Inventor · disambiguated record
Michael B. Mcshane
Also filed as: MCSHANE MICHAEL B
56 granted patents·2 pending applications·6,217 citations·filing 1985–2015
99Inventor score
Top patents by PatentIndex Score
58 records- 0199US7777330B2High bandwidth cache-to-processing unit communication in a multiple processor/cache systemFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Aug 17, 2010·269 cites·20 claims
- 0299US5273938AMethod for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer filmMOTOROLA INC·Filed 1992·Granted Dec 28, 1993·420 cites·14 claims
- 0399US5239198AOvermolded semiconductor device having solder ball and edge lead connective structureMOTOROLA INC·Filed 1992·Granted Aug 24, 1993·482 cites·35 claims
- 0499US5216278ASemiconductor device having a pad array carrier packageMOTOROLA INC·Filed 1992·Granted Jun 1, 1993·844 cites·38 claims
- 0599US5041902AMolded electronic package with compression structuresMOTOROLA INC·Filed 1989·Granted Aug 20, 1991·387 cites·2 claims
- 0698US5468999ALiquid encapsulated ball grid array semiconductor device with fine pitch wire bondingMOTOROLA INC·Filed 1994·Granted Nov 21, 1995·357 cites·21 claims
- 0798US5450283AThermally enhanced semiconductor device having exposed backside and method for making the sameMOTOROLA INC·Filed 1994·Granted Sep 12, 1995·368 cites·20 claims
- 0898US5157480ASemiconductor device having dual electrical contact sitesMOTOROLA INC·Filed 1991·Granted Oct 20, 1992·427 cites·15 claims
- 0997US5247423AStacking three dimensional leadless multi-chip module and method for making the sameMOTOROLA INC·Filed 1992·Granted Sep 21, 1993·274 cites·12 claims
- 1097US5012386AHigh performance overmolded electronic packageMOTOROLA INC·Filed 1989·Granted Apr 30, 1991·213 cites·24 claims
- 1197US4661192ALow cost integrated circuit bonding processMOTOROLA INC·Filed 1985·Granted Apr 28, 1987·177 cites·5 claims
- 1295US5517056AMolded carrier ring leadframe having a particular resin injecting area design for gate removal and semiconductor device employing the sameMOTOROLA INC·Filed 1993·Granted May 14, 1996·239 cites·11 claims
- 1395US5200362AMethod of attaching conductive traces to an encapsulated semiconductor die using a removable transfer filmMOTOROLA INC·Filed 1991·Granted Apr 6, 1993·500 cites·8 claims
- 1494US9094135B2Die stack with optical TSVsFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Jul 28, 2015·19 cites·20 claims
- 1593US5105259AThermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipationMOTOROLA INC·Filed 1990·Granted Apr 14, 1992·172 cites·15 claims
- 1692US9435952B2Integration of a MEMS beam with optical waveguide and deflection in two dimensionsFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Sep 6, 2016·14 cites·15 claims
- 1792US9076664B2Stacked semiconductor die with continuous conductive viasPELLEY PERRY H·Filed 2011·Granted Jul 7, 2015·16 cites·17 claims
- 1892US8004080B2Edge mounted integrated circuits with heat sinkFREESCALE SMEICONDUCTOR INC·Filed 2009·Granted Aug 23, 2011·29 cites·18 claims
- 1990US5311057ALead-on-chip semiconductor device and method for making the sameMOTOROLA INC·Filed 1992·Granted May 10, 1994·119 cites·17 claims
- 2087US9810843B2Optical backplane mirrorFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Nov 7, 2017·8 cites·21 claims
- 2187US9261556B2Optical wafer and die probe testingFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Feb 16, 2016·7 cites·19 claims
- 2287US9091820B2Communication system die stackFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Jul 28, 2015·8 cites·20 claims
- 2387US5147821AMethod for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operationMOTOROLA INC·Filed 1991·Granted Sep 15, 1992·103 cites·17 claims
- 2487US5006922APackaged semiconductor device having a low cost ceramic PGA packageMOTOROLA INC·Filed 1990·Granted Apr 9, 1991·93 cites·22 claims
- 2582US5018005AThin, molded, surface mount electronic deviceMOTOROLA INC·Filed 1989·Granted May 21, 1991·57 cites·15 claims
- 2679US5045914APlastic pad array electronic AC deviceMOTOROLA INC·Filed 1991·Granted Sep 3, 1991·63 cites·17 claims
- 2778US5455200AMethod for making a lead-on-chip semiconductor device having peripheral bond padsMOTOROLA INC·Filed 1993·Granted Oct 3, 1995·56 cites·18 claims
- 2878US4837184AProcess of making an electronic device package with peripheral carrier structure of low-cost plasticMOTOROLA INC·Filed 1988·Granted Jun 6, 1989·54 cites·19 claims
- 2977US5053357AMethod of aligning and mounting an electronic device on a printed circuit board using a flexible substrate having fixed lead arrays thereonMOTOROLA INC·Filed 1990·Granted Oct 1, 1991·57 cites·6 claims
- 3076US9070653B2Microelectronic assembly having a heat spreader for a plurality of dieFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Jun 30, 2015·3 cites·20 claims
- 3176US5220195ASemiconductor device having a multilayer leadframe with full power and ground planesMOTOROLA INC·Filed 1991·Granted Jun 15, 1993·59 cites·15 claims
- 3274US10177052B2Defective die replacement in a die stackFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jan 8, 2019·3 cites·13 claims
- 3374US8980734B2Gate security featureFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Mar 17, 2015·3 cites·14 claims
- 3474US8501539B2Semiconductor device packageHESS KEVIN J·Filed 2009·Granted Aug 6, 2013·6 cites·20 claims
- 3573US5381036ALead-on chip semiconductor device having peripheral bond padsMOTOROLA INC·Filed 1993·Granted Jan 10, 1995·44 cites·17 claims
- 3672US8796855B2Semiconductor devices with nonconductive viasPELLEY PERRY H·Filed 2012·Granted Aug 5, 2014·3 cites·17 claims
- 3772US8680674B2Methods and structures for reducing heat exposure of thermally sensitive semiconductor devicesMCSHANE MICHAEL B·Filed 2012·Granted Mar 25, 2014·3 cites·20 claims
- 3872US5029325ATAB tape translator for use with semiconductor devicesMOTOROLA INC·Filed 1990·Granted Jul 2, 1991·47 cites·19 claims
- 3971US9766409B2Optical redundancyFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Sep 19, 2017·2 cites·16 claims
- 4068US5294827ASemiconductor device having thin package body and method for making the sameMOTOROLA INC·Filed 1992·Granted Mar 15, 1994·39 cites·14 claims
- 4167US9099475B2Techniques for reducing inductance in through-die vias of an electronic assemblyMCSHANE MICHAEL B·Filed 2012·Granted Aug 4, 2015·2 cites·19 claims
- 4267US9082757B2Stacked semiconductor devicesPELLEY PERRY H·Filed 2013·Granted Jul 14, 2015·2 cites·13 claims
- 4364US5344600AMethod for encapsulating semiconductor devices with package bodiesMOTOROLA INC·Filed 1992·Granted Sep 6, 1994·39 cites·2 claims
- 4464US5049526AMethod for fabricating semiconductor device including packageMOTOROLA INC·Filed 1989·Granted Sep 17, 1991·28 cites·7 claims
- 4564US4897602AElectronic device package with peripheral carrier structure of low-cost plasticMOTOROLA INC·Filed 1988·Granted Jan 30, 1990·34 cites·16 claims
- 4663US8796822B2Stacked semiconductor devicesPELLEY PERRY H·Filed 2011·Granted Aug 5, 2014·1 cites·16 claims
- 4763US5521428AFlagless semiconductor deviceMOTOROLA INC·Filed 1994·Granted May 28, 1996·36 cites·22 claims
- 4863US4924291AFlagless semiconductor packageMOTOROLA INC·Filed 1988·Granted May 8, 1990·27 cites·19 claims
- 4962US9318451B2Wirebond recess for stacked diePHAM TIM V·Filed 2013·Granted Apr 19, 2016·2 cites·19 claims
- 5061US9480161B2Thin low profile strip dual in-line memory moduleFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Oct 25, 2016·1 cites·20 claims
Showing the top 50 of 58 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Michael B. Mcshane files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →