Inventor · disambiguated record
Ming-Hao Wu
Also filed as: WU MING · Wu ming-hao
26 granted patents·8 pending applications·55 citations·filing 2006–2024
94Inventor score
Files withUNIMICRON TECHNOLOGY CORP25GAUSS LASERS TECH SHANGHAI CO LTD3SHANGHAI TREE GRAPH BLOCKCHAIN RES INSTITUTE2LI XIAOFENG1SHANGHAI TREE GRAPH BLOCKCHAIN INST1
Top patents by PatentIndex Score
34 records- 0194US10939538B1Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Mar 2, 2021·5 cites·12 claims
- 0293US9609746B1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Mar 28, 2017·9 cites·7 claims
- 0392US10039184B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Jul 31, 2018·9 cites·6 claims
- 0492US9491865B1Circuit board and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Nov 8, 2016·8 cites·4 claims
- 0586US10356901B2Manufacturing method of circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Jul 16, 2019·4 cites·8 claims
- 0685US9860984B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Jan 2, 2018·3 cites·12 claims
- 0781US10616992B2Circuit board and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Apr 7, 2020·2 cites·8 claims
- 0874US9832873B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Nov 28, 2017·1 cites·6 claims
- 0973US11349824B2Block sequencing method and system based on tree-graph structure, and data processing terminalSHANGHAI TREE GRAPH BLOCKCHAIN RES INSTITUTE·Filed 2020·Granted May 31, 2022·2 cites·13 claims
- 1072US9258908B2Substrate structure having component-disposing area and manufacturing process thereofUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Feb 9, 2016·3 cites·5 claims
- 1172US2025040026A1Manufacturing method of package carrierUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1269US10314179B2Manufacturing method of circuit structureUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Jun 4, 2019·1 cites·13 claims
- 1368US10850115B2Systems and methods for medical treatment using a series of pulsed lasersGAUSS LASERS TECH SHANGHAI CO LTD·Filed 2018·Granted Dec 1, 2020·6 cites·30 claims
- 1465US10051748B2Circuit structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Aug 14, 2018·1 cites·6 claims
- 1563US9646852B2Manufacturing process for substrate structure having component-disposing areaUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted May 9, 2017·1 cites·4 claims
- 1659US12232254B2Printed circuit board and manufacturing method thereofUNIMICRON TECH CORPORATION·Filed 2022·Granted Feb 18, 2025·0 cites·10 claims
- 1758US12156325B2Package carrier with improved heat dissipation efficiency and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Nov 26, 2024·0 cites·8 claims
- 1855US9883598B2Circuit board and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Jan 30, 2018·0 cites·4 claims
- 1954US12426168B2Circuit board structure and method for forming the sameUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Sep 23, 2025·0 cites·5 claims
- 2054US10736215B1Multilayer circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Aug 4, 2020·0 cites·14 claims
- 2153US2016363974A1Circuit board and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2016·Application pending·0 cites
- 2252US12256488B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Mar 18, 2025·0 cites·17 claims
- 2352US12016133B2Circuit board with a conductive bump mounted on an adhesive layerUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Jun 18, 2024·0 cites·16 claims
- 2451US12144113B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Nov 12, 2024·0 cites·22 claims
- 2551US11910535B2Printed circuit board stack structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Feb 20, 2024·0 cites·6 claims
- 2648US12099522B2Method and system for reducing storage overhead of blockchain nodes, and storage mediumSHANGHAI TREE GRAPH BLOCKCHAIN INST·Filed 2023·Granted Sep 24, 2024·0 cites·8 claims
- 2747US2023178954A1Integrated optical ampilification systemsGAUSS LASERS TECH SHANGHAI CO LTD·Filed 2022·Application pending·0 cites
- 2847US2023173115A1Systems and methods for fluid or structure surface disinfection using deep uv picosecond laserGAUSS LASERS TECH SHANGHAI CO LTD·Filed 2022·Application pending·0 cites
- 2946US11545412B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Jan 3, 2023·0 cites·14 claims
- 3046US2020313319A1Led lighting deviceXIAMEN ECO LIGHTING CO LTD·Filed 2019·Application pending·0 cites
- 3144US2022240367A1Package structure having solder mask layer with low dielectric constant and method of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 3243US2009307292A1Dynamically changing a garbage collector in a managed runtime systemLI XIAOFENG·Filed 2006·Application pending·0 cites
- 3342US2015053462A1Wiring board structureUNIMICRON TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 3435US11507543B2Permissionless blockchain consensus method with adjusting block weight, system and P2P networkSHANGHAI TREE GRAPH BLOCKCHAIN RES INSTITUTE·Filed 2019·Granted Nov 22, 2022·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →