Inventor · disambiguated record
Ming-Hsien Lin
Also filed as: LIN MING · LIN MING-HSIEN
64 granted patents·44 pending applications·299 citations·filing 1992–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD64LIN MING-HSIEN23AGENCY SCIENCE TECH & RES2LEE CHENG-CHANG2YEOU GHI IND CO LTD2
Top patents by PatentIndex Score
108 records- 0198US10170322B1Atomic layer deposition based process for contact barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 1, 2019·49 cites·20 claims
- 0296US10963609B2Method for analyzing electromigration (EM) in integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 30, 2021·5 cites·20 claims
- 0393US9929087B2Enhancing integrated circuit density with active atomic reservoirTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 27, 2018·8 cites·20 claims
- 0493US7950108B2Castor that is braked and positioned simultaneouslySUNNY CASTORS CO LTD·Filed 2008·Granted May 31, 2011·31 cites·20 claims
- 0592US10157258B2Method for evaluating failure-in-timeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·6 cites·20 claims
- 0692US8516656B2Combination castor whose castor units are braked simultaneouslyLIN MING-HSIEN·Filed 2012·Granted Aug 27, 2013·17 cites·4 claims
- 0792US8418315B1Combination castor brake system whose castor assemblies are braked and positioned simultaneouslyLIN MING-HSIEN·Filed 2012·Granted Apr 16, 2013·18 cites·6 claims
- 0891US8484802B1Combination castor whose castor assemblies are braked and positioned simultaneouslyLIN MING-HSIEN·Filed 2012·Granted Jul 16, 2013·17 cites·7 claims
- 0990US11455448B2Method for analyzing electromigration (EM) in integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 27, 2022·2 cites·20 claims
- 1090US10790196B2Threshold voltage tuning for fin-based integrated circuit deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 29, 2020·4 cites·20 claims
- 1189US2025324729A1Threshold Voltage Tuning for Fin-Based Integrated Circuit DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1287US12071701B2Plating system and method of plating waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 27, 2024·0 cites·20 claims
- 1387US2024360584A1Plating system and method of plating waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1485US10679859B2Atomic layer deposition based process for contact barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 9, 2020·3 cites·20 claims
- 1585US2024360585A1Methods of electrochemical platingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1683US12071699B2Apparatus for electro-chemical platingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·20 claims
- 1783US9818694B2Active atomic reservoir for enhancing electromigration reliability in integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 14, 2017·4 cites·20 claims
- 1883US2025357091A1Apparatus and method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1981US12480204B2Physical vapor deposition apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 25, 2025·0 cites·20 claims
- 2081US11684741B2Breathing maskLIN MING HSIEN·Filed 2020·Granted Jun 27, 2023·1 cites·9 claims
- 2181US8189330B2Docking station for connecting to a notebook computerHUNG CHIN-CHUNG·Filed 2010·Granted May 29, 2012·11 cites·17 claims
- 2281US5370078AMethod and apparatus for crystal growth with shape and segregation controlWISCONSIN ALUMNI RES FOUND·Filed 1992·Granted Dec 6, 1994·36 cites·27 claims
- 2380US2025343148A1Integrated chip structure with high thermal conductivity layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2479US12437975B2Apparatus and method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 7, 2025·0 cites·20 claims
- 2579US12376367B2Threshold voltage tuning for fin-based integrated circuit deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 2679US2025349649A1Manufacturing method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2778US11634832B2Plating system and method of plating waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 25, 2023·0 cites·20 claims
- 2877US11427924B1Apparatus for electro-chemical platingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 30, 2022·0 cites·20 claims
- 2977US2024376592A1Physical vapor deposition (pvd) system and method of processing targetTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3076US7891039B2Cleaning apparatus with fast wringing abilityLIN MING-HSIEN·Filed 2007·Granted Feb 22, 2011·7 cites·10 claims
- 3175US11809803B2Method for evaluating failure-in-timeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·20 claims
- 3275US2024387316A1Semiconductor arrangement and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3375US2024290721A1Method for forming semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3475US2024376600A1Methods of substrate processing and methods of manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3574US12077850B2Physical vapor deposition apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 3674US11978703B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 3774US2024387364A1Semiconductor interconnection structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3874US2025357264A1Heat dissipation by nano pipesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3973US2025226278A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4073US2024363406A1Apparatuses and systems for electroplatingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4173US2025309041A1Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4273US2025140697A1Integrated chip structure with high thermal conductivity layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4373US2025062165A1Methods of manufacturing semiconductor device and sputtering chambersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4472US11908800B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 4571US11366951B2Method for evaluating failure-in-timeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 21, 2022·0 cites·20 claims
- 4671US7555804B2Cleaning head for sweeping and wringing apparatusLIN MING-HSIEN·Filed 2006·Granted Jul 7, 2009·4 cites·18 claims
- 4771US7185387B1Dismountable cleaning head for sweeping apparatusLIN MING-HSIEN·Filed 2006·Granted Mar 6, 2007·4 cites·7 claims
- 4870USD1038567STool cart creeperYEOU GHI IND CO LTD·Filed 2022·Granted Aug 6, 2024·6 cites·1 claims
- 4970US7555805B2Holding assembly for sweeping and wringing apparatusLIN MING-HSIEN·Filed 2006·Granted Jul 7, 2009·5 cites·7 claims
- 5070US2023386824A1Apparatus for electro-chemical platingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 108 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →