Inventor · disambiguated record
Motomu Degai
Also filed as: DEGAI MOTOMU
22 granted patents·15 pending applications·10 citations·filing 2015–2025
90Inventor score
Top patents by PatentIndex Score
37 records- 0196US11417518B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 0294US11923193B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Mar 5, 2024·3 cites·22 claims
- 0386US12400874B2Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Aug 26, 2025·0 cites·23 claims
- 0486US11923191B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Mar 5, 2024·1 cites·20 claims
- 0585US2025285878A1Apparatus for etching baseKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0683US2025336670A1Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0782US12278103B2Method of processing substrate and method of manufacturing semiconductor device by forming filmKOKUSAI ELECTRIC CORP·Filed 2023·Granted Apr 15, 2025·0 cites·22 claims
- 0881US12374544B2Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 0980US11562905B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jan 24, 2023·1 cites·16 claims
- 1080US11335554B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted May 17, 2022·1 cites·18 claims
- 1178US11894239B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Feb 6, 2024·0 cites·21 claims
- 1276US2025069891A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1375US2025246427A1Processing apparatus, processing method, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1473US12381091B2Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Granted Aug 5, 2025·0 cites·21 claims
- 1573US11315800B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Apr 26, 2022·0 cites·19 claims
- 1672US12033852B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jul 9, 2024·0 cites·20 claims
- 1771US11848203B2Methods of processing substrate and manufacturing semiconductor device by forming film, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Dec 19, 2023·0 cites·24 claims
- 1870US2025218764A1Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1967US12176216B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Dec 24, 2024·0 cites·8 claims
- 2067US11699593B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jul 11, 2023·0 cites·20 claims
- 2166US12283476B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Apr 22, 2025·0 cites·22 claims
- 2262US2025011925A1Substrate processing apparatus, processing vessel, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2359US2025104998A1Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2456US2023411165A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2556US2024105448A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing system, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2653US2019304791A1Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-transitory Computer-readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 2750US11152215B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Oct 19, 2021·0 cites·7 claims
- 2849US2022005685A1Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 2948US11705326B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Jul 18, 2023·0 cites·18 claims
- 3047US2021305043A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 3147US2021098258A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 3244US10355098B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 16, 2019·0 cites·16 claims
- 3342US11004676B2Method for manufacturing semiconductor device, non-transitory computer-readable recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2018·Granted May 11, 2021·0 cites·5 claims
- 3441US2019304797A1Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 3540US9984887B2Method of manufacturing a semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted May 29, 2018·0 cites·10 claims
- 3640US9368358B2Method of manufacturing a semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2015·Granted Jun 14, 2016·0 cites·11 claims
- 3734US2016293421A1Method of manufacturing semiconductor device and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →