Inventor · disambiguated record
Ming-Tzong Yang
Also filed as: YANG MING · YANG MING T · YANG MING-TZONG
100 granted patents·16 pending applications·1,912 citations·filing 1991–2025
99Inventor score
Files withUNITED MICROELECTRONICS CORP62MEDIATEK INC36YANG MING-TZONG7CHANG TIEN-CHANG2LEE MING-CHENG2
Top patents by PatentIndex Score
116 records- 0196US9548289B2Semiconductor package assemblies with system-on-chip (SOC) packagesMEDIATEK INC·Filed 2015·Granted Jan 17, 2017·15 cites·22 claims
- 0294US5798298AMethod of automatically generating dummy metals for multilevel interconnectionUNITED MICROELECTRONICS CORP·Filed 1996·Granted Aug 25, 1998·177 cites·6 claims
- 0393US5438009AMethod of fabrication of MOSFET device with buried bit lineUNITED MICROELECTRONICS CORP·Filed 1993·Granted Aug 1, 1995·95 cites·14 claims
- 0492US5418176AProcess for producing memory devices having narrow buried N+ linesUNITED MICROELECTRONICS CORP·Filed 1994·Granted May 23, 1995·88 cites·17 claims
- 0591US9570399B2Semiconductor package assembly with through silicon via interconnectMEDIATEK INC·Filed 2015·Granted Feb 14, 2017·9 cites·18 claims
- 0691US7897995B2Lateral bipolar junction transistor with reduced base resistanceMEDIATEK INC·Filed 2009·Granted Mar 1, 2011·21 cites·17 claims
- 0790US5656840ASingle bit erase flash EEPROMUNITED MICROELECTRONICS CORP·Filed 1995·Granted Aug 12, 1997·63 cites·20 claims
- 0889US7671469B2SiGe device with SiGe-embedded dummy pattern for alleviating micro-loading effectMEDIATEK INC·Filed 2007·Granted Mar 2, 2010·16 cites·13 claims
- 0989US5180680AMethod of fabricating electrically erasable read only memory cellUNITED MICROELECTRONICS CORP·Filed 1991·Granted Jan 19, 1993·79 cites·15 claims
- 1088US5716884AProcess for fabricating a stacked capacitorUNITED MICROELECTRONICS CORP·Filed 1996·Granted Feb 10, 1998·57 cites·19 claims
- 1188US5439838AMethod of thinning for EEPROM tunneling oxide deviceUNITED MICROELECTRONICS CORP·Filed 1994·Granted Aug 8, 1995·52 cites·16 claims
- 1287US9640489B2Seal ring structure with capacitorMEDIATEK INC·Filed 2014·Granted May 2, 2017·7 cites·24 claims
- 1387US9257392B2Semiconductor package with through silicon via interconnectMEDIATEK INC·Filed 2013·Granted Feb 9, 2016·7 cites·11 claims
- 1486US9543232B2Semiconductor package structure and method for forming the sameMEDIATEK INC·Filed 2015·Granted Jan 10, 2017·4 cites·18 claims
- 1586US8810001B2Seal ring structure with capacitorHUNG CHENG-CHOU·Filed 2012·Granted Aug 19, 2014·9 cites·11 claims
- 1686US5698458AMultiple well device and process of manufactureUNITED MICROELECTRONICS CORP·Filed 1996·Granted Dec 16, 1997·67 cites·1 claims
- 1784US7932581B2Lateral bipolar junction transistorMEDIATEK INC·Filed 2009·Granted Apr 26, 2011·10 cites·22 claims
- 1884US5981404AMultilayer ONO structureUNITED MICROELECTRONICS CORP·Filed 1997·Granted Nov 9, 1999·88 cites·7 claims
- 1983US11587846B2Semiconductor device and method of forming the sameMEDIATEK INC·Filed 2020·Granted Feb 21, 2023·1 cites·20 claims
- 2083US9269664B2Semiconductor package with through silicon via interconnect and method for fabricating the sameMEDIATEK INC·Filed 2013·Granted Feb 23, 2016·6 cites·12 claims
- 2183US5604367ACompact EEPROM memory cell having a floating gate transistor with a multilayer gate electrodeUNITED MICROELECTRONICS CORP·Filed 1995·Granted Feb 18, 1997·43 cites·8 claims
- 2282US10361173B2Semiconductor package assemblies with system-on-chip (SOC) packagesMEDIATEK INC·Filed 2016·Granted Jul 23, 2019·3 cites·18 claims
- 2382US5354704ASymmetric SRAM cell with buried N+ local interconnection lineUNITED MICROELECTRONICS CORP·Filed 1993·Granted Oct 11, 1994·71 cites·20 claims
- 2480US6258692B1Method forming shallow trench isolationUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jul 10, 2001·60 cites·26 claims
- 2579US5258634AElectrically erasable read only memory cell array having elongated control gate in a trenchUNITED MICROELECTRONICS CORP·Filed 1992·Granted Nov 2, 1993·45 cites·7 claims
- 2678US5902752AActive layer mask with dummy patternUNITED MICROELECTRONICS CORP·Filed 1996·Granted May 11, 1999·53 cites·6 claims
- 2776US5516713AMethod of making high coupling ratio NAND type flash memoryUNITED MICROELECTRONICS CORP·Filed 1994·Granted May 14, 1996·33 cites·18 claims
- 2875US9679842B2Semiconductor package assemblyMEDIATEK INC·Filed 2015·Granted Jun 13, 2017·2 cites·17 claims
- 2975US8278733B2Bonding pad structure and integrated circuit chip using such bonding pad structureYANG MING-TZONG·Filed 2010·Granted Oct 2, 2012·4 cites·20 claims
- 3074US8860544B2Integrated inductorKO CHING-CHUNG·Filed 2009·Granted Oct 14, 2014·6 cites·8 claims
- 3173US12191226B2Method of manufacturing heat dissipation substrate with high thermal conductivity for semiconductor deviceMEDIATEK INC·Filed 2023·Granted Jan 7, 2025·0 cites·18 claims
- 3273US5541876AMemory cell fabricated by floating gate structureUNITED MICROELECTRONICS CORP·Filed 1994·Granted Jul 30, 1996·33 cites·8 claims
- 3373US5436186AProcess for fabricating a stacked capacitorUNITED MICROELECTRONICS CORP·Filed 1994·Granted Jul 25, 1995·27 cites·10 claims
- 3473US5393233AProcess for fabricating double poly high density buried bit line mask ROMUNITED MICROELECTRONICS CORP·Filed 1993·Granted Feb 28, 1995·26 cites·2 claims
- 3572US5380673ADram capacitor structureUNITED MICROELECTRONICS CORP·Filed 1994·Granted Jan 10, 1995·34 cites·18 claims
- 3672US5306657AProcess for forming an FET read only memory deviceUNITED MICROELECTRONICS CORP·Filed 1993·Granted Apr 26, 1994·26 cites·16 claims
- 3772US2025359403A1Package structureLEXTAR ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 3869US10727202B2Package structureMEDIATEK INC·Filed 2016·Granted Jul 28, 2020·1 cites·20 claims
- 3969US9190976B2Passive device cell and fabrication process thereofMEDIATEK INC·Filed 2013·Granted Nov 17, 2015·2 cites·16 claims
- 4069US5488004ASOI by large angle oxygen implantUNITED MICROELECTRONICS CORP·Filed 1994·Granted Jan 30, 1996·45 cites·26 claims
- 4169US5478678ADouble rim phase shifter maskUNITED MICROELECTRONICS CORP·Filed 1994·Granted Dec 26, 1995·21 cites·21 claims
- 4269US5429980AMethod of forming a stacked capacitor using sidewall spacers and local oxidationUNITED MICROELECTRONICS CORP·Filed 1994·Granted Jul 4, 1995·30 cites·22 claims
- 4368US5629220AMethod of manufacture of pull down transistor with drain off-set for low leakage SRAM'sUNITED MICROELECTRONICS CORP·Filed 1995·Granted May 13, 1997·24 cites·10 claims
- 4468US5436190AMethod for fabricating semiconductor device isolation using double oxide spacersUNITED MICROELECTRONICS CORP·Filed 1994·Granted Jul 25, 1995·39 cites·22 claims
- 4567US11348900B2Package structureMEDIATEK INC·Filed 2020·Granted May 31, 2022·0 cites·17 claims
- 4666US9870980B2Semiconductor package with through silicon via interconnectMEDIATEK INC·Filed 2015·Granted Jan 16, 2018·1 cites·6 claims
- 4766US7169668B2Method of manufacturing a split-gate flash memory deviceUNITED MICROELECTRONICS CORP·Filed 2005·Granted Jan 30, 2007·3 cites·20 claims
- 4865US9524948B2Package structureMEDIATEK INC·Filed 2013·Granted Dec 20, 2016·1 cites·12 claims
- 4965US5444411AFunctional MOS transistor with gate-level weighted sum and threshold operationsUNITED MICROELECTRONICS CORP·Filed 1994·Granted Aug 22, 1995·24 cites·10 claims
- 5064US8987851B2Radio-frequency device package and method for fabricating the sameMEDIATEK INC·Filed 2013·Granted Mar 24, 2015·1 cites·9 claims
Showing the top 50 of 116 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →