Inventor · disambiguated record
Ming-Hong Kuo
Also filed as: KUO MING H · KUO MING-HONG
22 granted patents·12 pending applications·339 citations·filing 1987–2025
95Inventor score
Files withVANGUARD INT SEMICONDUCT CORP10KUO MING-HONG6ETRON TECH INC5INVENT AND COLLABORATION LABORATORY PTE LTD4ETRON TECHNOLOGY INC3
Top patents by PatentIndex Score
34 records- 0180US8724362B2Transistor circuit layout structureETRON TECHNOLOGY INC·Filed 2012·Granted May 13, 2014·5 cites·20 claims
- 0278US6008085ADesign and a novel process for formation of DRAM bit line and capacitor node contactsVANGUARD INT SEMICONDUCT CORP·Filed 1998·Granted Dec 28, 1999·39 cites·23 claims
- 0376US6184081B1Method of fabricating a capacitor under bit line DRAM structure using contact hole linersVANGUARD INT SEMICONDUCT CORP·Filed 1999·Granted Feb 6, 2001·57 cites·26 claims
- 0473US6057210AMethod of making a shallow trench isolation for ULSI formation via in-direct CMP processVANGUARD INT SEMICONDUCT CORP·Filed 1998·Granted May 2, 2000·46 cites·20 claims
- 0569US5658822ALocos method with double polysilicon/silicon nitride spacerVANGUARD INT SEMICONDUCT CORP·Filed 1996·Granted Aug 19, 1997·37 cites·19 claims
- 0669US2023027913A1Method for forming transistor structureINVENT AND COLLABORATION LABORATORY PTE LTD·Filed 2022·Application pending·0 cites
- 0764US6133599ADesign and a novel process for formation of DRAM bit line and capacitor node contactsVANGUARD INT SEMICONDUCT CORP·Filed 1999·Granted Oct 17, 2000·25 cites·4 claims
- 0863US6261923B1Method to solve the dishing issue in CMP planarization by using a nitride hard mask for local inverse etchback and CMPVANGUARD INT SEMICONDUCT CORP·Filed 1999·Granted Jul 17, 2001·30 cites·21 claims
- 0962US6171929B1Shallow trench isolator via non-critical chemical mechanical polishingVANGUARD INT SEMICONDUCT CORP·Filed 1999·Granted Jan 9, 2001·30 cites·20 claims
- 1062US2025372553A13d ic structureETRON TECH INC·Filed 2025·Application pending·0 cites
- 1162US2025357397A13d ic structureETRON TECH INC·Filed 2025·Application pending·0 cites
- 1259US9105506B2Dynamic memory structureLU NICKY·Filed 2012·Granted Aug 11, 2015·1 cites·18 claims
- 1358US9935109B2Dynamic memory structureETRON TECH INC·Filed 2017·Granted Apr 3, 2018·0 cites·9 claims
- 1456US2025226316A1Dram cell structure and method for manufacturing the sameETRON TECH INC·Filed 2024·Application pending·0 cites
- 1555US9685449B2Dynamic memory structureETRON TECH INC·Filed 2016·Granted Jun 20, 2017·0 cites·10 claims
- 1655US9397103B2Dynamic memory structureETRON TECHNOLOGY INC·Filed 2015·Granted Jul 19, 2016·0 cites·14 claims
- 1755US6017813AMethod for fabricating a damascene landing padVANGUARD INT SEMICONDUCT CORP·Filed 1998·Granted Jan 25, 2000·23 cites·11 claims
- 1853US5643824AMethod of forming nitride sidewalls having spacer feet in a locos processVANGUARD INT SEMICONDUCT CORP·Filed 1996·Granted Jul 1, 1997·20 cites·34 claims
- 1952US12125910B2Transistor structure with increased gate dielectric thickness between gate-to-drain overlap regionINVENT AND COLLABORATION LABORATORY PTE LTD·Filed 2022·Granted Oct 22, 2024·0 cites·5 claims
- 2050US10479676B2Apparatus and methods for integrated MEMS devicesMCUBE INC·Filed 2018·Granted Nov 19, 2019·0 cites·10 claims
- 2150US2024032281A1Memory cell structureINVENT AND COLLABORATION LABORATORY PTE LTD·Filed 2023·Application pending·0 cites
- 2249US8331178B2Memory device capable of operation in a burn in stress mode, method for performing burn in stress on a memory device, and method for detecting leakage current of a memory deviceLIU SHI-HUEI·Filed 2011·Granted Dec 11, 2012·2 cites·18 claims
- 2349US2023402457A1Transistor structure and method for fabricating the sameINVENT AND COLLABORATION LABORATORY PTE LTD·Filed 2023·Application pending·0 cites
- 2447US8659068B2Dynamic memory structureETRON TECHNOLOGY INC·Filed 2012·Granted Feb 25, 2014·0 cites·20 claims
- 2546US10046966B2Apparatus and methods for integrated MEMS devicesMCUBE INC·Filed 2017·Granted Aug 14, 2018·0 cites·10 claims
- 2646US2014197027A1Electroplating aid board and electroplating device using sameKUO MING-HONG·Filed 2013·Application pending·0 cites
- 2741US2014021017A1Transmission mechanism of vertical circuit board etching deviceKUO MING-HONG·Filed 2013·Application pending·0 cites
- 2839US5092266ASolder levelerKUO MING HONG·Filed 1990·Granted Mar 3, 1992·12 cites·1 claims
- 2939US2008202800A1Re-routing method and the circuit thereofKUO MING-HONG·Filed 2008·Application pending·0 cites
- 3037US2005006205A1Transporting device for a vertical-type thin circuit board etching machineFiled 2003·Application pending·0 cites
- 3136US6060348AMethod to fabricate isolation by combining locos and shallow trench isolation for ULSI technologyVANGUARD INT SEMICONDUCT CORP·Filed 1998·Granted May 9, 2000·6 cites·20 claims
- 3235US2006284635A1Re-routing method and the circuit thereofKUO MING-HONG·Filed 2006·Application pending·0 cites
- 3331US2012254470A1Connector applied to a portable device and method of connecting a portable device with an external deviceKUO MING-HONG·Filed 2012·Application pending·0 cites
- 3429US4775090APin head assemblyKUO MING H·Filed 1987·Granted Oct 4, 1988·6 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →