Inventor · disambiguated record
Mirng-Ji Lii
Also filed as: LII MIRNG-JI
220 granted patents·35 pending applications·3,220 citations·filing 1997–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD149TAIWAN SEMICONDUCTOR MFG54YU CHEN-HUA11INTEL CORP6LII MIRNG-JI3
Top patents by PatentIndex Score
255 records- 0199US9368460B2Fan-out interconnect structure and method for forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 14, 2016·1k cites·20 claims
- 0299US9275925B2System and method for an improved interconnect structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 1, 2016·64 cites·20 claims
- 0399US7361990B2Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump padsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Apr 22, 2008·134 cites·15 claims
- 0498US9653442B2Integrated circuit package and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 16, 2017·40 cites·20 claims
- 0598US9263839B2System and method for an improved fine pitch jointTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·69 cites·17 claims
- 0698US8912651B2Package-on-package (PoP) structure including stud bulbs and methodYU CHEN-HUA·Filed 2012·Granted Dec 16, 2014·41 cites·16 claims
- 0798US8759964B2Wafer level package structure and fabrication methodsPU HAN-PING·Filed 2007·Granted Jun 24, 2014·584 cites·18 claims
- 0897US9343433B2Packages with stacked dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 17, 2016·31 cites·20 claims
- 0997US9171790B2Package on package devices and methods of packaging semiconductor diesYU CHEN-HUA·Filed 2012·Granted Oct 27, 2015·40 cites·19 claims
- 1097US8884431B2Packaging methods and structures for semiconductor devicesLIN CHIH-WEI·Filed 2011·Granted Nov 11, 2014·35 cites·20 claims
- 1197US8642393B1Package on package devices and methods of forming sameYU CHEN-HUA·Filed 2012·Granted Feb 4, 2014·48 cites·19 claims
- 1297US8476770B2Apparatus and methods for forming through viasSHAO TUNG-LIANG·Filed 2011·Granted Jul 2, 2013·58 cites·14 claims
- 1396US11854835B2Heterogeneous bonding structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 1496US11532692B2Process for tuning via profile in dielectric materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·4 cites·20 claims
- 1596US9768090B2Substrate design for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 19, 2017·24 cites·17 claims
- 1696US9640521B2Multi-die package with bridge layer and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 2, 2017·15 cites·20 claims
- 1796US9425136B2Conical-shaped or tier-shaped pillar connectionsKUO TIN-HAO·Filed 2012·Granted Aug 23, 2016·24 cites·17 claims
- 1896US8039315B2Thermally enhanced wafer level packageTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Oct 18, 2011·29 cites·19 claims
- 1995US11101233B1Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 24, 2021·4 cites·20 claims
- 2095US10026671B2Substrate design for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 17, 2018·27 cites·20 claims
- 2195US8823180B2Package on package devices and methods of packaging semiconductor diesWANG TSUNG-DING·Filed 2012·Granted Sep 2, 2014·30 cites·18 claims
- 2295US8735273B2Forming wafer-level chip scale package structures with reduced number of seed layersLU WEN-HSIUNG·Filed 2011·Granted May 27, 2014·25 cites·20 claims
- 2395US8581400B2Post-passivation interconnect structureLIANG SHIH-WEI·Filed 2011·Granted Nov 12, 2013·22 cites·20 claims
- 2495US7265034B2Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw bladeTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 4, 2007·33 cites·20 claims
- 2594US9449941B2Connecting function chips to a package to form package-on-packageTSAI PEI-CHUN·Filed 2011·Granted Sep 20, 2016·44 cites·19 claims
- 2693US10319607B2Package-on-package structure with organic interposerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 11, 2019·16 cites·20 claims
- 2793US9984999B2Packages with stacked dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·6 cites·20 claims
- 2893US9653443B2Thermal performance structure for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 16, 2017·13 cites·19 claims
- 2993US9646923B2Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted May 9, 2017·12 cites·20 claims
- 3093US9305877B13D package with through substrate viasTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 5, 2016·14 cites·20 claims
- 3192US12027435B2Packages including multiple encapsulated substrate blocks and overlapping redistribution structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·1 cites·20 claims
- 3292US10049894B2Package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·7 cites·20 claims
- 3392US9123763B2Package-on-package (PoP) structure having at least one package comprising one die being disposed in a core material between first and second surfaces of the core materialYU CHEN-HUA·Filed 2011·Granted Sep 1, 2015·13 cites·13 claims
- 3492US7842548B2Fixture for P-through silicon via assemblyTAIWAN SEMCONDUCTOR MFG CO LTD·Filed 2008·Granted Nov 30, 2010·29 cites·9 claims
- 3591US9219030B2Package on package structures and methods for forming the sameYU CHEN-HUA·Filed 2012·Granted Dec 22, 2015·9 cites·16 claims
- 3690US11239305B2Display device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 1, 2022·2 cites·20 claims
- 3790US11222859B2Semiconductor device structure with bonding pad and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 11, 2022·3 cites·20 claims
- 3890US11069573B2Wafer level package structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 20, 2021·5 cites·20 claims
- 3990US10056345B2Conical-shaped or tier-shaped pillar connectionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 21, 2018·5 cites·20 claims
- 4090US9337135B2Pop joint through interposerTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 10, 2016·10 cites·20 claims
- 4190US9013038B2Semiconductor device with post-passivation interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 21, 2015·9 cites·18 claims
- 4290US8618827B2Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor deviceSHAO TUNG-LIANG·Filed 2010·Granted Dec 31, 2013·12 cites·20 claims
- 4390US7656042B2Stratified underfill in an IC packageTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Feb 2, 2010·17 cites·22 claims
- 4489US11075173B2Semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 27, 2021·5 cites·20 claims
- 4589US9812427B2Package on-package (PoP) structure including stud bulbsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 7, 2017·4 cites·20 claims
- 4688US10276525B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·5 cites·19 claims
- 4788US10056267B2Substrate design for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 21, 2018·7 cites·20 claims
- 4888US9870946B2Wafer level package structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 16, 2018·7 cites·20 claims
- 4988US9768105B2Rigid interconnect structures in package-on-package assembliesLII MIRNG-JI·Filed 2012·Granted Sep 19, 2017·12 cites·20 claims
- 5088US6191475B1Substrate for reducing electromagnetic interference and enclosureINTEL CORP·Filed 1997·Granted Feb 20, 2001·114 cites·23 claims
Showing the top 50 of 255 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →