Inventor · disambiguated record
Ming-Chih Yew
Also filed as: YEW M · YEW MING-CHIH
121 granted patents·75 pending applications·570 citations·filing 1975–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD176GEN MOTORS CORP7TAIWAN SEMICONDUCTOR MFG5YEW MING-CHIH3ADVANCED CHIP ENG TECH INC2
Top patents by PatentIndex Score
196 records- 0198US11749644B2Semiconductor device with curved conductive lines and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·5 cites·20 claims
- 0298US11557559B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 17, 2023·5 cites·20 claims
- 0398US11264359B2Chip bonded to a redistribution structure with curved conductive linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·10 cites·20 claims
- 0498US8941248B2Semiconductor device package and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 27, 2015·70 cites·20 claims
- 0597US11610854B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 21, 2023·4 cites·20 claims
- 0697US11393746B2Reinforcing package using reinforcing patchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 19, 2022·4 cites·20 claims
- 0796US12040267B2Organic interposer including intra-die structural reinforcement structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 16, 2024·2 cites·20 claims
- 0896US9653391B1Semiconductor packaging structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 16, 2017·23 cites·20 claims
- 0995US11600575B2Method for forming chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 7, 2023·2 cites·20 claims
- 1095US11282756B2Organic interposer including stress-resistant bonding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·3 cites·20 claims
- 1195US10276548B2Semiconductor packages having dummy connectors and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·11 cites·20 claims
- 1295US8624392B2Electrical connection for chip scale packagingYEW MING-CHIH·Filed 2011·Granted Jan 7, 2014·34 cites·20 claims
- 1395US4377298AVehicle wheel suspensionGEN MOTORS CORP·Filed 1981·Granted Mar 22, 1983·87 cites·4 claims
- 1494US12261102B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 25, 2025·2 cites·16 claims
- 1594US11908757B2Die corner removal for molding compound crack suppression in semiconductor die packaging and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·2 cites·20 claims
- 1694US11699668B2Semiconductor device package having warpage control and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 11, 2023·2 cites·20 claims
- 1794US11594477B2Semiconductor package and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·2 cites·20 claims
- 1893US11830800B2Metallization structure and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·2 cites·20 claims
- 1993US11164754B2Fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·9 cites·20 claims
- 2093US2025357432A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2192US10510734B2Semiconductor packages having dummy connectors and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·5 cites·20 claims
- 2291US11610835B2Organic interposer including intra-die structural reinforcement structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 21, 2023·2 cites·20 claims
- 2391US10685920B2Semiconductor device package with warpage control structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 16, 2020·5 cites·20 claims
- 2491US9721868B2Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 1, 2017·9 cites·20 claims
- 2591US9583474B2Package on packaging structure and methods of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 28, 2017·7 cites·20 claims
- 2691US8901732B2Semiconductor device package and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 2, 2014·12 cites·20 claims
- 2790US10971461B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 6, 2021·5 cites·20 claims
- 2889US9831190B2Semiconductor device package with warpage control structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 28, 2017·7 cites·20 claims
- 2989US9502323B2Method of forming encapsulated semiconductor device packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 22, 2016·6 cites·20 claims
- 3089US8847369B2Packaging structures and methods for semiconductor devicesYEW MING-CHIH·Filed 2012·Granted Sep 30, 2014·12 cites·20 claims
- 3189US2025364346A1Chip package structure with multiple gap-filling layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3288US10867976B2Semiconductor packages having dummy connectors and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·3 cites·20 claims
- 3388US9780076B2Package-on-package structure with through molding viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 3, 2017·4 cites·20 claims
- 3487US9237647B2Package-on-package structure with through molding viaTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 12, 2016·6 cites·20 claims
- 3587US2025364436A1Methods of forming a semiconductor package including stress buffersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3687US2024387472A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3787US2025357368A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3886US12040285B2Structure and formation method of chip package with reinforcing structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 16, 2024·1 cites·20 claims
- 3986US12014969B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·1 cites·20 claims
- 4086US11742322B2Integrated fan-out package having stress release structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·1 cites·20 claims
- 4185US12412851B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·20 claims
- 4285US12347764B2Organic interposer including intra-die structural reinforcement structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 4385US2025343179A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4485US2025293143A1Organic interposer including intra-die structural reinforcement structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4584US12444696B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 4684US12362256B2Method for forming semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 4784US12132021B2Method for fabricating semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 4884US11652037B2Semiconductor package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 16, 2023·1 cites·20 claims
- 4984US11270953B2Structure and formation method of chip package with shielding structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 8, 2022·3 cites·20 claims
- 5084US9748156B1Semiconductor package assembly, semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 29, 2017·4 cites·20 claims
Showing the top 50 of 196 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →