Method of manufacturing wiring board

Abstract

A method for manufacturing a wiring board, includes: forming an insulating resin layer on a conductive layer; forming a metal chloride or a metal sulfate on the insulating resin layer; forming a protective layer on the metal chloride or the metal sulfate; forming an exposed portion in the insulating resin layer, the metal chloride or the metal sulfate, and the protective layer so as to at least partially expose the conductive layer; removing residues in the exposed portion; removing the protective layer; and forming a wiring on the insulating resin layer in which the protective layer has been removed.

1 . A method of manufacturing a wiring board, comprising:
 forming an insulating resin layer on a conductive layer;   forming a metal chloride or a metal sulfate on the insulating resin layer;   forming a protective layer on the metal chloride or the metal sulfate;   forming an exposed portion in the insulating resin layer, the metal chloride or the metal sulfate, and the protective layer so as to at least partially expose the conductive layer;   removing residues in the exposed portion;   removing the protective layer; and   forming a wiring on the insulating resin layer in which the protective layer has been removed.   
     
     
         2 . The method according to  claim 1 ,
 wherein the metal chloride or the metal sulfate includes tin or palladium.   
     
     
         3 . The method according to  claim 1 , further comprising:
 forming an adhesion layer between the insulating resin layer and the metal chloride or between the insulating resin layer and the metal sulfate.   
     
     
         4 . The method according to  claim 1 ,
 wherein the separating layer includes at least one metal layer including at least one metal selected from the group consisting of zinc, nickel, cobalt and chromium.   
     
     
         5 . The method according to  claim 1 ,
 wherein the adhesion layer includes at least one compound layer including at least one compound selected from the group consisting of triazinethiol, a silane coupling agent, nitrobenzoic acid, and mercaptosulfonic acid.   
     
     
         6 . The method according to  claim 1 ,
 wherein the protective layer includes an acrylic resin.   
     
     
         7 . The method according to  claim 1 ,
 wherein the insulating resin layer includes an epoxy resin.   
     
     
         8 . The method according to  claim 1 ,
 wherein dry etching is performed in an atmosphere including CF 4  or SF 6 .   
     
     
         9 . The method according to  claim 1 ,
 wherein wet etching is performed with a liquid including permanganate.   
     
     
         10 . The method according to  claim 1 ,
 wherein the conductive layer includes copper.   
     
     
         11 . The method according to  claim 1 ,
 wherein the protective layer is immersed in a separation liquid.   
     
     
         12 . The method according to  claim 11 ,
 wherein the insulating resin layer is insoluble in the separation liquid,   the metal chloride or the metal sulfate is insoluble in the separation liquid, and   the protective layer is soluble in the separation liquid.   
     
     
         13 . The method according to  claim 1 ,
 wherein the metal chloride or the metal sulfate is immersed in a separation liquid.   
     
     
         14 . The method according to  claim 13 ,
 wherein the insulating resin layer is insoluble in the separation liquid, and   the metal chloride or the metal sulfate is soluble in the separation liquid.