Inventor · disambiguated record
Michael Len
Also filed as: LEN MICHAEL · LEN MICHAEL J
10 granted patents·4 pending applications·44 citations·filing 1999–2022
84Inventor score
Top patents by PatentIndex Score
14 records- 0186US8969733B1High power RF circuitANAREN INC·Filed 2013·Granted Mar 3, 2015·10 cites·42 claims
- 0283US12176592B2High powered RF part for improved manufacturabilityTTM TECH INC·Filed 2021·Granted Dec 24, 2024·1 cites·21 claims
- 0381US11158920B2High powered RF part for improved manufacturabilityTTM TECH INC·Filed 2017·Granted Oct 26, 2021·3 cites·21 claims
- 0473US6464510B1Microwave circuit connectorANAREN MICROWAVE INC·Filed 1999·Granted Oct 15, 2002·24 cites·16 claims
- 0571US9350062B2Stress relieved high power RF circuitANAREN INC·Filed 2014·Granted May 24, 2016·4 cites·38 claims
- 0670US9064622B2RF resistor with lossy tracesANAREN INC·Filed 2013·Granted Jun 23, 2015·2 cites·20 claims
- 0765US2021227695A1Methods for fabricating printed circuit board assemblies with high density via arrayTTM TECH INC·Filed 2021·Application pending·0 cites
- 0860US10980127B2Methods for fabricating printed circuit board assemblies with high density via arrayTTM TECH INC·Filed 2019·Granted Apr 13, 2021·0 cites·24 claims
- 0953US12418085B2Circulator design and methods of fabricating the circulatorTTM TECH INC·Filed 2022·Granted Sep 16, 2025·0 cites·21 claims
- 1049US2023082429A1Forming waveguides and heat transfer elements in printed circuit boardsTTM TECH INC·Filed 2022·Application pending·0 cites
- 1148US2022247058A1High powered rf part for improved manufacturabilityTTM TECH INC·Filed 2022·Application pending·0 cites
- 1245US11729933B2Near-hermetic package with flexible signal input and outputTTM TECH NORTH AMERICA LLC·Filed 2022·Granted Aug 15, 2023·0 cites·18 claims
- 1339US12262464B2Methods for forming engineered thermal paths of printed circuit boards by use of removable layersTTM TECH INC·Filed 2021·Granted Mar 25, 2025·0 cites·17 claims
- 1434US2019029122A1Encapsulation of circuit traceANAREN INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →