Inventor · disambiguated record
Munehisa Kodama
Also filed as: KODAMA MUNEHISA
8 granted patents·8 pending applications·6 citations·filing 2018–2024
75Inventor score
Technology areasH10P
Files withTOKYO ELECTRON LTD16
Top patents by PatentIndex Score
16 records- 0180US11120985B2Substrate transfer device, substrate processing system, substrate processing method and computer-readable recording mediumTOKYO ELECTRON LTD·Filed 2018·Granted Sep 14, 2021·4 cites·7 claims
- 0270US11417543B2Bonding apparatus and bonding methodTOKYO ELECTRON LTD·Filed 2019·Granted Aug 16, 2022·1 cites·7 claims
- 0370US2024379370A1Substrate processing methodTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0467US11817337B2Substrate processing system and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Nov 14, 2023·1 cites·20 claims
- 0556US12142483B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Nov 12, 2024·0 cites·19 claims
- 0649US2024017375A1Substrate processing system and substrate processing methodTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 0748US12191153B2Substrate processing apparatus, substrate processing system and substrate processing methodTOKYO ELECTRON LTD·Filed 2020·Granted Jan 7, 2025·0 cites·18 claims
- 0846US2023105522A1Removing apparatusTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 0944US2023364740A1Grinding apparatusTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 1043US10833045B2Substrate processing apparatus and manufacturing method of substrate holding unitTOKYO ELECTRON LTD·Filed 2018·Granted Nov 10, 2020·0 cites·5 claims
- 1142US11929268B2Substrate processing system, substrate processing method and computer-readable recording mediumTOKYO ELECTRON LTD·Filed 2019·Granted Mar 12, 2024·0 cites·16 claims
- 1242US2023086738A1Bonding apparatus and bonding methodTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 1341US11858092B2Substrate processing system, substrate processing method and computer-readable recording mediumTOKYO ELECTRON LTD·Filed 2018·Granted Jan 2, 2024·0 cites·19 claims
- 1440US2022234160A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2020·Application pending·0 cites
- 1538US2020234961A1Substrate processing methodTOKYO ELECTRON LTD·Filed 2018·Application pending·0 cites
- 1637US2020130124A1Grinding apparatus, grinding method and computer-readable recording mediumTOKYO ELECTRON LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →