Inventor · disambiguated record
Milan Paunovic
Also filed as: PAUNOVIC MILAN
11 granted patents·5 pending applications·1,084 citations·filing 1979–2008
94Inventor score
Top patents by PatentIndex Score
16 records- 0198US6197364B1Production of electroless Co(P) with designed coercivityIBM·Filed 1999·Granted Mar 6, 2001·294 cites·13 claims
- 0297US5380560APalladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal depositionIBM·Filed 1992·Granted Jan 10, 1995·327 cites·20 claims
- 0393US5169680AElectroless deposition for IC fabricationINTEL CORP·Filed 1992·Granted Dec 8, 1992·192 cites·50 claims
- 0484US5729201AIdentification tags using amorphous wireIBM·Filed 1995·Granted Mar 17, 1998·80 cites·5 claims
- 0580US4908242AMethod of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissuresKOLLMORGEN CORP·Filed 1988·Granted Mar 13, 1990·47 cites·42 claims
- 0679US6911229B2Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereofIBM·Filed 2002·Granted Jun 28, 2005·20 cites·14 claims
- 0777US6416812B1Method for depositing copper onto a barrier layerIBM·Filed 2000·Granted Jul 9, 2002·20 cites·18 claims
- 0873US4303798AHeat shock resistant printed circuit board assembliesKOLLMORGEN TECH CORP·Filed 1979·Granted Dec 1, 1981·26 cites·9 claims
- 0970US6395164B1Copper seed layer repair technique using electroless touch-upIBM·Filed 1999·Granted May 28, 2002·36 cites·3 claims
- 1069US4814197AControl of electroless plating bathsKOLLMORGEN CORP·Filed 1986·Granted Mar 21, 1989·29 cites·22 claims
- 1152US2008237053A1Structure comprising a barrier layer of a tungsten alloy comprising cobalt and/or nickelIBM·Filed 2008·Application pending·0 cites
- 1247US2005269708A1Tungsten encapsulated copper interconnections using electroplatingANDRICACOS PANAYOTIS C·Filed 2005·Application pending·0 cites
- 1343US5294486ABarrier improvement in thin filmsIBM·Filed 1993·Granted Mar 15, 1994·13 cites·4 claims
- 1443US2005006777A1Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereofIBM·Filed 2004·Application pending·0 cites
- 1540US2004108136A1Structure comprising a barrier layer of a tungsten alloy comprising cobalt and/or nickelIBM·Filed 2002·Application pending·0 cites
- 1639US2002092673A1Tungsten encapsulated copper interconnections using electroplatingIBM·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →