Inventor · disambiguated record
Motoaki Tani
Also filed as: TANI MOTOAKI
28 granted patents·4 pending applications·401 citations·filing 1989–2017
97Inventor score
Top patents by PatentIndex Score
32 records- 0197US7224046B2Multilayer wiring board incorporating carbon fibers and glass fibersFUJITSU LTD·Filed 2005·Granted May 29, 2007·60 cites·10 claims
- 0293US7002080B2Multilayer wiring boardFUJITSU LTD·Filed 2003·Granted Feb 21, 2006·69 cites·9 claims
- 0391US6869665B2Wiring board with core layer containing inorganic fillerFUJITSU LTD·Filed 2003·Granted Mar 22, 2005·64 cites·12 claims
- 0489US7640660B2Method for manufacturing multilayer wiring board incorporating carbon fibers and glass fibersFUJITSU LTD·Filed 2007·Granted Jan 5, 2010·16 cites·3 claims
- 0584US7388157B2Printed wiring boardFUJITSU LTD·Filed 2005·Granted Jun 17, 2008·13 cites·10 claims
- 0683US7400035B2Semiconductor device having multilayer printed wiring boardFUJITSU LTD·Filed 2004·Granted Jul 15, 2008·29 cites·8 claims
- 0776US8866312B2Semiconductor apparatus, method for manufacturing the same and electric deviceTANI MOTOAKI·Filed 2012·Granted Oct 21, 2014·4 cites·13 claims
- 0876US7246435B2Wiring board and method for fabricating the sameFUJITSU LTD·Filed 2005·Granted Jul 24, 2007·5 cites·10 claims
- 0973US7420130B2Wiring board and method for fabricating the sameFUJITSU LTD·Filed 2007·Granted Sep 2, 2008·4 cites·7 claims
- 1071US6846549B2Multilayer printed wiring boardFUJITSU LTD·Filed 2001·Granted Jan 25, 2005·14 cites·15 claims
- 1169US9318426B2Semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2013·Granted Apr 19, 2016·2 cites·10 claims
- 1268US9312151B2Method of manufacturing semiconductor device and method of manufacturing electronic device including an adhesive layer on a support memberFUJITSU LTD·Filed 2013·Granted Apr 12, 2016·2 cites·14 claims
- 1368US9136172B2Method of manufacturing semiconductor device and method of manufacturing electronic assemblyFUJITSU LTD·Filed 2013·Granted Sep 15, 2015·2 cites·14 claims
- 1468US7017265B2Method for manufacturing multilayer wiring board, and multilayer wiring board manufactured therebyFUJITSU LTD·Filed 2002·Granted Mar 28, 2006·12 cites·18 claims
- 1565US8318599B2Resin layer formation method and semiconductor device fabrication methodNAKAGAWA KANAE·Filed 2006·Granted Nov 27, 2012·5 cites·16 claims
- 1664US9177938B2Method for manufacturing semiconductor apparatusFUJITSU LTD·Filed 2014·Granted Nov 3, 2015·1 cites·11 claims
- 1761US9214361B2Semiconductor device manufacturing method and electronic device manufacturing methodFUJITSU LTD·Filed 2013·Granted Dec 15, 2015·1 cites·5 claims
- 1860US8420444B2Semiconductor device and method of manufacturing the sameTANI MOTOAKI·Filed 2011·Granted Apr 16, 2013·1 cites·10 claims
- 1955US5308929AVia hole structure and process for formation thereofFUJITSU LTD·Filed 1992·Granted May 3, 1994·26 cites·18 claims
- 2055US5154994AMethod of and apparatus for forming volume type phase hologramFUJITSU LTD·Filed 1989·Granted Oct 13, 1992·12 cites·18 claims
- 2153US5362359ACircuit board and process for producing sameFUJITSU LTD·Filed 1993·Granted Nov 8, 1994·14 cites·19 claims
- 2251US2015189751A1Wiring board, method for fabricating the same, and electronic apparatusFUJITSU LTD·Filed 2014·Application pending·0 cites
- 2351US2009218118A1Board and manufacturing method for the sameFUJITSU LTD·Filed 2009·Application pending·0 cites
- 2450US7799604B2Semiconductor device having multilayer printed wiring board and manufacturing method of the sameFUJITSU LTD·Filed 2007·Granted Sep 21, 2010·0 cites·7 claims
- 2550US6045975APhotosensitive, heat-resistant resin composition for forming patternsFUJITSU LTD·Filed 1993·Granted Apr 4, 2000·13 cites·2 claims
- 2650US6013419AProcess for using photosensitive, heat-resistant resin composition to form patternsFUJITSU LTD·Filed 1995·Granted Jan 11, 2000·11 cites·3 claims
- 2745US2012085730A1Method of manufacturing wiring boardSASAKI SHINYA·Filed 2011·Application pending·0 cites
- 2841US5236772ACircuit board and process for producing sameFUJITSU LTD·Filed 1991·Granted Aug 17, 1993·7 cites·13 claims
- 2939US5231440AMethod of and apparatus for forming volume type phase hologramFUJITSU LTD·Filed 1992·Granted Jul 27, 1993·7 cites·6 claims
- 3038US2017243808A1Joined body and manufacturing method thereof, and cooling device and electronic equipment using cooling deviceFUJITSU LTD·Filed 2017·Application pending·0 cites
- 3137US5972562AVisible radiation-curable solder resist compositions, and method for forming solder resist patternsFUJITSU LTD·Filed 1997·Granted Oct 26, 1999·6 cites·11 claims
- 3230US6261741B1Photosensitive heat-resistant resin composition, method of patterning insulating film made of the same, and patterned insulating film obtained therebyFUJITSU LTD·Filed 1998·Granted Jul 17, 2001·1 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →