Inventor · disambiguated record
Ming-Tung Wu
Also filed as: WU MING-TUNG
20 granted patents·1 pending application·446 citations·filing 2010–2024
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD12HSIEH YUAN-CHIH3TAIWAN SEMICONDUCTOR MFG3HUANG HSIN-TING1LIN HUNG-HUA1
Top patents by PatentIndex Score
21 records- 0199US9355882B2Transfer module for bowed wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 31, 2016·391 cites·20 claims
- 0292US11081334B2Particle prevention in wafer edge trimmingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 3, 2021·6 cites·20 claims
- 0390US8580594B2Method of fabricating a semiconductor device having recessed bonding siteHUANG HSIN-TING·Filed 2011·Granted Nov 12, 2013·13 cites·18 claims
- 0490US8207595B2Semiconductor having a high aspect ratio viaHSIEH YUAN-CHIH·Filed 2010·Granted Jun 26, 2012·9 cites·14 claims
- 0589US8846129B2Biological sensing structures and methods of forming the sameLIN HUNG-HUA·Filed 2012·Granted Sep 30, 2014·10 cites·20 claims
- 0684US8598687B2Semiconductor having a high aspect ratio viaHSIEH YUAN-CHIH·Filed 2012·Granted Dec 3, 2013·5 cites·19 claims
- 0783US10510563B2Wafer carrier assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 17, 2019·3 cites·20 claims
- 0882US10857651B2Apparatus of chemical mechanical polishing and operating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·3 cites·20 claims
- 0981US8445380B2Semiconductor having a high aspect ratio viaHSIEH YUAN-CHIH·Filed 2012·Granted May 21, 2013·4 cites·20 claims
- 1079US12183571B2Integrated aligned stealth laser for wafer edge trimming processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 31, 2024·0 cites·20 claims
- 1176US2025079150A1Integrated stealth laser for wafer edge trimming processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1271US10879077B2Planarization apparatus and planarization method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 29, 2020·1 cites·20 claims
- 1368US11605534B2Particle prevention in wafer edge trimmingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 14, 2023·0 cites·20 claims
- 1465US9377401B2Biological sensing structuresTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 28, 2016·0 cites·20 claims
- 1564US10119909B2Biological sensing structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 6, 2018·0 cites·20 claims
- 1664US8735260B2Method to prevent metal pad damage in wafer level packageTSAI SHANG-YING·Filed 2010·Granted May 27, 2014·1 cites·20 claims
- 1762US11342199B2Wafer carrier assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 24, 2022·0 cites·20 claims
- 1857US9099476B2Semiconductor having a high aspect ratio viaTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 4, 2015·0 cites·20 claims
- 1956US11901171B2Integrated aligned stealth laser with blade and grinding apparatus for wafer edge trimming processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 13, 2024·0 cites·20 claims
- 2055US9472504B2Semiconductor having a high aspect ratio viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 18, 2016·0 cites·20 claims
- 2155US9034677B2MEMS device and method of formation thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 19, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →