Inventor · disambiguated record
Minh Van Ngo
Also filed as: NGO MINH V · NGO MINH VAN
301 granted patents·11 pending applications·7,158 citations·filing 1995–2022
99Inventor score
Files withADVANCED MICRO DEVICES INC252SPANSION LLC23CYPRESS SEMICONDUCTOR CORP4FASL LLC3LITTELFUSE INC3
Top patents by PatentIndex Score
312 records- 0199US6573172B1Methods for improving carrier mobility of PMOS and NMOS devicesADVANCED MICRO DEVICES INC·Filed 2002·Granted Jun 3, 2003·395 cites·30 claims
- 0297US6645882B1Preparation of composite high-K/standard-K dielectrics for semiconductor devicesADVANCED MICRO DEVICES INC·Filed 2002·Granted Nov 11, 2003·122 cites·20 claims
- 0396US6787864B2Mosfets incorporating nickel germanosilicided gate and methods for their formationADVANCED MICRO DEVICES INC·Filed 2002·Granted Sep 7, 2004·126 cites·21 claims
- 0496US6528884B1Conformal atomic liner layer in an integrated circuit interconnectADVANCED MICRO DEVICES INC·Filed 2001·Granted Mar 4, 2003·90 cites·9 claims
- 0595US6562718B1Process for forming fully silicided gatesADVANCED MICRO DEVICES INC·Filed 2000·Granted May 13, 2003·107 cites·18 claims
- 0695US6451647B1Integrated plasma etch of gate and gate dielectric and low power plasma post gate etch removal of high-K residualADVANCED MICRO DEVICES INC·Filed 2002·Granted Sep 17, 2002·92 cites·18 claims
- 0794US6746971B1Method of forming copper sulfide for memory cellADVANCED MICRO DEVICES INC·Filed 2002·Granted Jun 8, 2004·120 cites·20 claims
- 0894US6706576B1Laser thermal annealing of silicon nitride for increased density and etch selectivityADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 16, 2004·79 cites·20 claims
- 0994US6670241B1Semiconductor memory with deuterated materialsADVANCED MICRO DEVICES INC·Filed 2002·Granted Dec 30, 2003·79 cites·8 claims
- 1094US6566283B1Silane treatment of low dielectric constant materials in semiconductor device manufacturingADVANCED MICRO DEVICES INC·Filed 2002·Granted May 20, 2003·72 cites·18 claims
- 1194US6436808B1NH3/N2-plasma treatment to prevent organic ILD degradationADVANCED MICRO DEVICES INC·Filed 2000·Granted Aug 20, 2002·82 cites·30 claims
- 1293US6830998B1Gate dielectric quality for replacement metal gate transistorsADVANCED MICRO DEVICES INC·Filed 2003·Granted Dec 14, 2004·75 cites·9 claims
- 1393US6764898B1Implantation into high-K dielectric material after gate etch to facilitate removalADVANCED MICRO DEVICES INC·Filed 2002·Granted Jul 20, 2004·76 cites·23 claims
- 1493US6727560B1Engineered metal gate electrodeADVANCED MICRO DEVICES INC·Filed 2003·Granted Apr 27, 2004·64 cites·9 claims
- 1593US6723635B1Protection low-k ILD during damascene processing with thin linerADVANCED MICRO DEVICES INC·Filed 2002·Granted Apr 20, 2004·65 cites·15 claims
- 1693US6660634B1Method of forming reliable capped copper interconnectsADVANCED MICRO DEVICES INC·Filed 2002·Granted Dec 9, 2003·67 cites·15 claims
- 1793US6656763B1Spin on polymers for organic memory devicesADVANCED MICRO DEVICES INC·Filed 2003·Granted Dec 2, 2003·98 cites·20 claims
- 1893US6563183B1Gate array with multiple dielectric properties and method for forming sameADVANCED MICRO DEVICES INC·Filed 2002·Granted May 13, 2003·113 cites·4 claims
- 1993US6528432B1H2-or H2/N2-plasma treatment to prevent organic ILD degradationADVANCED MICRO DEVICES INC·Filed 2000·Granted Mar 4, 2003·68 cites·34 claims
- 2092US6562416B2Method of forming low resistance viasADVANCED MICRO DEVICES INC·Filed 2001·Granted May 13, 2003·57 cites·12 claims
- 2192US6429128B1Method of forming nitride capped Cu lines with reduced electromigration along the Cu/nitride interfaceADVANCED MICRO DEVICES INC·Filed 2001·Granted Aug 6, 2002·63 cites·20 claims
- 2291US6878592B1Selective epitaxy to improve silicidationADVANCED MICRO DEVICES INC·Filed 2003·Granted Apr 12, 2005·51 cites·22 claims
- 2391US6713392B1Nitrogen oxide plasma treatment for reduced nickel silicide bridgingADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 30, 2004·51 cites·15 claims
- 2491US6686263B1Selective formation of top memory electrode by electroless formation of conductive materialsADVANCED MICRO DEVICES INC·Filed 2002·Granted Feb 3, 2004·67 cites·16 claims
- 2591US6657304B1Conformal barrier liner in an integrated circuit interconnectADVANCED MICRO DEVICES INC·Filed 2002·Granted Dec 2, 2003·45 cites·6 claims
- 2691US6033584AProcess for reducing copper oxide during integrated circuit fabricationADVANCED MICRO DEVICES INC·Filed 1997·Granted Mar 7, 2000·118 cites·18 claims
- 2790US6787458B1Polymer memory device formed in via openingADVANCED MICRO DEVICES INC·Filed 2003·Granted Sep 7, 2004·63 cites·20 claims
- 2890US6773954B1Methods of forming passive layers in organic memory cellsADVANCED MICRO DEVICES INC·Filed 2002·Granted Aug 10, 2004·62 cites·23 claims
- 2990US6653190B1Flash memory with controlled wordline widthADVANCED MICRO DEVICES INC·Filed 2001·Granted Nov 25, 2003·44 cites·20 claims
- 3090US6617215B1Memory wordline hard maskADVANCED MICRO DEVICES INC·Filed 2002·Granted Sep 9, 2003·47 cites·20 claims
- 3190US6190966B1Process for fabricating semiconductor memory device with high data retention including silicon nitride etch stop layer formed at high temperature with low hydrogen ion concentrationVANTIS CORP·Filed 1997·Granted Feb 20, 2001·76 cites·32 claims
- 3290US6174743B1Method of reducing incidence of stress-induced voiding in semiconductor interconnect linesADVANCED MICRO DEVICES INC·Filed 1998·Granted Jan 16, 2001·114 cites·6 claims
- 3389US8367493B1Void free interlayer dielectricSPANSION LLC·Filed 2005·Granted Feb 5, 2013·17 cites·17 claims
- 3489US8049334B1Buried silicide local interconnect with sidewall spacers and method for making the sameADVANCED MICRO DEVICES INC·Filed 2010·Granted Nov 1, 2011·8 cites·20 claims
- 3589US6770905B1Implantation for the formation of CuX layer in an organic memory deviceADVANCED MICRO DEVICES INC·Filed 2002·Granted Aug 3, 2004·56 cites·20 claims
- 3689US6525391B1Nickel silicide process using starved silicon diffusion barrierADVANCED MICRO DEVICES INC·Filed 2001·Granted Feb 25, 2003·52 cites·15 claims
- 3788US6809402B1Reflowable-doped HDP filmADVANCED MICRO DEVICES INC·Filed 2002·Granted Oct 26, 2004·53 cites·18 claims
- 3888US6303505B1Copper interconnect with improved electromigration resistanceADVANCED MICRO DEVICES INC·Filed 1998·Granted Oct 16, 2001·87 cites·22 claims
- 3987US9831054B2Insulated thermal cut-off deviceLITTELFUSE INC·Filed 2014·Granted Nov 28, 2017·7 cites·20 claims
- 4087US8035153B2Self-aligned patterning method by using non-conformal film and etch for flash memory and other semiconductor applicationsSPANSION LLC·Filed 2010·Granted Oct 11, 2011·9 cites·27 claims
- 4187US6989604B1Conformal barrier liner in an integrated circuit interconnectADVANCED MICRO DEVICES INC·Filed 2003·Granted Jan 24, 2006·31 cites·14 claims
- 4287US6525428B1Graded low-k middle-etch stop layer for dual-inlaid patterningADVANCE MICRO DEVICES INC·Filed 2002·Granted Feb 25, 2003·46 cites·17 claims
- 4386US7534732B1Semiconductor devices with copper interconnects and composite silicon nitride capping layersSPANSION LLC·Filed 2006·Granted May 19, 2009·12 cites·7 claims
- 4486US7033888B2Engineered metal gate electrodeADVANCED MICRO DEVICES INC·Filed 2004·Granted Apr 25, 2006·33 cites·11 claims
- 4586US6613657B1BPSG, SA-CVD liner/P-HDP gap fillADVANCED MICRO DEVICES INC·Filed 2002·Granted Sep 2, 2003·31 cites·12 claims
- 4686US6479348B1Method of making memory wordline hard mask extensionADVANCED MICRO DEVICES INC·Filed 2002·Granted Nov 12, 2002·31 cites·20 claims
- 4786US6420752B1Semiconductor device with self-aligned contacts using a liner oxide layerADVANCED MICRO DEVICES INC·Filed 2000·Granted Jul 16, 2002·37 cites·7 claims
- 4886US6143672AMethod of reducing metal voidings in 0.25 μm AL interconnectADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 7, 2000·65 cites·17 claims
- 4985US7060571B1Semiconductor device with metal gate and high-k tantalum oxide or tantalum oxynitride gate dielectricADVANCED MICRO DEVICES INC·Filed 2004·Granted Jun 13, 2006·35 cites·18 claims
- 5085US6884681B1Method of manufacturing a semiconductor memory with deuterated materialsFASL LLC·Filed 2003·Granted Apr 26, 2005·31 cites·10 claims
Showing the top 50 of 312 patent records by PatentIndex Score.
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