Inventor · disambiguated record
Mun Hoong Tai
Also filed as: TAI MUN HOONG
7 granted patents·1 pending application·30 citations·filing 2007–2022
80Inventor score
Files withHEWLETT PACKARD ENTPR DEV LP3GOLDSTEIN MARTIN2TAI MUN HOONG2HEWLETT PACKARD DEVELOPMENT CO1
Top patents by PatentIndex Score
8 records- 0181US11700712B2Floating heat sink for use with a thermal interface materialHEWLETT PACKARD ENTPR DEV LP·Filed 2021·Granted Jul 11, 2023·1 cites·17 claims
- 0279US8509960B2Providing cooling to a computer system via a pedestal having a cooling fanTAI MUN HOONG·Filed 2009·Granted Aug 13, 2013·14 cites·11 claims
- 0377US8102671B2Serial connection external interface riser cards avoidance of abutment of parallel connection external interface memory modulesGOLDSTEIN MARTIN·Filed 2007·Granted Jan 24, 2012·7 cites·15 claims
- 0470US9148974B2Serial connection riser cards including parallel connection memory modulesGOLDSTEIN MARTIN·Filed 2011·Granted Sep 29, 2015·3 cites·15 claims
- 0570US8301316B2System and method for orienting a baffle proximate an array of fans that cool electronic componentsTAI MUN HOONG·Filed 2010·Granted Oct 30, 2012·5 cites·8 claims
- 0655US11855381B2Chassis having an insertion key assembly for a pluggable moduleHEWLETT PACKARD ENTPR DEV LP·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 0750US2015373855A1Serial connection external interface riser cards avoidance of abutment of parallel connection external interface memory modulesHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Application pending·0 cites
- 0848US11960268B2Power allocation to heat a processing chip of a network deviceHEWLETT PACKARD ENTPR DEV LP·Filed 2021·Granted Apr 16, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →