Electroplating aid board and electroplating device using same

Abstract

An electroplating device includes a plating solution, at least one anode basket located in the plating solution, and a workpiece to be plated. An electroplating aid board is arranged between the anode basket and the workpiece to be plated. The electroplating aid board has at least one side that has a length exceeding the workpiece to be plated. The electroplating aid board is made of a plastic material that is not electrically conductive and includes a plurality of holes formed therein. In an electroplating operation, the holes provide an effect of tunnel that guides positive ions (such as copper ions) of the plating solution to flow from the anode basket (namely anode) straightforward to the nearest surface portion of the workpiece to be plated.

I claim: 
     
         1 . An electroplating aid board, which is adapted to be used in electroplating facility, is made of a plastic material that is not electrically conductive, and comprises a plurality of holes formed therein, the holes guiding positive ions contained in a plating solution. 
     
     
         2 . The electroplating aid board according to  claim 1 , wherein the holes are arranged in rows and the holes are set to alternate each other. 
     
     
         3 . An electroplating device, comprising:
 a plating solution;   at least one anode basket, which is located in the plating solution and is connected to an anode of a power supply; and   a workpiece to be plated, which is placed in the plating solution and is connected to a cathode of the power supply; and   characterized in that an electroplating aid board is arranged between the anode basket and the workpiece to be plated, the electroplating aid board having at least one side that has a length exceeding the workpiece to be plated, the electroplating aid board being made of a plastic material that is not electrically conductive and comprising a plurality of holes formed therein.   
     
     
         4 . The electroplating device according to  claim 3 , wherein the holes are arranged in rows and the holes are set to alternate each other. 
     
     
         5 . The electroplating device according to  claim 3 , wherein the electroplating aid board is secured to a fastener provided on a spray tube.