Inventor · disambiguated record
Ming-Shiou Hsieh
Also filed as: Hsieh Ming-Shiou
7 granted patents·1 pending application·12 citations·filing 2016–2020
76Inventor score
Files withUNITED MICROELECTRONICS CORP8
Top patents by PatentIndex Score
8 records- 0189US9722030B1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 1, 2017·6 cites·12 claims
- 0287US9859164B1Method for manufacturing finsUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jan 2, 2018·5 cites·11 claims
- 0367US9842760B1Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Dec 12, 2017·1 cites·15 claims
- 0461US12501694B2Semiconductor device and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 16, 2025·0 cites·7 claims
- 0555US9947588B1Method for manufacturing finsUNITED MICROELECTRONICS CORP·Filed 2017·Granted Apr 17, 2018·0 cites·8 claims
- 0652US9966434B2Manufacturing method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 8, 2018·0 cites·8 claims
- 0745US11107689B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 31, 2021·0 cites·12 claims
- 0836US2019067477A1Semiconductor structure with doped fin-shaped structures and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →