Inventor · disambiguated record
Ming-Tung Shen
Also filed as: SHEN MING · SHEN MING-TUNG
38 granted patents·9 pending applications·568 citations·filing 1983–2023
97Inventor score
Files withOLIN CORP6BOEHRINGER INGELHEIM INT3COMPUTECH INTERNAT VENTURES LT3CTS COMP TECHNOLOGY SYSTEM COR3MILLENNIUM PHARM INC3
Top patents by PatentIndex Score
47 records- 0194US6774473B1Semiconductor chip moduleSHEN MING-TUNG·Filed 1999·Granted Aug 10, 2004·170 cites·8 claims
- 0293US5384689AIntegrated circuit chip including superimposed upper and lower printed circuit boardsFiled 1993·Granted Jan 24, 1995·170 cites·3 claims
- 0391US7332614B2Process for cross coupling indolesBOEHRINGER INGELHEIM INT·Filed 2005·Granted Feb 19, 2008·16 cites·13 claims
- 0483US8795589B1Bio-based volatile corrosion inhibitorsFURMAN ALLA·Filed 2012·Granted Aug 5, 2014·6 cites·4 claims
- 0582US5146011APreparation of chlorohydrinsOLIN CORP·Filed 1991·Granted Sep 8, 1992·24 cites·24 claims
- 0677US7126009B2Palladium catalyzed indolization of 2-bromo or chloroanilinesBOEHRINGER INGELHEIM INT·Filed 2005·Granted Oct 24, 2006·2 cites·10 claims
- 0775US6255323B1Cyanoguanidine compoundsSHIONOGI BIORES CORP·Filed 2000·Granted Jul 3, 2001·8 cites·39 claims
- 0875US4847410ABlock co-polymers useful as aqueous dispersantsOLIN CORP·Filed 1987·Granted Jul 11, 1989·13 cites·8 claims
- 0972US10697070B1Corrosion inhibiting filmsCORTEC CORP·Filed 2017·Granted Jun 30, 2020·1 cites·5 claims
- 1070US6368894B1Multi-chip semiconductor module and manufacturing process thereofFiled 2000·Granted Apr 9, 2002·15 cites·26 claims
- 1168US2023253640A1Method for regenerating secondary batterySHEN MING TUNG·Filed 2023·Application pending·0 cites
- 1267US6577014B2Low-profile semiconductor deviceSHEN YU NUNG·Filed 2001·Granted Jun 10, 2003·13 cites·13 claims
- 1367US2010197924A1Preparation of aminotetralin compoundsMILLENNIUM PHARM INC·Filed 2009·Application pending·0 cites
- 1466US6501291B1Testing base for semiconductor devicesCTS COMP TECHNOLOGY SYSTEM COR·Filed 2000·Granted Dec 31, 2002·13 cites·19 claims
- 1565US6704609B1Multi-chip semiconductor module and manufacturing process thereofSHEN MING-TUNG·Filed 2000·Granted Mar 9, 2004·12 cites·65 claims
- 1665US6627993B1Semiconductor device having an electrical contact and a dielectric lining in a contact regionCTS COMP TECHNOLOGY SYSTEM COR·Filed 2000·Granted Sep 30, 2003·10 cites·5 claims
- 1765US6271586B1Integrated circuit chip and method for fabricating the sameFiled 1999·Granted Aug 7, 2001·21 cites·3 claims
- 1862US4959156ABlock co-polymers useful as aqueous dispersantsOLIN CORP·Filed 1989·Granted Sep 25, 1990·14 cites·8 claims
- 1962US2015112071A1Preparation of aminotetralin compoundsMILLENNIUM PHARM INC·Filed 2014·Application pending·0 cites
- 2060US2014256947A1Preparation of aminotetralin compoundsMILLENNIUM PHARM INC·Filed 2013·Application pending·0 cites
- 2155US7408076B22-Bromoanaline and 2-chloroaniline compoundsBOEHRINGER INGELHEIM INT·Filed 2006·Granted Aug 5, 2008·0 cites·4 claims
- 2255US6670707B2Integrated circuit chipFiled 2001·Granted Dec 30, 2003·4 cites·14 claims
- 2354US6420210B2Semiconductor device and method for manufacturing the sameCOMPUTECH INTERNAT VENTURES LT·Filed 2001·Granted Jul 16, 2002·5 cites·5 claims
- 2453US4761447AHeat-vulcanizable moldable/extrudable organopolysiloxane compositionsRHONE POULENC CHIMIE·Filed 1987·Granted Aug 2, 1988·10 cites·9 claims
- 2552US6429514B2Integrated circuit chip and method for fabricating the sameCOMPUTECH INTERNAT VENTURES LT·Filed 2001·Granted Aug 6, 2002·3 cites·9 claims
- 2652US6429535B2Integrated circuit chip and method for fabricating the sameCOMPUTECH INTERNAT VENTURES LT·Filed 2001·Granted Aug 6, 2002·3 cites·6 claims
- 2751US7714127B2Process for making heteroaryl amine intermediate compoundsBOEHRINGER INGELHEIM PHARMA·Filed 2006·Granted May 11, 2010·0 cites·8 claims
- 2850US4515958AProcess for preparing 1-alkyl-5-mercaptotetrazolesOLIN CORP·Filed 1983·Granted May 7, 1985·3 cites·11 claims
- 2949US5777178AProcess for the preparation of polyoxyalkylene ether surfactant compositionsOLIN CORP·Filed 1996·Granted Jul 7, 1998·5 cites·12 claims
- 3048US6580168B2Method for manufacturing a low-profile semiconductor deviceFiled 2001·Granted Jun 17, 2003·3 cites·12 claims
- 3146US6380613B1Semiconductor deviceFiled 2000·Granted Apr 30, 2002·2 cites·31 claims
- 3246US4546164AProcess for preparing a one-component organopolysiloxane compositionSWS SILICONES CORP·Filed 1985·Granted Oct 8, 1985·7 cites·9 claims
- 3346US2019386333A1Lithium ion secondary batteryMING TUNG SHEN·Filed 2018·Application pending·0 cites
- 3444US2017294677A1Fluorine-Substituted Propylene Carbonate-Based Electrolytic Solution and Lithium-Ion BatteryHSC CORP·Filed 2014·Application pending·0 cites
- 3544US2008319166A1Treatment of implantable medical devices resistant to calcificationSHEN MING·Filed 2008·Application pending·0 cites
- 3641US2004159955A1Semiconductor chip moduleFiled 2004·Application pending·0 cites
- 3740US6677180B2Method for manufacturing a low-profile semiconductor deviceFiled 2003·Granted Jan 13, 2004·0 cites·18 claims
- 3839US6534344B2Integrated circuit chip and method for fabricating the sameFiled 2001·Granted Mar 18, 2003·0 cites·3 claims
- 3938US6734041B2Semiconductor chip module and method for manufacturing the sameFiled 2001·Granted May 11, 2004·0 cites·10 claims
- 4038US2001011770A1Semiconductor device and method for fabricating the sameFiled 2001·Application pending·0 cites
- 4137US6916734B2Contact-forming methodINFO POINT ENTPR LTD·Filed 2003·Granted Jul 12, 2005·0 cites·4 claims
- 4237US6262483B1Semiconductor chip module and method for manufacturing the sameFiled 1999·Granted Jul 17, 2001·5 cites·9 claims
- 4337US5162575APreparation of isocyanates using a silver salt promoted rearrangementOLIN CORP·Filed 1991·Granted Nov 10, 1992·2 cites·8 claims
- 4433US6307270B1Electro-optic device and method for manufacturing the sameFiled 1999·Granted Oct 23, 2001·4 cites·15 claims
- 4532US6246109B1Semiconductor device and method for fabricating the sameFiled 1999·Granted Jun 12, 2001·2 cites·15 claims
- 4630US6278183B1Semiconductor device and method for manufacturing the sameFiled 1999·Granted Aug 21, 2001·0 cites·8 claims
- 4730US6225691B1Integrated circuit packaging structureCTS COMP TECHNOLOGY SYSTEM COR·Filed 1999·Granted May 1, 2001·2 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →