozzle for screening pasteIBM·Filed 1995·Granted Oct 15, 1996·67 cites·10 claims
- 3585US6661661B2Common heatsink for multiple chips and modulesIBM·Filed 2002·Granted Dec 9, 2003·30 cites·7 claims
- 3685US5973389ASemiconductor chip carrier assemblyIBM·Filed 1997·Granted Oct 26, 1999·68 cites·14 claims
- 3785US5785799AApparatus for attaching heat sinks directly to chip carrier modules using flexible epoxyIBM·Filed 1997·Granted Jul 28, 1998·65 cites·4 claims
- 3885US5747101ADirect chip attachment (DCA) with electrically conductive adhesivesIBM·Filed 1996·Granted May 5, 1998·72 cites·15 claims
- 3985US5478700AMethod for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection headIBM·Filed 1993·Granted Dec 26, 1995·65 cites·21 claims
- 4084US5889321AStiffeners with improved adhesion to flexible substratesIBM·Filed 1997·Granted Mar 30, 1999·75 cites·7 claims
- 4183US8269340B2Curvilinear heat spreader/lid with improved heat dissipationGAYNES MICHAEL A·Filed 2007·Granted Sep 18, 2012·10 cites·13 claims
- 4283US6199751B1Polymer with transient liquid phase bondable particlesIBM·Filed 2000·Granted Mar 13, 2001·32 cites·12 claims
- 4382US6432511B1Thermoplastic adhesive preform for heat sink attachmentIBM·Filed 1997·Granted Aug 13, 2002·49 cites·5 claims
- 4482US5759737AMethod of making a component carrierIBM·Filed 1996·Granted Jun 2, 1998·62 cites·5 claims
- 4580US10607963B2Chip package for two-phase cooling and assembly process thereofIBM·Filed 2016·Granted Mar 31, 2020·3 cites·12 claims
- 4680US7319591B2Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packagesIBM·Filed 2005·Granted Jan 15, 2008·7 cites·10 claims
- 4780US6150726AComponent carrier with raised bonding sitesIBM·Filed 1998·Granted Nov 21, 2000·51 cites·6 claims
- 4880US5798050AProcess for fabrication of a selectively filled flexible adhesive device for solderless connection of electronic modules to a substrateIBM·Filed 1997·Granted Aug 25, 1998·50 cites·13 claims
- 4979US10548228B2Thermal interface adhesion for transfer molded electronic componentsIBM·Filed 2016·Granted Jan 28, 2020·1 cites·1 claims
- 5079US6129804ATFT panel alignment and attachment method and apparatusIBM·Filed 1998·Granted Oct 10, 2000·36 cites·34 claims
Showing the top 50 of 151 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →