Inventor · disambiguated record
Ming Sun
Also filed as: SUN MING · SUN MING-WEI
120 granted patents·31 pending applications·1,703 citations·filing 2003–2024
99Inventor score
Files withALPHA & OMEGA SEMICONDUCTOR26AU OPTRONICS CORP19SEAGATE TECHNOLOGY LLC17SUN MING17WESTERN DIGITAL FREMONT LLC12
Top patents by PatentIndex Score
151 records- 0198US8582238B1Systems and methods for providing perpendicular magnetic writers having gradient magnetic moment side shieldsLIU FENG·Filed 2011·Granted Nov 12, 2013·175 cites·27 claims
- 0298US8451563B1Method for providing a side shield for a magnetic recording transducer using an air bridgeZHANG JINQIU·Filed 2011·Granted May 28, 2013·158 cites·14 claims
- 0398US8322022B1Method for providing an energy assisted magnetic recording head in a wafer packaging configurationYI GE·Filed 2010·Granted Dec 4, 2012·152 cites·15 claims
- 0497US8760819B1Magnetic recording sensor with sputtered antiferromagnetic coupling trilayer between plated ferromagnetic shieldsLIU FENG·Filed 2010·Granted Jun 24, 2014·142 cites·22 claims
- 0597US8441756B1Method and system for providing an antiferromagnetically coupled writerSUN MING·Filed 2010·Granted May 14, 2013·150 cites·10 claims
- 0697US7868431B2Compact power semiconductor package and method with stacked inductor and integrated circuit dieALPHA & OMEGA SEMICONDUCTOR·Filed 2009·Granted Jan 11, 2011·66 cites·28 claims
- 0796US9817375B2Systems and methods for modeling energy consumption and creating demand response strategies using learning-based approachesBOARD OF TRUSTEES OF THE UNIV OF ALABAMA·Filed 2015·Granted Nov 14, 2017·28 cites·11 claims
- 0896US8670211B1Method and system for providing high magnetic flux saturation CoFe filmsSUN MING·Filed 2011·Granted Mar 11, 2014·153 cites·16 claims
- 0996US8097874B2Programmable resistive memory cell with sacrificial metalVENKATASAMY VENKATRAM·Filed 2009·Granted Jan 17, 2012·92 cites·20 claims
- 1095US8513784B2Multi-layer lead frame package and method of fabricationLU JUN·Filed 2010·Granted Aug 20, 2013·24 cites·17 claims
- 1194US7622796B2Semiconductor package having a bridged plate interconnectionALPHA & OMEGA SEMICONDUCTOR·Filed 2007·Granted Nov 24, 2009·31 cites·23 claims
- 1293US9443541B1Magnetic writer having a gradient in saturation magnetization of the shields and return poleWESTERN DIGITAL (FREMONT) LLC·Filed 2015·Granted Sep 13, 2016·21 cites·20 claims
- 1393US7776658B2Compact co-packaged semiconductor dies with elevation-adaptive interconnection platesALPHA & OMEGA SEMICONDUCTOR·Filed 2008·Granted Aug 17, 2010·29 cites·16 claims
- 1492US7683464B2Semiconductor package having dimpled plate interconnectionsALPHA & OMEGA SEMICONDUCTOR·Filed 2007·Granted Mar 23, 2010·25 cites·12 claims
- 1591US9305583B1Method for fabricating a magnetic writer using multiple etches of damascene materialsWESTERN DIGITAL FREMONT LLC·Filed 2014·Granted Apr 5, 2016·17 cites·20 claims
- 1690US8289751B2Non-volatile memory cell with programmable unipolar switching elementTIAN WEI·Filed 2011·Granted Oct 16, 2012·14 cites·20 claims
- 1790US7974117B2Non-volatile memory cell with programmable unipolar switching elementSEAGATE TECHNOLOGY LLC·Filed 2009·Granted Jul 5, 2011·27 cites·20 claims
- 1889US11302350B1Magnetic recording head having a wrap-around shield comprising a laminated film and a magnetic recording device comprising the magnetic recording headWESTERN DIGITAL TECH INC·Filed 2021·Granted Apr 12, 2022·3 cites·20 claims
- 1989US8217748B2Compact inductive power electronics packageFENG TAO·Filed 2009·Granted Jul 10, 2012·18 cites·20 claims
- 2089US8124453B2Vertically packaged MOSFET and IC power devices as integrated module using 3D interconnected laminatesSUN MING·Filed 2010·Granted Feb 28, 2012·10 cites·4 claims
- 2189US7776746B2Method and apparatus for ultra thin wafer backside processingALPHA & OMEGA SEMICONDUCTOR·Filed 2007·Granted Aug 17, 2010·13 cites·10 claims
- 2288US8058960B2Chip scale power converter package having an inductor substrateHEBERT FRANCOIS·Filed 2007·Granted Nov 15, 2011·20 cites·36 claims
- 2387US8981464B2Wafer level chip scale package and process of manufactureALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Mar 17, 2015·6 cites·9 claims
- 2487US7829989B2Vertical packaged IC device modules with interconnected 3D laminates directly contacts wafer backsideALPHA & OMEGA SEMICONDUCTOR·Filed 2005·Granted Nov 9, 2010·14 cites·23 claims
- 2586US10460750B1Plating based pre-defined side shield and application in magnetic headSANDISK TECHNOLOGIES LLC·Filed 2018·Granted Oct 29, 2019·7 cites·19 claims
- 2686US8846532B2Method and apparatus for ultra thin wafer backside processingALPHA & OMEGA SEMICONDUCTOR·Filed 2012·Granted Sep 30, 2014·8 cites·4 claims
- 2786US8680658B2Conductive clip for semiconductor device packageSHI LEI·Filed 2008·Granted Mar 25, 2014·14 cites·23 claims
- 2886US7955893B2Wafer level chip scale package and process of manufactureALPHA & OMEGA SEMICONDUCTOR·Filed 2008·Granted Jun 7, 2011·11 cites·18 claims
- 2986US7777989B2Magnetic writer including an electroplated high moment laminated poleSEAGATE TECHNOLOGY LLC·Filed 2006·Granted Aug 17, 2010·9 cites·20 claims
- 3086US7511361B2DFN semiconductor package having reduced electrical resistanceZHANG XIAOTIAN·Filed 2005·Granted Mar 31, 2009·13 cites·8 claims
- 3185US8456903B2Magnetic memory with porous non-conductive current confinement layerTANG MICHAEL XUEFEI·Filed 2010·Granted Jun 4, 2013·8 cites·17 claims
- 3285US8159828B2Low profile flip chip power module and method of makingSUN MING·Filed 2007·Granted Apr 17, 2012·15 cites·5 claims
- 3385US8119465B1Thin film transistor and method for fabricating the sameLIN WU-HSIUNG·Filed 2011·Granted Feb 21, 2012·9 cites·18 claims
- 3485US8097902B2Programmable metallization memory cells via selective channel formingXI HAIWEN·Filed 2008·Granted Jan 17, 2012·10 cites·12 claims
- 3585US7826181B2Magnetic memory with porous non-conductive current confinement layerSEAGATE TECHNOLOGY LLC·Filed 2008·Granted Nov 2, 2010·9 cites·19 claims
- 3684US7750386B2Memory cells including nanoporous layers containing conductive materialSEAGATE TECHNOLOGY LLC·Filed 2008·Granted Jul 6, 2010·12 cites·21 claims
- 3783US7612439B2Semiconductor package having improved thermal performanceALPHA & OMEGA SEMICONDUCTOR·Filed 2005·Granted Nov 3, 2009·17 cites·12 claims
- 3882US9123359B1Magnetic recording transducer with sputtered antiferromagnetic coupling trilayer between plated ferromagnetic shields and method of fabricationHAN DEHUA·Filed 2010·Granted Sep 1, 2015·9 cites·19 claims
- 3982US7884469B2Semiconductor package having a bridged plate interconnectionALPHA & OMEGA SEMICONDUCTOR·Filed 2009·Granted Feb 8, 2011·9 cites·17 claims
- 4081US9135930B1Method for fabricating a magnetic write pole using vacuum depositionWESTERN DIGITAL FREMONT LLC·Filed 2014·Granted Sep 15, 2015·5 cites·17 claims
- 4181US7740993B2Mask for sequential lateral solidification (SLS) process and a method for crystallizing amorphous silicon by using the sameAU OPTRONICS CORP·Filed 2006·Granted Jun 22, 2010·6 cites·25 claims
- 4280US7811904B2Method of fabricating a semiconductor device employing electroless platingALPHA & OMEGA SEMICONDUCTOR·Filed 2007·Granted Oct 12, 2010·7 cites·9 claims
- 4379US7808102B2Multi-die DC-DC boost power converter with efficient packagingALPHA & OMEGA SEMICONDUCTOR·Filed 2007·Granted Oct 5, 2010·6 cites·12 claims
- 4478US7999363B2Structure and method for self protection of power deviceALPHA & OMEGA SEMICONDUCTOR·Filed 2007·Granted Aug 16, 2011·8 cites·27 claims
- 4577US7857907B2Methods of forming silicon nanocrystals by laser annealingAU OPTRONICS CORP·Filed 2007·Granted Dec 28, 2010·15 cites·22 claims
- 4676US7906375B2Compact co-packaged semiconductor dies with elevation-adaptive interconnection platesALPHA & OMEGA SEMICONDUCTOR·Filed 2010·Granted Mar 15, 2011·4 cites·8 claims
- 4776US7759775B2High current semiconductor power device SOIC packageALPHA & OMEGA SEMICONDUCTOR·Filed 2006·Granted Jul 20, 2010·7 cites·13 claims
- 4875US8564910B2Magnetic shield structureBENAKLI MOURAD·Filed 2009·Granted Oct 22, 2013·2 cites·15 claims
- 4975US7781265B2DFN semiconductor package having reduced electrical resistanceALPHA & OMEGA SEMICONDUCTOR·Filed 2009·Granted Aug 24, 2010·5 cites·4 claims
- 5074US7473498B2Mask and method of manufacturing a poly-silicon layer using the sameAU OPTRONICS CORP·Filed 2005·Granted Jan 6, 2009·4 cites·22 claims
Showing the top 50 of 151 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →