Inventor · disambiguated record
Min-Sung Song
Also filed as: SONG MIN SUNG
22 granted patents·6 pending applications·46 citations·filing 2007–2023
93Inventor score
Files withSAMSUNG ELECTRONICS CO LTD10SAMSUNG ELECTRO MECH9KANG SUNG HYUNG2SIM JAE-HWANG2SONG MIN-SUNG2
Top patents by PatentIndex Score
28 records- 0189US11581146B2Ceramic electronic component comprising dielectric grains having a core-dual shell structure and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2020·Granted Feb 14, 2023·2 cites·16 claims
- 0288US8593038B2Dielectric composition and ceramic electronic component including the sameKANG SUNG HYUNG·Filed 2012·Granted Nov 26, 2013·9 cites·13 claims
- 0380US10529736B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 7, 2020·4 cites·20 claims
- 0480US8183152B2Method of fabricating semiconductor deviceSIM JAE-HWANG·Filed 2010·Granted May 22, 2012·5 cites·20 claims
- 0579US11581144B2Multilayer capacitor and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2021·Granted Feb 14, 2023·1 cites·18 claims
- 0679US9190209B2Dielectric ceramic composition and multilayer ceramic capacitor including the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 17, 2015·3 cites·16 claims
- 0777US8343812B2Contact structures in substrate having bonded interface, semiconductor device including the same, methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2011·Granted Jan 1, 2013·4 cites·9 claims
- 0876US9461058B2Methods of fabricating semiconductor devices including multiple patterningSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 4, 2016·2 cites·20 claims
- 0975US8592273B2Method of manufacturing nonvolatile memory deviceSIM JAE-HWANG·Filed 2011·Granted Nov 26, 2013·4 cites·13 claims
- 1073US9076578B2Dielectric composition and ceramic electronic component including the sameSAMSUNG ELECTRO MECH·Filed 2012·Granted Jul 7, 2015·2 cites·15 claims
- 1173US8829644B2Nonvolatile memory device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 9, 2014·3 cites·7 claims
- 1271US9330931B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 3, 2016·2 cites·20 claims
- 1370US11842857B2Ceramic electronic component comprising dielectric grains having a core-dual shell structure and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2023·Granted Dec 12, 2023·0 cites·14 claims
- 1470US8034668B2Method for forming semiconductor device having metallization comprising select lines, bit lines and word linesSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 11, 2011·3 cites·14 claims
- 1567US9761603B2Methods for fabricating a semiconductor device and semiconductor devices fabricated by the sameSONG MIN-SUNG·Filed 2015·Granted Sep 12, 2017·1 cites·20 claims
- 1661US10896917B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 19, 2021·0 cites·20 claims
- 1758US10593689B2Methods for fabricating a semiconductor device and semiconductor devices fabricated by the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 17, 2020·0 cites·12 claims
- 1858US9129753B2Dielectric ceramic composition and multi-layer ceramic capacitor comprising the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Sep 8, 2015·0 cites·12 claims
- 1958US7601998B2Semiconductor memory device having metallization comprising select lines, bit lines and word linesSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 13, 2009·1 cites·10 claims
- 2055US2014063686A1Dielectric composition having high dielectric constant, multilayered ceramic condensers comprising the same, and method of preparing for multilayered ceramic condensersSAMSUNG ELECTRO MECHANIS CO LTD·Filed 2013·Application pending·0 cites
- 2150US2012113562A1Dielectric composition having high dielectric constant, multi layered ceramic condensers comprising the same, and method of preparing for multi layered ceramic condensersKANG SUNG HYUNG·Filed 2011·Application pending·0 cites
- 2249US7936002B2Multiple-layer non-volatile memory devices, memory systems employing such devices, and methods of fabrication thereofSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted May 3, 2011·0 cites·8 claims
- 2347US8399308B2Method for forming semiconductor device having metallization comprising select lines, bit lines and word linesJANG YOUNG-CHUL·Filed 2011·Granted Mar 19, 2013·0 cites·14 claims
- 2446US2010012980A1Contact Structures in Substrate Having Bonded Interface, Semiconductor Device Including the Same, Methods of Fabricating the SameSONG MIN-SUNG·Filed 2009·Application pending·0 cites
- 2546US2014098455A1Dielectric composition and multilayer ceramic electronic component manufactured using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2643US2014218840A1Dielectric composition and multilayer ceramic electronic component using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2737US2016126012A1Multilayer ceramic capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2836US8227306B2Multiple-layer non-volatile memory devices, memory systems employing such devices, and methods of fabrication thereofKIM JONGHYUK·Filed 2011·Granted Jul 24, 2012·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →