Inventor · disambiguated record
Mitsuo Osada
Also filed as: OSADA MITSUO
16 granted patents·1 pending application·279 citations·filing 1982–2006
94Inventor score
Top patents by PatentIndex Score
17 records- 0182US4457780AElectric contact materialsSUMITOMO ELECTRIC INDUSTRIES·Filed 1982·Granted Jul 3, 1984·22 cites·8 claims
- 0278US5229549ACeramic circuit board and a method of manufacturing the ceramic circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Jul 20, 1993·62 cites·4 claims
- 0373US6475429B2Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the sameTOKYO TUNGSTEN KK·Filed 2001·Granted Nov 5, 2002·19 cites·19 claims
- 0472US5481136ASemiconductor element-mounting composite heat-sink baseSUMITOMO ELECTRIC INDUSTRIES·Filed 1995·Granted Jan 2, 1996·45 cites·22 claims
- 0569US6595821B2Rotary anode for X-ray tube comprising an Mo-containing layer and a W-containing layer laminated to each other and method of producing the sameTOKYO TUNGSTEN KK·Filed 2001·Granted Jul 22, 2003·7 cites·6 claims
- 0668US6271585B1Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the sameTOKYO TUNGSTEN KK·Filed 1998·Granted Aug 7, 2001·32 cites·27 claims
- 0765US5448107ARadiating fin having an improved life and thermal conductivitySUMITOMO ELECTRIC INDUSTRIES·Filed 1992·Granted Sep 5, 1995·35 cites·12 claims
- 0858US7083759B2Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directionsALMT CORP·Filed 2001·Granted Aug 1, 2006·10 cites·7 claims
- 0958US4614638AProcess for producing sintered ferrous alloysSUMITOMO ELECTRIC INDUSTRIES·Filed 1985·Granted Sep 30, 1986·12 cites·19 claims
- 1055US6926861B2Semiconductor package and method for producing heat-radiating substrate for itTOKYO TUNGSTEN KK·Filed 2003·Granted Aug 9, 2005·6 cites·7 claims
- 1147US6693353B1Semiconductor package and method for producing heat-radiating substrate for itTOKYO TUNGSTEN KK·Filed 1999·Granted Feb 17, 2004·13 cites·6 claims
- 1239US2006246314A1Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directionsALMT CORP·Filed 2006·Application pending·0 cites
- 1336US5305947AMethod for manufacturing semiconductor-mounting heat-radiative substrates and semiconductor package using the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1993·Granted Apr 26, 1994·7 cites·3 claims
- 1432US5451817ASemiconductor-mounting heat-radiative substrates, a method of making and use thereof in semiconductor packagesSUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted Sep 19, 1995·4 cites·7 claims
- 1532US5132779AHousing for semiconductor device with occlusion gas removedSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Jul 21, 1992·3 cites·5 claims
- 1625US6233311B1Rotary anode for X-ray tube comprising an Mo-containing layer and a W-containing layer laminated to each other and method of producing the sameTOKYO TUNGSTERS CO LTD·Filed 1999·Granted May 15, 2001·1 cites·4 claims
- 1724US5275782AHousing for semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Jan 4, 1994·1 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →