Inventor · disambiguated record
Mohit K. Haran
Also filed as: HARAN MOHIT · HARAN MOHIT K
28 granted patents·32 pending applications·18 citations·filing 2015–2025
93Inventor score
Top patents by PatentIndex Score
60 records- 0190US10319625B2Metal via processing schemes with via critical dimension (CD) control for back end of line (BEOL) interconnects and the resulting structuresINTEL CORP·Filed 2015·Granted Jun 11, 2019·7 cites·20 claims
- 0286US11393754B2Contact over active gate structures with etch stop layers for advanced integrated circuit structure fabricationINTEL CORP·Filed 2018·Granted Jul 19, 2022·3 cites·8 claims
- 0386US11145541B2Conductive via and metal line end fabrication and structures resulting therefromINTEL CORP·Filed 2017·Granted Oct 12, 2021·5 cites·18 claims
- 0483US2025331300A1Integrated circuit structures having cut metal gatesINTEL CORP·Filed 2025·Application pending·0 cites
- 0582US12261122B2Contact over active gate structures with etch stop layers for advanced integrated circuit structure fabricationINTEL CORP·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 0681US2024347465A1Contact over active gate structures with etch stop layers for advanced integrated circuit structure fabricationINTEL CORP·Filed 2024·Application pending·0 cites
- 0781US2025133821A1Integrated circuit structures having cut metal gatesINTEL CORP·Filed 2024·Application pending·0 cites
- 0879US2024347539A1Integrated circuit structures having cut metal gatesINTEL CORP·Filed 2024·Application pending·0 cites
- 0977US12406931B2Contact over active gate structures with etch stop layers for advanced integrated circuit structure fabricationINTEL CORP·Filed 2022·Granted Sep 2, 2025·0 cites·21 claims
- 1076US11664274B2Method to repair edge placement errors in a semiconductor deviceINTEL CORP·Filed 2019·Granted May 30, 2023·2 cites·5 claims
- 1175US12369392B2Fabrication of gate-all-around integrated circuit structures having pre-spacer deposition cut gatesINTEL CORP·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 1275US2025046713A1Self-aligned patterning with colored blocking and structures resulting therefromINTEL CORP·Filed 2024·Application pending·0 cites
- 1373US12080639B2Contact over active gate structures with metal oxide layers to inhibit shortingINTEL CORP·Filed 2019·Granted Sep 3, 2024·1 cites·17 claims
- 1473US2024249946A1Gate spacing in integrated circuit structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 1572US11972979B21D vertical edge blocking (VEB) via and plugINTEL CORP·Filed 2023·Granted Apr 30, 2024·0 cites·22 claims
- 1671US2025227988A1Integrated circuit structures having dielectric gate wall and dielectric gate plugINTEL CORP·Filed 2025·Application pending·0 cites
- 1770US2024154037A1Integrated circuit structures having dielectric anchor and confined epitaxial source or drain structureINTEL CORP·Filed 2023·Application pending·0 cites
- 1869US12308284B2Plug and trench architectures for integrated circuits and methods of manufactureINTEL CORP·Filed 2021·Granted May 20, 2025·0 cites·19 claims
- 1969US2022392898A1Integrated circuit structures having cut metal gatesINTEL CORP·Filed 2021·Application pending·0 cites
- 2067US12469780B2Integrated circuit structure with recessed self-aligned deep boundary viaINTEL CORP·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 2166US12002678B2Gate spacing in integrated circuit structuresINTEL CORP·Filed 2020·Granted Jun 4, 2024·0 cites·20 claims
- 2266US2023197854A1Integrated circuit structures having dielectric anchor and confined epitaxial source or drain structureINTEL CORP·Filed 2021·Application pending·0 cites
- 2364US12400913B2Contact over active gate structures with conductive trench contact taps for advanced integrated circuit structure fabricationINTEL CORP·Filed 2021·Granted Aug 26, 2025·0 cites·20 claims
- 2463US12471330B2Integrated circuit structures having maximized channel sizingINTEL CORP·Filed 2021·Granted Nov 11, 2025·0 cites·20 claims
- 2561US11990472B2Fabrication of gate-all-around integrated circuit structures having pre-spacer deposition cut gatesINTEL CORP·Filed 2020·Granted May 21, 2024·0 cites·11 claims
- 2660US2023093657A1Integrated circuit structures having dielectric gate wall and dielectric gate plugINTEL CORP·Filed 2021·Application pending·0 cites
- 2759US11652045B2Via contact patterning method to increase edge placement error marginINTEL CORP·Filed 2021·Granted May 16, 2023·0 cites·20 claims
- 2858US12419085B2Integrated circuit structures having backside gate tie-downINTEL CORP·Filed 2022·Granted Sep 16, 2025·0 cites·20 claims
- 2958US12154855B2Self-aligned patterning with colored blocking and structures resulting therefromINTEL CORP·Filed 2019·Granted Nov 26, 2024·0 cites·16 claims
- 3058US2023187515A1Integrated circuit structures having versatile channel placementYEMENICIOGLU SUKRU·Filed 2021·Application pending·0 cites
- 3157US10636700B2Metal via processing schemes with via critical dimension (CD) control for back end of line (BEOL) interconnects and the resulting structuresINTEL CORP·Filed 2019·Granted Apr 28, 2020·0 cites·20 claims
- 3257US2022399333A1Integrated circuit structures having metal gates with reduced aspect ratio cutsINTEL CORP·Filed 2021·Application pending·0 cites
- 3355US11721580B21D vertical edge blocking (VEB) via and plugINTEL CORP·Filed 2019·Granted Aug 8, 2023·0 cites·11 claims
- 3455US2022406778A1Integrated circuit structures having plugged metal gatesINTEL CORP·Filed 2021·Application pending·0 cites
- 3554US2024213250A1Self-aligned backbone for forksheet transistorsINTEL CORP·Filed 2022·Application pending·0 cites
- 3653US12237223B2Contact over active gate structures using directed self-assembly for advanced integrated circuit structure fabricationINTEL CORP·Filed 2020·Granted Feb 25, 2025·0 cites·20 claims
- 3753US12237388B2Transistor arrangements with stacked trench contacts and gate strapsINTEL CORP·Filed 2020·Granted Feb 25, 2025·0 cites·20 claims
- 3853US2024113019A1Split via structures coupled to conductive lines for advanced integrated circuit structure fabricationINTEL CORP·Filed 2022·Application pending·0 cites
- 3952US12199161B2Contact over active gate structures with tapered gate or trench contact for advanced integrated circuit structure fabricationINTEL CORP·Filed 2020·Granted Jan 14, 2025·0 cites·20 claims
- 4052US11211324B2Via contact patterning method to increase edge placement error marginINTEL CORP·Filed 2019·Granted Dec 28, 2021·0 cites·20 claims
- 4151US11171043B2Plug and trench architectures for integrated circuits and methods of manufactureINTEL CORP·Filed 2016·Granted Nov 9, 2021·0 cites·13 claims
- 4251US2023207466A1Recessed and self-aligned buried power railGULER LEONARD P·Filed 2021·Application pending·0 cites
- 4350US12506075B2Epitaxial source/drain back-side device contact structures with wrap around metallization and protective conformal linerINTEL CORP·Filed 2021·Granted Dec 23, 2025·0 cites·19 claims
- 4450US12382721B2Integrated circuit structures having cut metal gates with dielectric spacer fillINTEL CORP·Filed 2021·Granted Aug 5, 2025·0 cites·18 claims
- 4550US2023187441A1Integrated circuit structures with trench contact flyover structureINTEL CORP·Filed 2021·Application pending·0 cites
- 4650US2024113177A1Stacked source or drain contact flyoverINTEL CORP·Filed 2022·Application pending·0 cites
- 4750US2023320057A1Recessed transistor terminal via jumpersINTEL CORP·Filed 2022·Application pending·0 cites
- 4849US2023207623A1Epi barrier aligned backside contactINTEL CORP·Filed 2021·Application pending·0 cites
- 4949US2023084182A1Selective depopulation of gate-all-around semiconductor devicesINTEL CORP·Filed 2021·Application pending·0 cites
- 5049US2022393007A1Narrow conductive structures for gate contact or trench contactINTEL CORP·Filed 2021·Application pending·0 cites
Showing the top 50 of 60 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →