Inventor · disambiguated record
Michitaka Mikami
Also filed as: MIKAMI MICHITAKA
1 granted patent·4 pending applications·0 citations·filing 2005–2011
11Inventor score
Top patents by PatentIndex Score
5 records- 0134US2008075626A1Wire Bump MaterialTANAKA ELECTRONICS IND·Filed 2005·Application pending·0 cites
- 0233US2011236697A1Aluminum for ultrasonic bondingTANAKA ELECTRONICS IND·Filed 2010·Application pending·0 cites
- 0331US2013164559A1Aluminum ribbon for ultrasonic bondingMIKAMI MICHITAKA·Filed 2010·Application pending·0 cites
- 0427US8440137B2Au bonding wire for semiconductor deviceTESHIMA SATOSHI·Filed 2005·Granted May 14, 2013·0 cites·7 claims
- 0513US2012312428A1High strength and high elongation ratio of au alloy bonding wireMIKAMI MICHITAKA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →