Inventor · disambiguated record
Miho Jomen
Also filed as: JOMEN MIHO
6 granted patents·3 pending applications·43 citations·filing 2003–2008
80Inventor score
Top patents by PatentIndex Score
9 records- 0192US8247030B2Void-free copper filling of recessed features using a smooth non-agglomerated copper seed layerSUZUKI KENJI·Filed 2008·Granted Aug 21, 2012·23 cites·19 claims
- 0284US7846841B2Method for forming cobalt nitride cap layersTOKYO ELECTRON LTD·Filed 2008·Granted Dec 7, 2010·9 cites·20 claims
- 0374US7799681B2Method for forming a ruthenium metal cap layerTOKYO ELECTRON LTD·Filed 2008·Granted Sep 21, 2010·4 cites·24 claims
- 0471US7776740B2Method for integrating selective low-temperature ruthenium deposition into copper metallization of a semiconductor deviceTOKYO ELECTRON LTD·Filed 2008·Granted Aug 17, 2010·4 cites·19 claims
- 0566US7718527B2Method for forming cobalt tungsten cap layersTOKYO ELECTRON LTD·Filed 2008·Granted May 18, 2010·2 cites·27 claims
- 0660US7884012B2Void-free copper filling of recessed features for semiconductor devicesTOKYO ELECTRON LTD·Filed 2007·Granted Feb 8, 2011·1 cites·20 claims
- 0748US2006081461A1Electroless plating apparatus and methodTOKYO ELECTRON LTD·Filed 2005·Application pending·0 cites
- 0839US2005164499A1Electroless plating method and apparatusTOKYO ELECTRON LTD·Filed 2005·Application pending·0 cites
- 0937US2006037858A1Electroless plating apparatus and electroless plating methodTOKYO ELECTRON LTD·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →