Inventor · disambiguated record
Michihiro Sugo
Also filed as: SUGO MICHIHIRO
78 granted patents·7 pending applications·247 citations·filing 1996–2024
98Inventor score
Top patents by PatentIndex Score
85 records- 0193US10128143B2Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2015·Granted Nov 13, 2018·9 cites·15 claims
- 0291US10982053B2Polymer containing silphenylene and polyether structuresSHINETSU CHEMICAL CO·Filed 2019·Granted Apr 20, 2021·6 cites·5 claims
- 0391US9646868B2Wafer temporary bonding method and thin wafer manufacturing methodSHINETSU CHEMICAL CO·Filed 2015·Granted May 9, 2017·7 cites·13 claims
- 0489US7638259B2Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the compositionSHINETSU CHEMICAL CO·Filed 2007·Granted Dec 29, 2009·8 cites·11 claims
- 0588US9934996B2Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing methodSHINETSU CHEMICAL CO·Filed 2016·Granted Apr 3, 2018·5 cites·12 claims
- 0687US8999817B2Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2013·Granted Apr 7, 2015·7 cites·44 claims
- 0787US8796410B2Polymer having silphenylene and siloxane structures, a method of preparing the same, an adhesive composition, an adhesive sheet, a protective material for a semiconductor device, and a semiconductor deviceSUGO MICHIHIRO·Filed 2012·Granted Aug 5, 2014·10 cites·16 claims
- 0886US9941145B2Wafer processing temporary bonding arrangement, wafer processing laminate, and thin wafer manufacturing methodSHINETSU CHEMICAL CO·Filed 2016·Granted Apr 10, 2018·4 cites·11 claims
- 0986US7485405B2Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting filmSHINETSU CHEMICAL CO·Filed 2005·Granted Feb 3, 2009·25 cites·11 claims
- 1086US7432313B2Solvent-free polymide silicone resin composition and a cured resin film thereofSHINETSU CHEMICAL CO·Filed 2005·Granted Oct 7, 2008·7 cites·21 claims
- 1183US8673537B2Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said compositionFURUYA MASAHIRO·Filed 2010·Granted Mar 18, 2014·4 cites·18 claims
- 1283US8263308B2Polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formationTAGAMI SHOHEI·Filed 2010·Granted Sep 11, 2012·6 cites·10 claims
- 1382US9884979B2Temporary adhesion method and method for producing thin waferSHINETSU CHEMICAL CO·Filed 2016·Granted Feb 6, 2018·3 cites·18 claims
- 1481US10658314B2Wafer laminate, method for production thereof, and adhesive composition for wafer laminateSHINETSU CHEMICAL CO·Filed 2017·Granted May 19, 2020·1 cites·9 claims
- 1581US9346990B2Temporary adhesive material for wafer processing, wafer processing laminate, and method for manufacturing thin wafer using sameSHINETSU CHEMICAL CO·Filed 2015·Granted May 24, 2016·3 cites·20 claims
- 1681US8378148B2Alcoholic hydroxyl-containing compounds and making methodSHINETSU CHEMICAL CO·Filed 2010·Granted Feb 19, 2013·2 cites·2 claims
- 1781US6538093B2Polyimide silicone resin, process for its production, and polyimide silicone resin compositionSHINETSU CHEMICAL CO·Filed 2001·Granted Mar 25, 2003·15 cites·14 claims
- 1880US9263333B2Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin waferSHINETSU CHEMICAL CO·Filed 2013·Granted Feb 16, 2016·4 cites·21 claims
- 1979US10115622B2Wafer processing laminate and method for processing waferSHINETSU CHEMICAL CO·Filed 2016·Granted Oct 30, 2018·2 cites·14 claims
- 2079US7781541B2Polyimide silicone resin and thermosetting composition comprising the sameSHINETSU CHEMICAL CO·Filed 2007·Granted Aug 24, 2010·3 cites·12 claims
- 2177US10297485B2Semiconductor device, making method, and laminateSHINETSU CHEMICAL CO·Filed 2018·Granted May 21, 2019·2 cites·5 claims
- 2276US10319653B2Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the sameSHINETSU CHEMICAL CO·Filed 2015·Granted Jun 11, 2019·3 cites·10 claims
- 2376US9653335B2Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing methodKATO HIDETO·Filed 2012·Granted May 16, 2017·4 cites·7 claims
- 2476US8501879B2Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatusKONDO KAZUNORI·Filed 2011·Granted Aug 6, 2013·5 cites·16 claims
- 2575US10308787B2Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2017·Granted Jun 4, 2019·2 cites·19 claims
- 2675US7981976B2Heat-curable polyimide silicone resin compositionSHINETSU CHEMICAL CO·Filed 2008·Granted Jul 19, 2011·2 cites·4 claims
- 2774US10242902B2Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2015·Granted Mar 26, 2019·2 cites·15 claims
- 2874US8053533B2Phenolic OH-containing polyimide silicone, epoxy resin and curing agentSHINETSU CHEMICAL CO·Filed 2009·Granted Nov 8, 2011·2 cites·12 claims
- 2974US7678874B2Polyimide having an alcoholic hydroxyl group and a process for the preparation thereofSHINETSU CHEMICAL CO·Filed 2005·Granted Mar 16, 2010·2 cites·6 claims
- 3073US11183417B2Method for manufacturing laminate and method for manufacturing substrateSHINETSU CHEMICAL CO·Filed 2019·Granted Nov 23, 2021·1 cites·18 claims
- 3172US7041766B2Colorless and transparent polyimidesilicone resin having thermosetting functional groupsSHINETSU CHEMICAL CO·Filed 2003·Granted May 9, 2006·19 cites·7 claims
- 3271US9550931B2Temporary adhesive material for wafer, film for temporary adhesion using same, wafer processing laminate, and method for producing thin wafer using sameSHINETSU CHEMICAL CO·Filed 2014·Granted Jan 24, 2017·2 cites·20 claims
- 3371US9096032B2Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing methodSHINETSU CHEMICAL CO·Filed 2013·Granted Aug 4, 2015·2 cites·23 claims
- 3470US8735264B2Temporary adhesive composition and method for manufacturing thin wafer using the sameSHINETSU CHEMICAL CO·Filed 2012·Granted May 27, 2014·2 cites·10 claims
- 3570US2025236598A1New compoundSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 3669US7834100B2Phenolic OH and radically polymerizable group containing polyimide silicone and epoxy resinSHINETSU CHEMICAL CO·Filed 2008·Granted Nov 16, 2010·1 cites·9 claims
- 3769US7256248B2Imide silicone resin and production process thereforSHINETSU CHEMICAL CO·Filed 2003·Granted Aug 14, 2007·8 cites·16 claims
- 3867US10373903B2Laminate and making methodSHINETSU CHEMICAL CO·Filed 2018·Granted Aug 6, 2019·0 cites·6 claims
- 3967US7405244B2Solvent-free polyimide silicone resin composition and a resin film composed of the sameSHINETSU CHEMICAL CO·Filed 2005·Granted Jul 29, 2008·1 cites·10 claims
- 4066US6706841B2Solventless polyimide silicone resin compositionsSHINETSU CHEMICAL CO·Filed 2002·Granted Mar 16, 2004·6 cites·12 claims
- 4165US10106713B2Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2015·Granted Oct 23, 2018·1 cites·21 claims
- 4265US9472438B2Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin waferSHINETSU CHEMICAL CO·Filed 2013·Granted Oct 18, 2016·1 cites·28 claims
- 4365US6703133B2Polyimide silicone resin, its solution composition, and polyimide silicone resin filmSHINETSU CHEMICAL CO·Filed 2001·Granted Mar 9, 2004·6 cites·13 claims
- 4464US9458365B2Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the sameSHINETSU CHEMICAL CO·Filed 2014·Granted Oct 4, 2016·1 cites·18 claims
- 4564US9365681B2Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing methodSHINETSU CHEMICAL CO·Filed 2012·Granted Jun 14, 2016·1 cites·15 claims
- 4664US9334424B2Temporary adhesive for wafer processing, member for wafer processing using the same, wafer processed body, and method for producing thin waferSHINETSU CHEMICAL CO·Filed 2013·Granted May 10, 2016·1 cites·20 claims
- 4764US8048978B2Silphenylene compound and process for producing the sameSHINETSU CHEMICAL CO·Filed 2008·Granted Nov 1, 2011·0 cites·4 claims
- 4863US6723432B2Electrode-forming compositions and electrode membersSHINETSU CHEMICAL CO·Filed 2002·Granted Apr 20, 2004·5 cites·10 claims
- 4962US6749643B2Method of dry cleaning and dry cleaning solvent thereforSHINETSU CHEMICAL CO·Filed 2001·Granted Jun 15, 2004·3 cites·12 claims
- 5062US6248803B1Radiation-curable resin compositionsSHINETSU CHEMICAL CO·Filed 1999·Granted Jun 19, 2001·16 cites·6 claims
Showing the top 50 of 85 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →