Inventor · disambiguated record
Michael A. Lamson
Also filed as: LAMSON MICHAEL A · LAMSON MICHAEL ANTHONY
29 granted patents·3 pending applications·1,021 citations·filing 1991–2012
97Inventor score
Top patents by PatentIndex Score
32 records- 0197US5083187AIntegrated circuit device having bumped power supply buses over active surface areas and method of manufacture thereofTEXAS INSTRUMENTS INC·Filed 1991·Granted Jan 21, 1992·308 cites·7 claims
- 0290US5233220ABalanced capacitance lead frame for integrated circuits and integrated circuit device with separate conductive layerTEXAS INSTRUMENTS INC·Filed 1992·Granted Aug 3, 1993·113 cites·25 claims
- 0388US9030216B2Coaxial four-point probe for low resistance measurementsLAMSON MICHAEL ANTHONY·Filed 2012·Granted May 12, 2015·9 cites·10 claims
- 0487US6084777ABall grid array packageTEXAS INSTRUMENTS INC·Filed 1998·Granted Jul 4, 2000·99 cites·14 claims
- 0583US5442233APackaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipationHITACHI LTD·Filed 1992·Granted Aug 15, 1995·55 cites·28 claims
- 0679US7132845B1FA tool using conductor modelTEXAS INSTRUMENTS INC·Filed 2005·Granted Nov 7, 2006·14 cites·5 claims
- 0779US6518663B1Constant impedance routing for high performance integrated circuit packagingTEXAS INSTRUMENTS INC·Filed 2000·Granted Feb 11, 2003·31 cites·7 claims
- 0877US6822340B2Low capacitance coupling wire bonded semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2001·Granted Nov 23, 2004·22 cites·12 claims
- 0977US6064576AInterposer having a cantilevered ball connection and being electrically connected to a printed circuit boardTEXAS INSTRUMENTS INC·Filed 1997·Granted May 16, 2000·51 cites·16 claims
- 1077US5432127AMethod for making a balanced capacitance lead frame for integrated circuits having a power bus and dummy leadsTEXAS INSTRUMENTS INC·Filed 1993·Granted Jul 11, 1995·48 cites·9 claims
- 1176US6323116B1Differential pair geometry for integrated circuit chip packagesTEXAS INSTRUMENTS INC·Filed 2000·Granted Nov 27, 2001·20 cites·11 claims
- 1275US6424027B1Low pass filter integral with semiconductor packageTEXAS INSTRUMENTS INC·Filed 2000·Granted Jul 23, 2002·32 cites·8 claims
- 1373US6820046B1System for electrically modeling an electronic structure and method of operationTEXAS INSTRUMENTS INC·Filed 2000·Granted Nov 16, 2004·32 cites·28 claims
- 1473US6054758ADifferential pair geometry for integrated circuit chip packagesTEXAS INSTRUMENTS INC·Filed 1997·Granted Apr 25, 2000·37 cites·8 claims
- 1572US5585665APackaged semiconductor device and a leadframe thereforHITACHI LTD·Filed 1995·Granted Dec 17, 1996·31 cites·9 claims
- 1666US6794743B1Structure and method of high performance two layer ball grid array substrateTEXAS INSTRUMENTS INC·Filed 2000·Granted Sep 21, 2004·10 cites·27 claims
- 1765US5994169ALead frame for integrated circuits and process of packagingTEXAS INSTRUMENTS INC·Filed 1998·Granted Nov 30, 1999·32 cites·5 claims
- 1864US5160893AMethod of measuring semiconductor lead inductance by changing the dielectric constant surrounding the leadTEXAS INSTRUMENTS INC·Filed 1991·Granted Nov 3, 1992·23 cites·7 claims
- 1962US7265443B2Wire bonded semiconductor device having low inductance and noiseTEXAS INSTRUMENTS INC·Filed 2005·Granted Sep 4, 2007·2 cites·13 claims
- 2062US7195954B2Low capacitance coupling wire bonded semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2004·Granted Mar 27, 2007·9 cites·13 claims
- 2156US6563208B2Semiconductor package with conductor impedance selected during assemblyTEXAS INSTRUMENTS INC·Filed 2000·Granted May 13, 2003·7 cites·13 claims
- 2254US7132740B2Semiconductor package with conductor impedance selected during assemblyTEXAS INSTRUMENTS INC·Filed 2003·Granted Nov 7, 2006·6 cites·16 claims
- 2353US7795072B2Structure and method of high performance two layer ball grid array substrateTEXAS INSTRUMENTS INC·Filed 2008·Granted Sep 14, 2010·0 cites·6 claims
- 2452US5840599AProcess of packaging an integrated circuit with a conductive material between a lead frame and the face of the circuitTEXAS INSTRUMENTS INC·Filed 1994·Granted Nov 24, 1998·17 cites·10 claims
- 2548US6995037B2Structure and method of high performance two layer ball grid array substrateTEXAS INSTRUMENTS INC·Filed 2003·Granted Feb 7, 2006·2 cites·6 claims
- 2648US2006063304A1Structure and method of high performance two layer ball grid array substrateLAMSON MICHAEL A·Filed 2005·Application pending·0 cites
- 2744US8174276B2Coaxial four-point probe for low resistance measurementsLAMSON MICHAEL ANTHONY·Filed 2009·Granted May 8, 2012·0 cites·6 claims
- 2840US6030859AMethod of making a packaged semiconductor device and a lead-frame thereforHITACHI LTD·Filed 1997·Granted Feb 29, 2000·6 cites·27 claims
- 2939US2008157385A1IC package with integral vertical passive delay cellsYUE HEPING·Filed 2006·Application pending·0 cites
- 3038US2005133901A1System and method for delivering power to a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2003·Application pending·0 cites
- 3132US5648299APackaged semiconductor device and a leadframe thereforHITACHI LTD·Filed 1996·Granted Jul 15, 1997·1 cites·11 claims
- 3232US5334802AMethod and configuration for reducing electrical noise in integrated circuit devicesTEXAS INSTRUMENTS INC·Filed 1993·Granted Aug 2, 1994·4 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →