Inventor · disambiguated record
Michael Knabl
Also filed as: KNABL MICHAEL
8 granted patents·1 pending application·12 citations·filing 2012–2022
78Inventor score
Files withINFINEON TECHNOLOGIES AG5INFINEON TECHNOLOGIES AUSTRIA AG2INFINEON TECHNOLOGIES AUSTRIA1VON KOBLINSKI CARSTEN1
Top patents by PatentIndex Score
9 records- 0189US11211459B2Semiconductor device and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted Dec 28, 2021·5 cites·14 claims
- 0275US8841768B2Chip package and a method for manufacturing a chip packageVON KOBLINSKI CARSTEN·Filed 2012·Granted Sep 23, 2014·5 cites·26 claims
- 0370US10580753B2Method for manufacturing semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 3, 2020·2 cites·16 claims
- 0465US11990520B2Method of manufacturing a semiconductor device having frame structures laterally surrounding backside metal structuresINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 21, 2024·0 cites·21 claims
- 0565US2022359428A1Method for Processing a Semiconductor Wafer and Semiconductor Composite StructureINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 0659US11515264B2Method for processing a semiconductor wafer, semiconductor composite structure and support structure for semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2019·Granted Nov 29, 2022·0 cites·15 claims
- 0752US9318446B2Metal deposition on substratesINFINEON TECHNOLOGIES AUSTRIA·Filed 2014·Granted Apr 19, 2016·0 cites·19 claims
- 0849US9698106B2Metal deposition on substratesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Jul 4, 2017·0 cites·12 claims
- 0945US11610817B2Method of processing a semiconductor wafer, semiconductor wafer, and semiconductor die produced from a semiconductor waferINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Mar 21, 2023·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →