Adhesive compositions for use in die attach applications

Abstract

Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

1 . An adhesive composition, comprising:
 a curable resin component;   a curing agent; and   a block copolymer additive comprising hydrophobic segments and hydrophilic segments, wherein the glass transition temperature of the block copolymer additive is at least about 40° C.; and   a composition comprising:   a first epoxy component;   a second silane-modified epoxy component, wherein the second silane-modified epoxy component arises from reaction of an aromatic epoxy resin and an epoxy silane in a weight ratio of from about 1:10 to about 10:1,   
       wherein the epoxy silane is embraced by the following structure:
   R 1 —Si(OR 2 ) 3  
 
 
       wherein R 1  is an oxirane-containing moiety and R 2  is an alkyl or alkoxy-substituted alkyl, aryl or aralkyl group having from 1 to ten carbon atoms. 
     
     
         2 - 31 . (canceled) 
     
     
         32 . An assembly comprising a hydrophilic substrate and a partially cured adhesive composition, wherein the adhesive composition comprises a curable resin component, a curing agent, and a block copolymer additive comprising hydrophobic segments and hydrophilic segments, wherein the glass transition temperature of the additive is at least about 40° C., and a composition comprising:
 As component (A) an epoxy component embraced by the following structure: 
 
       
         
           
           
               
               
           
         
       
       wherein Y may or may not be present and when Y present is a direct bond, CH 2 , CH(CH 3 ) 2 , C═O, or S, R 1  here is alkyl, alkenyl, hydroxy, carboxy and halogen, and x here is 1-4;
 As component (B) an epoxy-functionalized alkoxy silane embraced by the following structure:
   R 1 —Si(OR 2 ) 3   (VIII)
 
 
 
       where R 1  is an oxirane-containing moiety and R 2  is an alkyl or alkoxy-substituted alkyl, aryl, or aralkyl group having from one to ten carbon atoms; and
 As component (C) reaction products of components (A) and (B). 
 
     
     
         33 . The composition of  claim 1 , further comprising
 a thermoplastic urethane; and   diaminophenyl sulfone.   
     
     
         34 . A composition of matter comprising:
 As component (A) an epoxy component embraced by the following structure:   
       
         
           
           
               
               
           
         
       
       wherein Y may or may not be present and when Y present is a direct bond, CH 2 , CH(CH 3 ) 2 , C═O, or S, R 1  here is alkyl, alkenyl, hydroxy, carboxy and halogen, and x here is 1-4;
 As component (B) an epoxy-functionalized alkoxy silane embraced by the following structure:
   R 1 —Si(OR 2 ) 3   (VIII)
 
 
 
       wherein R 1  is an oxirane-containing moiety and R 2  is an alkyl or alkoxy-substituted alkyl, aryl, or aralkyl group having from one to ten carbon atoms; and
 As component (C) reaction products of components (A) and (B). 
 
     
     
         35 . The composition of  claim 34 , wherein component (C) is made from components (A) and (B) in a by weight ratio of 1:100 to 100:1. 
     
     
         36 . The composition of  claim 34 , wherein component (C) is made from components (A) and (B) in a by weight ratio of 1:10 to 10:1. 
     
     
         37 . The composition of  claim 34 , wherein the first epoxy component is a solid epoxy resin derived from the group consisting of bisphenol A, bisphenol F, bisphenol S, tetramethylbiphenyl, biphenyl, and novolacs; or wherein the epoxy component is tris(2,3-epoxy-propyl)isocyanurate or a dicyclopentadiene (“DCPD”) epoxy resin, or combinations thereof. 
     
     
         38 . An adhesive composition, comprising:
 a curable resin component;   a curing agent; and   a block copolymer additive comprising hydrophobic segments and hydrophilic segments,   wherein the glass transition temperature of the block copolymer additive is at least about 40° C.; and   a composition comprising:   an epoxy modified silane comprising:   As component (A) an epoxy component embraced by the following structure:   
       
         
           
           
               
               
           
         
       
       wherein Y may or may not be present and when Y present is a direct bond, CH 2 , CH(CH 3 ) 2 , C═O, or S, R 1  here is alkyl, alkenyl, hydroxy, carboxy and halogen, and x here is 1-4;
 As component (B) an epoxy-functionalized alkoxy silane embraced by the following structure:
   R 1 —Si(OR 2 ) 3   (VIII)
 
 
 
       where R 1  is an oxirane-containing moiety and R 2  is an alkyl or alkoxy-substituted alkyl, aryl, or aralkyl group having from one to ten carbon atoms; and
 As component (C) reaction products of components (A) and (B). 
 
     
     
         39 . The composition of  claim 38 , wherein component (C) is made from components (A) and (B) in a by weight ratio of 1:100 to 100:1. 
     
     
         40 . The composition of  claim 38 , wherein component (C) is made from components (A) and (B) in a by weight ratio of 1:10 to 10:1. 
     
     
         41 . The composition of  claim 38 , wherein the first epoxy component is a solid epoxy resin derived from the group consisting of bisphenol A, bisphenol F, bisphenol S, tetramethylbiphenyl, biphenyl, and novolacs; or wherein the epoxy component is tris(2,3-epoxy-propyl)isocyanurate or a dicyclopentadiene (“DCPD”) epoxy resin, or combinations thereof.