Inventor · disambiguated record
Mu Hwan Seo
Also filed as: SEO MU HWAN
6 granted patents·1 pending application·184 citations·filing 2000–2007
86Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0193US7321162B1Semiconductor package having reduced thicknessAMKOR TECHNOLOGY INC·Filed 2006·Granted Jan 22, 2008·31 cites·20 claims
- 0289US6525406B1Semiconductor device having increased moisture path and increased solder joint strengthAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 25, 2003·69 cites·43 claims
- 0386US6696747B1Semiconductor package having reduced thicknessAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 24, 2004·39 cites·20 claims
- 0475US6475827B1Method for making a semiconductor package having improved defect testing and increased production yieldAMKOR TECHNOLOGY INC·Filed 2000·Granted Nov 5, 2002·25 cites·20 claims
- 0567US7102208B1Leadframe and semiconductor package with improved solder joint strengthAMKOR TECHNOLOGY INC·Filed 2000·Granted Sep 5, 2006·15 cites·19 claims
- 0655US7115445B2Semiconductor package having reduced thicknessAMKOR TECHNOLOGY INC·Filed 2004·Granted Oct 3, 2006·5 cites·20 claims
- 0751US2008283979A1Semiconductor Package Having Reduced ThicknessLEE TAE HEON·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Mu Hwan Seo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →