Inventor · disambiguated record
Mohamed R. Saber
Also filed as: SABER MOHAMED R
0 granted patents·11 pending applications·0 citations·filing 2023–2024
Technology areasH10W
Files withINTEL CORP11
Top patents by PatentIndex Score
11 records- 0160US2025112144A1Integrated circuit packages including a substrate having thermal isomeric moieties and non-thermal isomeric moietiesINTEL CORP·Filed 2023·Application pending·0 cites
- 0259US2025210491A1Vertically embedded utility patch for semiconductor packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 0358US2025266395A1Multi-die bridge assemblies and methods for three-dimensional packagingINTEL CORP·Filed 2024·Application pending·0 cites
- 0457US2025089156A1Low stress through glass vias (tgvs)INTEL CORP·Filed 2023·Application pending·0 cites
- 0557US2025273582A1Interconnections to package substrates for interconnect bridgesINTEL CORP·Filed 2024·Application pending·0 cites
- 0656US2025219021A1Vertically embedded components in package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0755US2025183179A1Passive structures in embedded bridge architecturesINTEL CORP·Filed 2023·Application pending·0 cites
- 0854US2025219040A1Technologies for Components Embedded in a Substrate CoreINTEL CORP·Filed 2023·Application pending·0 cites
- 0954US2025309148A1Substrate with component embedded in a blind cavityINTEL CORP·Filed 2024·Application pending·0 cites
- 1051US2025112175A1Microelectronic assemblies with edge stress reduction in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1149US2025096052A1Localized thermal healing and doping of glass cores for microelectronic assembliesINTEL CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →