Inventor · disambiguated record
Mitsuhiro Tomikawa
Also filed as: TOMIKAWA MITSUHIRO
28 granted patents·8 pending applications·71 citations·filing 1990–2024
94Inventor score
Top patents by PatentIndex Score
36 records- 0192US8829357B2Wiring board and method for manufacturing the sameMIKADO YUKINOBU·Filed 2011·Granted Sep 9, 2014·17 cites·18 claims
- 0290US11581148B2Thin film capacitor, circuit board incorporating the same, and thin film capacitor manufacturing methodTDK CORP·Filed 2021·Granted Feb 14, 2023·2 cites·20 claims
- 0390US9433097B2Circuit substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Aug 30, 2016·8 cites·20 claims
- 0487US10143092B2Circuit substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2016·Granted Nov 27, 2018·6 cites·20 claims
- 0586US9872401B2Circuit substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Jan 16, 2018·5 cites·20 claims
- 0681US9955591B2Circuit substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Apr 24, 2018·4 cites·20 claims
- 0780US9232656B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Jan 5, 2016·4 cites·21 claims
- 0875US9743534B2Wiring board with built-in electronic component and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Aug 22, 2017·3 cites·20 claims
- 0975US8693209B2Wiring board and method for manufacturing the sameMIKADO YUKINOBU·Filed 2012·Granted Apr 8, 2014·3 cites·21 claims
- 1074US10340088B2Thin-film capacitorTDK CORP·Filed 2018·Granted Jul 2, 2019·1 cites·3 claims
- 1172US9831163B2Circuit substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2016·Granted Nov 28, 2017·2 cites·20 claims
- 1271US9204552B2Printed wiring boardIBIDEN CO LTD·Filed 2012·Granted Dec 1, 2015·3 cites·20 claims
- 1367US10483345B2Electronic component embedded substrateTDK CORP·Filed 2018·Granted Nov 19, 2019·1 cites·4 claims
- 1462US2025125226A1Electronic component embedded module and method of manufacturing electronic component embedded moduleSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1559US8891245B2Printed wiring boardFURUTANI TOSHIKI·Filed 2012·Granted Nov 18, 2014·1 cites·19 claims
- 1658US11276531B2Thin-film capacitor and method for manufacturing thin-film capacitorTDK CORP·Filed 2018·Granted Mar 15, 2022·0 cites·12 claims
- 1753US2025120104A1Thin film capacitor, manufacturing method therefor, and electronic circuit board having the thin film capacitorTDK CORP·Filed 2022·Application pending·0 cites
- 1852US10950389B2Thin-film capacitorTDK CORP·Filed 2019·Granted Mar 16, 2021·0 cites·6 claims
- 1951US2025149252A1Thin film capacitor and electronic circuit board having the sameTDK CORP·Filed 2022·Application pending·0 cites
- 2051US2025218659A1Thin film capacitor and electronic circuit board having the sameTDK CORP·Filed 2022·Application pending·0 cites
- 2149US11114249B2Thin-film capacitorTDK CORP·Filed 2018·Granted Sep 7, 2021·0 cites·5 claims
- 2249US8698269B2Wiring board with built-in imaging device and method for manufacturing sameHANAI NOBUHIRO·Filed 2012·Granted Apr 15, 2014·0 cites·27 claims
- 2346US11367626B2Electronic component-incorporating substrateTDK CORP·Filed 2018·Granted Jun 21, 2022·0 cites·6 claims
- 2445US2023138154A1Electronic component and manufacturing method thereforTDK CORP·Filed 2021·Application pending·0 cites
- 2545US2019394915A1Electronic component housing package and electronic component housing methodTDK CORP·Filed 2019·Application pending·0 cites
- 2643US10886219B2Electronic component mounting packageTDK CORP·Filed 2018·Granted Jan 5, 2021·0 cites·5 claims
- 2743US10813220B2Electronic component embedded substrateTDK CORP·Filed 2018·Granted Oct 20, 2020·0 cites·4 claims
- 2843US9332657B2Multilayer printed wiring board and method for manufacturing multilayer printed wiring boardFURUTANI TOSHIKI·Filed 2012·Granted May 3, 2016·0 cites·4 claims
- 2942US11335614B2Electric component embedded structureTDK CORP·Filed 2018·Granted May 17, 2022·0 cites·7 claims
- 3042US2013256007A1Wiring board with built-in electronic component and method for manufacturing the sameIBIDEN CO LTD·Filed 2012·Application pending·0 cites
- 3140US10278290B2Electronic component embedded substrateTDK CORP·Filed 2017·Granted Apr 30, 2019·0 cites·19 claims
- 3240US10211157B2Electronic componentTDK CORP·Filed 2017·Granted Feb 19, 2019·0 cites·6 claims
- 3334US9930791B2Wiring board with built-in electronic component and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Mar 27, 2018·0 cites·20 claims
- 3434US5245158ASemiconductor device manufacturing apparatusMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Sep 14, 1993·8 cites·7 claims
- 3534US2016143134A1Wiring board with built-in metal block and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Application pending·0 cites
- 3630US5187558AStress reduction structure for a resin sealed semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Feb 16, 1993·3 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →