Inventor · disambiguated record
Myung Kil Lee
Also filed as: LEE MYUNG KIL
7 granted patents·2 pending applications·22 citations·filing 2005–2011
80Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0180US7279785B2Stacked die package systemSTATS CHIPPAC LTD·Filed 2005·Granted Oct 9, 2007·9 cites·16 claims
- 0273US7674640B2Stacked die package systemSTATS CHIPPAC LTD·Filed 2007·Granted Mar 9, 2010·5 cites·14 claims
- 0364US8089143B2Integrated circuit package system using interposerLEE MYUNG KIL·Filed 2005·Granted Jan 3, 2012·5 cites·20 claims
- 0457US8026582B2Integrated circuit package system with internal stacking module adhesiveSTATS CHIPPAC LTD·Filed 2008·Granted Sep 27, 2011·1 cites·20 claims
- 0556US8816487B2Integrated circuit packaging system with package-in-package and method of manufacture thereofBAE HYUNIL·Filed 2009·Granted Aug 26, 2014·2 cites·16 claims
- 0647US7947535B2Thin package system with external terminalsSTATS CHIPPAC LTD·Filed 2005·Granted May 24, 2011·0 cites·10 claims
- 0741US8481371B2Thin package system with external terminals and method of manufacture thereofKIM YOUNGCHEOL·Filed 2011·Granted Jul 9, 2013·0 cites·20 claims
- 0840US2007109750A1Integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Application pending·0 cites
- 0939US2007268660A1Spacerless semiconductor package chip stacking systemSTATS CHIPPAC LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →