Inventor · disambiguated record
Myung-Beom Park
Also filed as: PARK MYUNG-BEOM
5 granted patents·4 pending applications·0 citations·filing 2009–2025
59Inventor score
Top patents by PatentIndex Score
9 records- 0181US2025369687A1Carbon dioxide reusing system and methodSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0272US12416447B2Carbon dioxide reusing system and methodSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 16, 2025·0 cites·11 claims
- 0353US9562299B2Copper electroplating solution and copper electroplating apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Feb 7, 2017·0 cites·9 claims
- 0448US9840785B2Tin plating solution, tin plating equipment, and method for fabricating semiconductor device using the tin plating solutionSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Dec 12, 2017·0 cites·20 claims
- 0540US2009233439A1Method of forming an ohmic layer and method of forming a metal wiring of a semiconductor device using the samePARK MYUNG-BEOM·Filed 2009·Application pending·0 cites
- 0634US2010084277A1Composition for copper plating and associated methodsPARK MYUNG-BEOM·Filed 2009·Application pending·0 cites
- 0731US8795505B2Copper electroplating methodPARK MYUNG-BEOM·Filed 2011·Granted Aug 5, 2014·0 cites·14 claims
- 0830US2012193238A1Compositions For Plating Copper And Methods Of Forming A Copper Bump Using The SamePARK MYUNG-BEOM·Filed 2011·Application pending·0 cites
- 0922US9911612B2Methods of manufacturing semiconductor devices including impurity regionsSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 6, 2018·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →