Inventor · disambiguated record
Michitaka Kimura
Also filed as: KIMURA MICHITAKA
16 granted patents·3 pending applications·426 citations·filing 1996–2016
94Inventor score
Files withMITSUBISHI ELECTRIC CORP8RENESAS TECH CORP7RENESAS ELECTRONICS CORP2IWASAKI TOSHIHIRO1SUZUKI ZENZO1
Top patents by PatentIndex Score
19 records- 0196US6445594B1Semiconductor device having stacked semiconductor elementsMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 3, 2002·147 cites·20 claims
- 0288US6677677B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Jan 13, 2004·59 cites·12 claims
- 0385US6768516B2Semiconductor device constituting a CMOS camera systemRENESAS TECH CORP·Filed 2000·Granted Jul 27, 2004·42 cites·19 claims
- 0484US7443036B2Manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2005·Granted Oct 28, 2008·11 cites·10 claims
- 0582US6544814B1Method of manufacturing a packaged semiconductor device, and a semiconductor device manufactured therebyMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Apr 8, 2003·34 cites·12 claims
- 0677US8426303B2Manufacturing method of semiconductor device, and mounting structure thereofSUZUKI ZENZO·Filed 2011·Granted Apr 23, 2013·6 cites·10 claims
- 0777US6777814B2Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Aug 17, 2004·28 cites·9 claims
- 0876US10098179B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Oct 9, 2018·4 cites·23 claims
- 0975US6476502B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Nov 5, 2002·23 cites·20 claims
- 1068US6462425B1Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Oct 8, 2002·36 cites·14 claims
- 1163US7745258B2Manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2008·Granted Jun 29, 2010·2 cites·4 claims
- 1257US6756686B2Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Jun 29, 2004·8 cites·17 claims
- 1351US5659199AResin sealed semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Aug 19, 1997·17 cites·8 claims
- 1445US10037966B2Semiconductor device and manufacturing method thereforRENESAS ELECTRONICS CORP·Filed 2016·Granted Jul 31, 2018·0 cites·6 claims
- 1544US6856028B1Semiconductor device having an improved mounting structureRENESAS TECH CORP·Filed 2000·Granted Feb 15, 2005·1 cites·4 claims
- 1641US2005082663A1Semiconductor device and semiconductor moduleRENESAS TECH CORP·Filed 2004·Application pending·0 cites
- 1741US2012098126A1Semiconductor device and manufacturing method thereforIWASAKI TOSHIHIRO·Filed 2011·Application pending·0 cites
- 1839US5637917ALead frame assembly for a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Jun 10, 1997·8 cites·11 claims
- 1935US2003057569A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →