Inventor · disambiguated record
Michael Rattner
Also filed as: RATTNER MICHAEL · RATTNER MICHAEL B
9 granted patents·4 pending applications·219 citations·filing 2002–2015
89Inventor score
Top patents by PatentIndex Score
13 records- 0192US6902947B2Integrated method for release and passivation of MEMS structuresAPPLIED MATERIALS INC·Filed 2003·Granted Jun 7, 2005·89 cites·10 claims
- 0285US6846746B2Method of smoothing a trench sidewall after a deep trench silicon etch processAPPLIED MATERIALS INC·Filed 2002·Granted Jan 25, 2005·36 cites·20 claims
- 0380US6830950B2Integrated method for release and passivation of MEMS structuresAPPLIED MATERIALS INC·Filed 2002·Granted Dec 14, 2004·27 cites·38 claims
- 0479US7618548B2Silicon-containing structure with deep etched features, and method of manufactureAPPLIED MATERIALS INC·Filed 2005·Granted Nov 17, 2009·7 cites·7 claims
- 0577US6849554B2Method of etching a deep trench having a tapered profile in siliconAPPLIED MATERIALS INC·Filed 2002·Granted Feb 1, 2005·26 cites·34 claims
- 0675US7074723B2Method of plasma etching a deeply recessed feature in a substrate using a plasma source gas modulated etchant systemAPPLIED MATERIALS INC·Filed 2002·Granted Jul 11, 2006·18 cites·51 claims
- 0770US6900133B2Method of etching variable depth features in a crystalline substrateAPPLIED MATERIALS INC·Filed 2002·Granted May 31, 2005·14 cites·21 claims
- 0862US9018724B2Method of producing optical MEMSTING ALBERT·Filed 2008·Granted Apr 28, 2015·2 cites·19 claims
- 0948US2005241771A1Substrate carrier for processing substratesAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 1044US10712525B2Packaging MEMS in fluidic environmentsTING ALBERT·Filed 2015·Granted Jul 14, 2020·0 cites·8 claims
- 1141US2003219986A1Substrate carrier for processing substratesAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 1237US2003217693A1Substrate support assembly having an edge protectorAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 1337US2004087054A1Disposable barrier technique for through wafer etching in MEMSAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →