Inventor · disambiguated record
Min Tao
Also filed as: TAO MIN
24 granted patents·7 pending applications·312 citations·filing 2012–2024
95Inventor score
Files withINVENSAS CORP12ADEIA SEMICONDUCTOR TECH LLC6XCELSIS CORP5Corning Optical Communications LLC2INTEL CORP2
Top patents by PatentIndex Score
31 records- 0198US11715730B2Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elementsADEIA SEMICONDUCTOR TECH LLC·Filed 2021·Granted Aug 1, 2023·6 cites·19 claims
- 0298US11329034B2Direct-bonded LED structure contacts and substrate contactsINVENSAS CORP·Filed 2020·Granted May 10, 2022·146 cites·23 claims
- 0398US9368429B2Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chipsMA QING·Filed 2012·Granted Jun 14, 2016·86 cites·16 claims
- 0496US10629577B2Direct-bonded LED arrays and applicationsINVENSAS CORP·Filed 2018·Granted Apr 21, 2020·11 cites·14 claims
- 0596US10151887B2Hardened fiber optic connectors having a mechanical splice connector assemblyCorning Optical Communications LLC·Filed 2017·Granted Dec 11, 2018·20 cites·43 claims
- 0694US9972609B2Package-on-package devices with WLP components with dual RDLs for surface mount dies and methods thereforINVENSAS CORP·Filed 2016·Granted May 15, 2018·8 cites·9 claims
- 0793US10354976B2Dies-on-package devices and methods thereforINVENSAS CORP·Filed 2016·Granted Jul 16, 2019·6 cites·16 claims
- 0891US9991235B2Package on-package devices with upper RDL of WLPS and methods thereforINVENSAS CORP·Filed 2016·Granted Jun 5, 2018·5 cites·9 claims
- 0991US9991233B2Package-on-package devices with same level WLP components and methods thereforINVENSAS CORP·Filed 2016·Granted Jun 5, 2018·5 cites·19 claims
- 1091US2025105234A1Direct-bonded led arrays and driver circuitsADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 1190US2025038161A1Direct-bonded optoelectronic devicesADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 1289US9728524B1Enhanced density assembly having microelectronic packages mounted at substantial angle to boardINVENSAS CORP·Filed 2016·Granted Aug 8, 2017·7 cites·19 claims
- 1388US12199082B2Method of direct-bonded optoelectronic devicesADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Jan 14, 2025·0 cites·21 claims
- 1487US9985007B2Package on-package devices with multiple levels and methods thereforINVENSAS CORP·Filed 2016·Granted May 29, 2018·3 cites·29 claims
- 1587US9972573B2Wafer-level packaged components and methods thereforINVENSAS CORP·Filed 2016·Granted May 15, 2018·3 cites·20 claims
- 1686US12166024B2Direct-bonded LED arrays driversADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Dec 10, 2024·0 cites·19 claims
- 1779US9691728B2BBUL top side substrate layer enabling dual sided silicon interconnect and stacking flexibilityINTEL CORP·Filed 2015·Granted Jun 27, 2017·3 cites·5 claims
- 1872US10955671B2Stretchable film assembly with conductive tracesINVENSAS CORP·Filed 2018·Granted Mar 23, 2021·1 cites·12 claims
- 1968US12124035B2Stretchable film assembly with conductive tracesADEIA SEMICONDUCTOR TECH LLC·Filed 2021·Granted Oct 22, 2024·0 cites·16 claims
- 2067US10734759B2Configurable smart object system with magnetic contacts and magnetic assemblyXCELSIS CORP·Filed 2019·Granted Aug 4, 2020·1 cites·20 claims
- 2166US9617148B2Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chipsINTEL CORP·Filed 2016·Granted Apr 11, 2017·1 cites·8 claims
- 2260US11221513B2Electronic device display with a backlightAPPLE INC·Filed 2019·Granted Jan 11, 2022·0 cites·3 claims
- 2359US10782485B2Hardened fiber optic connectors having a mechanical splice connector assemblyCorning Optical Communications LLC·Filed 2018·Granted Sep 22, 2020·0 cites·48 claims
- 2454US11239587B2Configurable smart object system with clip-based connectorsXCELSIS CORP·Filed 2019·Granted Feb 1, 2022·0 cites·19 claims
- 2551US11246230B2Configurable smart object system with methods of making modules and contactorsXCELSIS CORP·Filed 2018·Granted Feb 8, 2022·0 cites·12 claims
- 2648US2024153182A1Embedded sensors in immersive reality headsets to enable social presenceMETA PLATFORMS TECH LLC·Filed 2022·Application pending·0 cites
- 2744US2019280421A1Configurable smart object system with grid or frame-based connectorsXCELSIS CORP·Filed 2019·Application pending·0 cites
- 2842US2019097362A1Configurable smart object system with standard connectors for adding artificial intelligence to appliances, vehicles, and devicesXCELSIS CORP·Filed 2018·Application pending·0 cites
- 2939US10354945B2Multi-surface edge pads for vertical mount packages and methods of making package stacksINVENSAS CORP·Filed 2017·Granted Jul 16, 2019·0 cites·14 claims
- 3038US2018040587A1Vertical Memory Module Enabled by Fan-Out Redistribution LayerINVENSAS CORP·Filed 2017·Application pending·0 cites
- 3135US2017110816A1Clip and electrical connector assemblyFOXCONN INTERCONNECT TECHNOLOGY LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →