Inventor · disambiguated record
Mitsuaki Komino
Also filed as: KOMINO MITSUAKI
24 granted patents·6 pending applications·5,058 citations·filing 1993–2020
98Inventor score
Top patents by PatentIndex Score
30 records- 0198US6156151APlasma processing apparatusTOKYO ELECTRON LTD·Filed 1997·Granted Dec 5, 2000·498 cites·20 claims
- 0298US6134807ADrying processing method and apparatus using sameTOKYO ELECTRON LTD·Filed 1998·Granted Oct 24, 2000·557 cites·10 claims
- 0398US5769952AReduced pressure and normal pressure treatment apparatusTOKYO ELECTRON LTD·Filed 1997·Granted Jun 23, 1998·545 cites·5 claims
- 0498US5478429APlasma process apparatusTOKYO ELECTRON LTD·Filed 1994·Granted Dec 26, 1995·473 cites·17 claims
- 0597US6544380B2Plasma treatment method and apparatusTOKYO ELECTRON LTD·Filed 2002·Granted Apr 8, 2003·104 cites·3 claims
- 0697US5665166APlasma processing apparatusTOKYO ELECTRON LTD·Filed 1996·Granted Sep 9, 1997·190 cites·36 claims
- 0797US5382311AStage having electrostatic chuck and plasma processing apparatus using sameTOKYO ELECTRON LTD·Filed 1993·Granted Jan 17, 1995·1k cites·20 claims
- 0896US7033444B1Plasma processing apparatus, and electrode structure and table structure of processing apparatusTOKYO ELECTRON LTD·Filed 2000·Granted Apr 25, 2006·129 cites·20 claims
- 0995US5575853AVacuum exhaust system for processing apparatusTOKYO ELECTRON LTD·Filed 1995·Granted Nov 19, 1996·210 cites·8 claims
- 1094US5567267AMethod of controlling temperature of susceptorTOKYO ELECTRON LTD·Filed 1993·Granted Oct 22, 1996·261 cites·13 claims
- 1193US7337745B1Electrode, susceptor, plasma processing apparatus and method of making the electrode and the susceptorTOKYO ELECTRON LTD·Filed 2000·Granted Mar 4, 2008·83 cites·7 claims
- 1293US6634845B1Transfer module and cluster system for semiconductor manufacturing processTOKYO ELECTRON LTD·Filed 2000·Granted Oct 21, 2003·71 cites·20 claims
- 1392US5625526AElectrostatic chuckTOKYO ELECTRON LTD·Filed 1994·Granted Apr 29, 1997·193 cites·9 claims
- 1492US5584971ATreatment apparatus control methodTOKYO ELECTRON LTD·Filed 1994·Granted Dec 17, 1996·127 cites·20 claims
- 1591US6431115B2Plasma treatment method and apparatusTOKYO ELECTRON LTD·Filed 2001·Granted Aug 13, 2002·27 cites·24 claims
- 1691US5376213APlasma processing apparatusTOKYO ELECTRON LTD·Filed 1993·Granted Dec 27, 1994·181 cites·21 claims
- 1789US5581874AMethod of forming a bonding portionTOKYO ELECTRON LTD·Filed 1995·Granted Dec 10, 1996·99 cites·26 claims
- 1888US6106737APlasma treatment method utilizing an amplitude-modulated high frequency powerTOKYO ELECTRON LTD·Filed 1998·Granted Aug 22, 2000·66 cites·4 claims
- 1983US6379756B2Plasma treatment method and apparatusTOKYO ELECTRON LTD·Filed 2001·Granted Apr 30, 2002·15 cites·3 claims
- 2083US5753891ATreatment apparatusTOKYO ELECTRON LTD·Filed 1995·Granted May 19, 1998·74 cites·7 claims
- 2176US5660740ATreatment apparatus control methodTOKYO ELECTRON LTD·Filed 1996·Granted Aug 26, 1997·42 cites·12 claims
- 2273US6131307AMethod and device for controlling pressure and flow rateTOKYO ELECTRON LTD·Filed 1998·Granted Oct 17, 2000·23 cites·16 claims
- 2370US6157774AVapor generating method and apparatus using sameTOKYO ELECTRON LTD·Filed 1998·Granted Dec 5, 2000·36 cites·12 claims
- 2459US6167323AMethod and system for controlling gas systemTOKYO ELECTRON LTD·Filed 1998·Granted Dec 26, 2000·23 cites·23 claims
- 2559US2010000469A1Deposition apparatus for organic el and evaporating apparatusTOKYO ELECTRON LTD·Filed 2009·Application pending·0 cites
- 2650US2009179385A1Magnetic fluid seal deviceEAGLE IND CO LTD·Filed 2007·Application pending·0 cites
- 2745US2010200566A1Heating apparatusEAGLE IND CO LTD·Filed 2007·Application pending·0 cites
- 2841US2021156031A1Apparatus for processing a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 2940US2007034159A1Semiconductor manufacturing device and its heating unitKOMINO MITSUAKI·Filed 2004·Application pending·0 cites
- 3037US2001054484A1Plasma processor, cluster tool, and method of controlling plasmaFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →