Inventor · disambiguated record
Michael A. Olla
Also filed as: OLLA MICHAEL A · OLLA MICHAEL ANTHONY
22 granted patents·1,007 citations·filing 1984–2008
97Inventor score
Files withMICROELECTRONICS & COMPUTER9SGS THOMSON MICROELECTRONICS5THOMSON COMPONENTS MOSTEK CORP5NODDINGS KENNETH2THOMSON COMPONENTS MOSTER CORP1
Top patents by PatentIndex Score
22 records- 0192USD288922SZero power random access memory packageTHOMSON COMPONENTS MOSTEK CORP·Filed 1984·Granted Mar 24, 1987·32 cites·1 claims
- 0292US4627151AAutomatic assembly of integrated circuitsTHOMSON COMPONENTS MOSTEK CORP·Filed 1984·Granted Dec 9, 1986·76 cites·7 claims
- 0391US5503948AThin cell electrochemical battery system; and method of interconnecting multiple thin cellsMICROELECTRONICS & COMPUTER·Filed 1994·Granted Apr 2, 1996·80 cites·69 claims
- 0489US4915565AManipulation and handling of integrated circuit diceSGS THOMSON MICROELECTRONICS·Filed 1989·Granted Apr 10, 1990·99 cites·5 claims
- 0588US5057903AThermal heat sink encapsulated integrated circuitMICROELECTRONICS & COMPUTER·Filed 1990·Granted Oct 15, 1991·107 cites·3 claims
- 0687US5574814AParallel optical transceiver linkMICROELECTRONICS & COMPUTER·Filed 1995·Granted Nov 12, 1996·115 cites·17 claims
- 0787US5344795AMethod for encapsulating an integrated circuit using a removable heatsink support blockMICROELECTRONICS & COMPUTER·Filed 1992·Granted Sep 6, 1994·99 cites·32 claims
- 0883US4722060AIntegrated-circuit leadframe adapted for a simultaneous bonding operationTHOMSON COMPONENTS MOSTEK CORP·Filed 1984·Granted Jan 26, 1988·65 cites·5 claims
- 0982US5403784AProcess for manufacturing a stacked multiple leadframe semiconductor package using an alignment templateMICROELECTRONICS & COMPUTER·Filed 1993·Granted Apr 4, 1995·73 cites·23 claims
- 1069US5171290ATesting socket for tab tapeMICROELECTRONICS & COMPUTER·Filed 1991·Granted Dec 15, 1992·34 cites·16 claims
- 1167US5309321AThermally conductive screen mesh for encapsulated integrated circuit packagesMICROELECTRONICS & COMPUTER·Filed 1992·Granted May 3, 1994·37 cites·31 claims
- 1267US4627787AChip selection in automatic assembly of integrated circuitTHOMSON COMPONENTS MOSTEK CORP·Filed 1984·Granted Dec 9, 1986·27 cites·6 claims
- 1365US4759675AChip selection in automatic assembly of integrated circuitSGS THOMSON MICROELECTRONICS·Filed 1986·Granted Jul 26, 1988·29 cites·5 claims
- 1463US5265321AIntegrated circuit structure with heat exchanger elements secured thereto and method of makingMICROELECTRONICS & COMPUTER·Filed 1992·Granted Nov 30, 1993·32 cites·20 claims
- 1560US7413688B2Fabrication of optical devices and assembliesNODDINGS KENNETH·Filed 2001·Granted Aug 19, 2008·7 cites·24 claims
- 1658US5111935AUniversal leadframe carrierSGS THOMSON MICROELECTRONICS·Filed 1988·Granted May 12, 1992·24 cites·8 claims
- 1757US8021058B1Fabrication of optical devices and assembliesNODDINGS KENNETH·Filed 2008·Granted Sep 20, 2011·0 cites·5 claims
- 1857US5065504AMethod of forming flexible metal leads on integrated circuitsMICROELECTRONICS & COMPUTER·Filed 1990·Granted Nov 19, 1991·28 cites·20 claims
- 1949US4626167AManipulation and handling of integrated circuit diceTHOMSON COMPONENTS MOSTEK CORP·Filed 1984·Granted Dec 2, 1986·15 cites·5 claims
- 2044US4743956AOffset bending of curvaceously planar radiating leadframe leads in semiconductor chip packagingTHOMSON COMPONENTS MOSTER CORP·Filed 1986·Granted May 10, 1988·16 cites·4 claims
- 2134US4815595AUniform leadframe carrierSGS THOMSON MICROELECTRONICS·Filed 1988·Granted Mar 28, 1989·6 cites·6 claims
- 2233US5182851AMethod for holding a strip of conductive lead framesSGS THOMSON MICROELECTRONICS·Filed 1991·Granted Feb 2, 1993·6 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →