Inventor · disambiguated record
My N. Nguyen
Also filed as: NGUYEN MY · NGUYEN MY N · NGUYEN MY NHU
41 granted patents·9 pending applications·1,006 citations·filing 1988–2019
98Inventor score
Top patents by PatentIndex Score
50 records- 0195US7244491B2Thermal interface materialsHONEYWELL INT INC·Filed 2005·Granted Jul 17, 2007·29 cites·23 claims
- 0293US5989459ACompliant and crosslinkable thermal interface materialsJOHNSON MATTHEY INC·Filed 1999·Granted Nov 23, 1999·84 cites·25 claims
- 0392US8835574B2Adhesive compositions for use in die attach applicationsHENKEL CORP·Filed 2012·Granted Sep 16, 2014·12 cites·3 claims
- 0491US6673434B2Thermal interface materialsHONEYWELL INT INC·Filed 2002·Granted Jan 6, 2004·52 cites·33 claims
- 0591US6451422B1Thermal interface materialsJOHNSON MATTHEY INC·Filed 1999·Granted Sep 17, 2002·109 cites·23 claims
- 0690US6605238B2Compliant and crosslinkable thermal interface materialsHONEYWELL INT INC·Filed 2001·Granted Aug 12, 2003·55 cites·22 claims
- 0789US7867609B2Thermal interface materialsHONEYWELL INT INC·Filed 2007·Granted Jan 11, 2011·14 cites·17 claims
- 0889US6706219B2Interface materials and methods of production and use thereofHONEYWELL INT INC·Filed 2001·Granted Mar 16, 2004·43 cites·35 claims
- 0989US6238596B1Compliant and crosslinkable thermal interface materialsJOHNSON MATTHEY ELECT INC·Filed 1999·Granted May 29, 2001·69 cites·4 claims
- 1085US6908669B2Thermal interface materialsHONEYWELL INT INC·Filed 2003·Granted Jun 21, 2005·26 cites·27 claims
- 1185US6797382B2Thermal interface materialsHONEYWELL INT INC·Filed 2002·Granted Sep 28, 2004·45 cites·38 claims
- 1283US7172711B2Interface materials and methods of production and use thereofHONEYWELL INT INC·Filed 2004·Granted Feb 6, 2007·26 cites·22 claims
- 1383US6811725B2Compliant and crosslinkable thermal interface materialsHONEYWELL INT INC·Filed 2003·Granted Nov 2, 2004·31 cites·22 claims
- 1479US5183784ASilver-glass pastesJOHNSON MATTHEY INC·Filed 1991·Granted Feb 2, 1993·65 cites·9 claims
- 1578US9209104B2Electronic devices assembled with thermally insulating layersHenkel IP & Holding GmbH·Filed 2014·Granted Dec 8, 2015·5 cites·74 claims
- 1673US5150195ARapid-curing adhesive formulation for semiconductor devicesJOHNSON MATTHEY INC·Filed 1990·Granted Sep 22, 1992·47 cites·17 claims
- 1771US5852092AOrganosilicon-containing compositions having enhanced adhesive propertiesJOHNSON MATTHEY INC·Filed 1997·Granted Dec 22, 1998·22 cites·14 claims
- 1871US5612403ALow temperature flexible die attach adhesive and articles using sameJOHNSON MATTHEY INC·Filed 1995·Granted Mar 18, 1997·29 cites·3 claims
- 1969US5250600ALow temperature flexible die attach adhesive and articles using sameJOHNSON MATTHEY INC·Filed 1992·Granted Oct 5, 1993·29 cites·15 claims
- 2067US7608324B2Interface materials and methods of production and use thereofHONEYWELL INT INC·Filed 2002·Granted Oct 27, 2009·8 cites·49 claims
- 2165US5399907ALow temperature flexible die attach adhesive and articles using sameJOHNSON MATTHEY INC·Filed 1993·Granted Mar 21, 1995·25 cites·16 claims
- 2264US10481653B2Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewithHenkel IP & Holding GmbH·Filed 2016·Granted Nov 19, 2019·1 cites·17 claims
- 2364US5075262ASilver-glass pastesJOHNSON MATTHEY INC·Filed 1990·Granted Dec 24, 1991·40 cites·9 claims
- 2463US5859105AOrganosilicon-containing compositions capable of rapid curing at low temperatureJOHNSON MATTHEY INC·Filed 1997·Granted Jan 12, 1999·22 cites·11 claims
- 2563US5155066ARapid-curing adhesive formulation for semiconductor devicesJOHNSON MATTHEY INC·Filed 1991·Granted Oct 13, 1992·32 cites·12 claims
- 2662US8338536B2Adhesive compositions for use in die attach applicationsNGUYEN MY·Filed 2010·Granted Dec 25, 2012·1 cites·10 claims
- 2760US9223363B2Electronic devices assembled with heat absorbing and/or thermally insulating compositionHenkel IP & Holding GmbH·Filed 2013·Granted Dec 29, 2015·1 cites·18 claims
- 2860US9209105B2Electronic devices assembled with thermally insulating layersHenkel IP & Holding GmbH·Filed 2014·Granted Dec 8, 2015·1 cites·20 claims
- 2958US11155065B2Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewithHenkel IP & Holding GmbH·Filed 2019·Granted Oct 26, 2021·0 cites·4 claims
- 3054US5489637ALow temperature flexible die attach adhesive and articles using sameJOHNSON MATTHEY INC·Filed 1995·Granted Feb 6, 1996·14 cites·20 claims
- 3154US2019198419A1Thermally insulating composition and electronic devices assembled therewithHenkel IP & Holding GmbH·Filed 2018·Application pending·0 cites
- 3253US8648460B2Thermal interface material with epoxidized nutshell oilNGUYEN MY NHU·Filed 2012·Granted Feb 11, 2014·1 cites·11 claims
- 3352US5371178ARapidly curing adhesive and methodJOHNSON MATTHEY INC·Filed 1993·Granted Dec 6, 1994·20 cites·14 claims
- 3452US2014220337A1Adhesive compositions for use in die attach applicationsHenkel US IP LLC·Filed 2013·Application pending·0 cites
- 3552US2015155220A1Thermally insulative composition and electronic devices assembled therewithHenkel IP & Holding GmbH·Filed 2014·Application pending·0 cites
- 3647US5386000ALow temperature flexible die attach adhesive and articles using sameJOHNSON MATTHEY INC·Filed 1993·Granted Jan 31, 1995·15 cites·9 claims
- 3747US2010140542A1Benzoxazine containing compositions of matter and curable compositions made therewithHENKEL CORP·Filed 2009·Application pending·0 cites
- 3847US2008044670A1Interface materials and methods of production and use thereofNGUYEN MY·Filed 2007·Application pending·0 cites
- 3945US11416046B2Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewithHENKEL AG & CO KGAA·Filed 2015·Granted Aug 16, 2022·0 cites·18 claims
- 4044US8698320B2Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devicesNGUYEN MY NHU·Filed 2009·Granted Apr 15, 2014·0 cites·17 claims
- 4144US5195299AMethod of reducing moisture content of hermetic packages containing semiconductor devicesJOHNSON MATTHEY INC·Filed 1992·Granted Mar 23, 1993·13 cites·3 claims
- 4242US2012279697A1Thermal interface material with phenyl esterFORRAY DEBORAH·Filed 2012·Application pending·0 cites
- 4339US5708129ADie attach adhesive with reduced resin bleedJOHNSON MATTHEY INC·Filed 1996·Granted Jan 13, 1998·9 cites·10 claims
- 4433US5524422AMaterials with low moisture outgassing properties and method of reducing moisture content of hermetic packages containing semiconductor devicesJOHNSON MATTHEY INC·Filed 1995·Granted Jun 11, 1996·3 cites·10 claims
- 4533US2017322600A1Compositions having a matrix and a hydrated salt of an acid and a group i or ii elment of the periodic table dispersed therein, and electronic devices assembled therewithHenkel IP & Holding GmbH·Filed 2017·Application pending·0 cites
- 4632US6117930AResin systems for organosilicon-containing compositionsJOHNSON MATTHEY INC·Filed 1998·Granted Sep 12, 2000·2 cites·14 claims
- 4730US2006040112A1Thermal interconnect and interface systems, methods of production and uses thereofDEAN NANCY·Filed 2003·Application pending·0 cites
- 4829US2007164424A1Thermal interconnect and interface systems, methods of production and uses thereofDEAN NANCY·Filed 2004·Application pending·0 cites
- 4928US4986849ASilver-glass pastesJOHNSON MATTHEY INC·Filed 1988·Granted Jan 22, 1991·4 cites·4 claims
- 5026US5164119ASilver-glass pastesJOHNSON MATTHEY INC·Filed 1990·Granted Nov 17, 1992·2 cites·5 claims
Join the waitlist — get patent alerts
Get an alert when My N. Nguyen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →