Inventor · disambiguated record
Mohd Afiz Hashim
Also filed as: HASHIM MOHD AFIZ
3 granted patents·0 citations·filing 2021–2023
45Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG3
Top patents by PatentIndex Score
3 records- 0170US12205874B2Semiconductor package with wire bond jointsINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 0260US11842953B2Semiconductor package with wire bond joints and related methods of manufacturingINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 12, 2023·0 cites·18 claims
- 0349US12512435B2Semiconductor package having a solder wetting structureINFINEON TECHNOLOGIES AG·Filed 2023·Granted Dec 30, 2025·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →