Inventor · disambiguated record

Ming-Shih Yeh

Also filed as: YEH MING-SHIH

63 granted patents·18 pending applications·258 citations·filing 2003–2025

98Inventor score

Technology areasH10W H10P H01L

Files withTAIWAN SEMICONDUCTOR MFG CO LTD66 TAIWAN SEMICONDUCTOR MFG4 SHIH CHIEN-HSUEH2 UNITED MICROELECTRONICS CORP2 YU CHEN-HUA2

Top patents by PatentIndex Score

81 records

0198US11482497B2Package structure including a first die and a second die and a bridge die and method of forming the package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 25, 2022·7 cites·20 claims
0298US10163803B1Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·42 cites·20 claims
0397US12033949B2Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 9, 2024·3 cites·20 claims
0497US11961800B2Via for semiconductor device connection and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 16, 2024·2 cites·20 claims
0597US11251071B2Raised via for terminal connections on different planesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
0696US12062602B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 13, 2024·3 cites·20 claims
0796US10879224B2Package structure, die and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·15 cites·20 claims
0896US10157852B2Multi-stacked package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 18, 2018·9 cites·20 claims
0995US11587900B2Package structure including IPD and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·3 cites·20 claims
1094US11854994B2Redistribution structure for integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
1193US11177142B2Method for dicing integrated fan-out packages without seal ringsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 16, 2021·10 cites·20 claims
1293US11133258B2Package with bridge die for interconnection and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 28, 2021·9 cites·19 claims
1393US10636775B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 28, 2020·6 cites·20 claims
1492US12159853B2Package structure including IPD and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 3, 2024·1 cites·20 claims
1592US11502032B2Chip package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 15, 2022·2 cites·20 claims
1692US10461036B2Multi-stacked package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 29, 2019·4 cites·20 claims
1790US11450612B2Semiconductor devices and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·2 cites·14 claims
1889US11075150B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 27, 2021·4 cites·18 claims
1989US7354856B2Method for forming dual damascene structures with tapered via portions and improved performanceTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Apr 8, 2008·15 cites·11 claims
2088US8432040B2Interconnection structure design for low RC delay and leakageYU CHEN-HUA·Filed 2006·Granted Apr 30, 2013·17 cites·8 claims
2188US8109407B2Apparatus for storing substratesHSIAO YI-LI·Filed 2007·Granted Feb 7, 2012·14 cites·21 claims
2288US7651943B2Forming diffusion barriers by annealing copper alloy layersTAIWAN SEMICONDCUTOR MFG COMPA·Filed 2008·Granted Jan 26, 2010·17 cites·19 claims
2387US12431417B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
2487US2025323133A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2586US11062978B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 13, 2021·3 cites·20 claims
2686US2024371840A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2785US12341104B2Methods of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
2885US12087745B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
2985US10529650B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 7, 2020·3 cites·20 claims
3085US10319683B2Multi-stacked package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 11, 2019·2 cites·20 claims
3185US10290610B2PoP device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·4 cites·20 claims
3285US8013445B2Low resistance high reliability contact via and metal line structure for semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Sep 6, 2011·12 cites·20 claims
3384US8193087B2Process for improving copper line cap formationSHIH CHIEN-HSUEH·Filed 2006·Granted Jun 5, 2012·10 cites·11 claims
3484US2025285981A1Semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3583US10622302B2Via for semiconductor device connection and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 14, 2020·2 cites·20 claims
3683US2024250020A1Via for semiconductor device connectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3782US8053865B2MOM capacitors integrated with air-gapsTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Nov 8, 2011·10 cites·15 claims
3882US2025309608A1Semiconductor Device and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3980US12211782B2Semiconductor package dielectric susbtrate including a trenchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
4080US2024387263A1Via for Component Electrode ConnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4180US2025125249A1Semiconductor package dielectric susbtrate including a trenchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4279US8623760B2Process for improving copper line cap formationSHIH CHIEN-HSUEH·Filed 2012·Granted Jan 7, 2014·4 cites·16 claims
4379US2025054894A1Package structure including ipd and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4478US2024332202A1Package structure with bridge die and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4577US11935836B2Semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 19, 2024·0 cites·20 claims
4677US11837587B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 5, 2023·0 cites·20 claims
4777US10297494B2Raised via for terminal connections on different planesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 21, 2019·2 cites·20 claims
4877US8106512B2Low resistance high reliability contact via and metal line structure for semiconductor deviceLEE HSIANG-HUAN·Filed 2010·Granted Jan 31, 2012·5 cites·20 claims
4975US12142524B2Via for component electrode connectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
5075US10867928B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·2 cites·13 claims

Showing the top 50 of 81 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →