Inventor · disambiguated record
Ming-Tan Lee
Also filed as: LEE MING-TAN
25 granted patents·13 pending applications·19 citations·filing 2014–2025
92Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD38
Top patents by PatentIndex Score
38 records- 0196US11841618B2Photoresist system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 12, 2023·2 cites·20 claims
- 0291US10859922B1Lithography system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·4 cites·20 claims
- 0390US10861710B2Methods of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·5 cites·20 claims
- 0489US2025349639A1Packages with enlarged through-vias in encapsulantTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0588US11215929B2Photoresist system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 4, 2022·3 cites·20 claims
- 0687US2025306466A1Photoresist system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0785US12353134B2Photoresist system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 0885US11587818B2Chuck design and method for waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 21, 2023·3 cites·20 claims
- 0982US12431400B2Packages with enlarged through-vias in encapsulantTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 30, 2025·0 cites·20 claims
- 1079US2024395595A1Chuck Design and Method for WaferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1179US2024387193A1Semiconductor devices with external connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1277US11823969B2Packages with enlarged through-vias in encapsulantTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 1376US2025123572A1Machine learning on overlay managementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1475US12148651B2Chuck design and method for waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 1575US12032295B2Optical lithography system and method of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 9, 2024·0 cites·20 claims
- 1675US11842896B2Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 12, 2023·0 cites·20 claims
- 1775US2024319609A1Optical Lithography System and Method of Using the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1873US2024079235A1Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1971US2024393685A1Semiconductor device and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2069US11515224B2Packages with enlarged through-vias in encapsulantTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 2169US11037877B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 15, 2021·1 cites·20 claims
- 2268US11960211B2Optical lithography system and method of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·0 cites·14 claims
- 2368US10867793B2Semiconductor package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·1 cites·20 claims
- 2466US11670541B2Methods of manufacturing semiconductor device using phase shift maskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
- 2565US12197138B2Machine learning on overlay managementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 14, 2025·0 cites·20 claims
- 2664US2021118697A1Methods of Manufacturing Semiconductor DevicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Application pending·0 cites
- 2761US11977333B2Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 7, 2024·0 cites·20 claims
- 2858US2025349734A1Pick-and-place alignment marks for semiconductor package structures and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2958US2023064162A1Semiconductor Device and Methods of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 3057US11189521B2Methods of manufacturing redistribution circuit structures using phase shift maskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 30, 2021·0 cites·20 claims
- 3155US2025079228A1Wafer chuck including self-sealing vacuum seal assemblies and methods for operating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3252US2024071887A1Semicondcutor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3349US11145560B2Semiconductor device and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 12, 2021·0 cites·20 claims
- 3447US11127688B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 21, 2021·0 cites·20 claims
- 3544US11143965B2Optical lithography system for patterning semiconductor devices and method of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 12, 2021·0 cites·20 claims
- 3642US11158600B2Lithography process for semiconductor packaging and structures resulting therefromTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 26, 2021·0 cites·18 claims
- 3741US10879166B2Package structure having redistribution structure with photosensitive and non-photosensitive dielectric materials and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 29, 2020·0 cites·20 claims
- 3840US10312118B2Bonding apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 4, 2019·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →