Inventor · disambiguated record
Michimoto Kaminaga
Also filed as: KAMINAGA MICHIMOTO
21 granted patents·3 pending applications·215 citations·filing 2000–2020
95Inventor score
Files withSANDISK TECHNOLOGIES LLC7RENESAS ELECTRONICS CORP6RENESAS TECH CORP6UCHIYAMA HIROYUKI3HITACHI LTD1
Top patents by PatentIndex Score
24 records- 0198US11049876B2Three-dimensional memory device containing through-memory-level contact via structuresSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Jun 29, 2021·13 cites·9 claims
- 0298US10269820B1Three-dimensional memory device containing different pedestal width support pillar structures and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2018·Granted Apr 23, 2019·49 cites·20 claims
- 0396US6603162B1Semiconductor integrated circuit device including dummy patterns located to reduce dishingHITACHI LTD·Filed 2000·Granted Aug 5, 2003·69 cites·2 claims
- 0495US10727248B2Three-dimensional memory device containing through-memory-level contact via structuresSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Jul 28, 2020·16 cites·20 claims
- 0594US10903230B2Three-dimensional memory device containing through-memory-level contact via structures and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2018·Granted Jan 26, 2021·9 cites·20 claims
- 0693US10971507B2Three-dimensional memory device containing through-memory-level contact via structuresSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Apr 6, 2021·8 cites·5 claims
- 0791US7009233B2Semiconductor integrated circuit device including dummy patterns located to reduce dishingRENESAS TECH CORP·Filed 2003·Granted Mar 7, 2006·30 cites·69 claims
- 0888US8183091B2Semiconductor integrated circuit device and process for manufacturing the sameUCHIYAMA HIROYUKI·Filed 2010·Granted May 22, 2012·5 cites·28 claims
- 0987US11342286B2Semiconductor die including edge ring structures and methods for making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted May 24, 2022·3 cites·17 claims
- 1083US9515153B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Dec 6, 2016·3 cites·6 claims
- 1183US7112870B2Semiconductor integrated circuit device including dummy patterns located to reduce dishingRENESAS TECH CORP·Filed 2005·Granted Sep 26, 2006·4 cites·144 claims
- 1280US11289388B2Semiconductor die including edge ring structures and methods for making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Mar 29, 2022·2 cites·6 claims
- 1376US7154164B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Dec 26, 2006·2 cites·12 claims
- 1475US7327014B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Feb 5, 2008·2 cites·10 claims
- 1562US9059100B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Jun 16, 2015·0 cites·4 claims
- 1661US9275956B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Mar 1, 2016·0 cites·18 claims
- 1759US8569107B2Semiconductor integrated circuit device and process for manufacturing the sameUCHIYAMA HIROYUKI·Filed 2012·Granted Oct 29, 2013·0 cites·6 claims
- 1859US7696608B2Semiconductor integrated circuit device and process for manufacturing the sameHITACHI ULSI SYS CO LTD·Filed 2007·Granted Apr 13, 2010·0 cites·18 claims
- 1958US8558352B2Semiconductor integrated circuit device and process for manufacturing the sameUCHIYAMA HIROYUKI·Filed 2011·Granted Oct 15, 2013·0 cites·3 claims
- 2054US10043876B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Aug 7, 2018·0 cites·8 claims
- 2154US2018233568A1Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 2249US2007222043A1Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2007·Application pending·0 cites
- 2345US2010193958A1Semiconductor Device and a Method of Manufacturing the SameRENESAS TECH CORP·Filed 2010·Application pending·0 cites
- 2442US9349463B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted May 24, 2016·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →