Inventor · disambiguated record
Myung Jin Yim
Also filed as: YIM MYUNG J · YIM MYUNG JIN
27 granted patents·17 pending applications·413 citations·filing 2000–2025
96Inventor score
Top patents by PatentIndex Score
44 records- 0196US6238597B1Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrateKOREA ADVANCED INST SCI & TECH·Filed 2000·Granted May 29, 2001·133 cites·5 claims
- 0295US8383460B1Method for fabricating through substrate vias in semiconductor substrateGLOBALFOUNDRIES INC·Filed 2011·Granted Feb 26, 2013·28 cites·20 claims
- 0391US11531174B2Co-packaging with silicon photonics hybrid planar lightwave circuitINTEL CORP·Filed 2017·Granted Dec 20, 2022·8 cites·17 claims
- 0490US11982854B2Co-packaging with silicon photonics hybrid planar lightwave circuitINTEL CORP·Filed 2022·Granted May 14, 2024·1 cites·23 claims
- 0587US6362090B1Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating methodKOREA ADVANCED INST SCI & TECH·Filed 2000·Granted Mar 26, 2002·50 cites·4 claims
- 0686US7446384B2CMOS image sensor module with wafersKOREA ADVANCED INST SCI & TECH·Filed 2006·Granted Nov 4, 2008·15 cites·9 claims
- 0786US6878435B2High adhesion triple layered anisotropic conductive adhesive filmKOREA ADVANCED INST SCI & TECH·Filed 2002·Granted Apr 12, 2005·46 cites·6 claims
- 0886US6518097B1Method for fabricating wafer-level flip chip package using pre-coated anisotropic conductive adhesiveKOREA ADVANCED INST SCI & TECH·Filed 2000·Granted Feb 11, 2003·66 cites·10 claims
- 0983US10727368B2Optoelectronic device module having a silicon interposerINTEL CORP·Filed 2016·Granted Jul 28, 2020·4 cites·16 claims
- 1078US2024264396A1Co-packaging with silicon photonics hybrid planar lightwave circuitINTEL CORP·Filed 2024·Application pending·0 cites
- 1177US10014654B2Optoelectronic packaging assembliesINTEL CORP·Filed 2013·Granted Jul 3, 2018·5 cites·19 claims
- 1277US8409927B1Methods for fabricating integrated circuit systems including high reliability die under-fillYIM MYUNG JIN·Filed 2011·Granted Apr 2, 2013·5 cites·20 claims
- 1374US6930399B2High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the sameTELEPHUS INC·Filed 2001·Granted Aug 16, 2005·11 cites·7 claims
- 1473US12078853B2Semiconductor package with embedded optical dieINTEL CORP·Filed 2021·Granted Sep 3, 2024·0 cites·18 claims
- 1572US7081675B2Multilayered anisotropic conductive adhesive for fine pitchTELEPHUS INC·Filed 2004·Granted Jul 25, 2006·24 cites·11 claims
- 1671US9900102B2Integrated circuit with chip-on-chip and chip-on-substrate configurationINTEL CORP·Filed 2015·Granted Feb 20, 2018·2 cites·17 claims
- 1770US11156788B2Semiconductor package with embedded optical dieINTEL CORP·Filed 2016·Granted Oct 26, 2021·1 cites·11 claims
- 1869US10242976B2In-package photonics integration and assembly architectureINTEL CORP·Filed 2016·Granted Mar 26, 2019·1 cites·9 claims
- 1968US9041228B2Molding compound including a carbon nano-tube dispersionYIM MYUNG JIN·Filed 2008·Granted May 26, 2015·3 cites·19 claims
- 2066US9950464B2Forming a carbon nano-tube dispersionMICRON TECHNOLOGY INC·Filed 2015·Granted Apr 24, 2018·1 cites·21 claims
- 2162US9893816B2Dynamic beam steering optoelectronic packagesINTEL CORP·Filed 2016·Granted Feb 13, 2018·1 cites·20 claims
- 2262US9374902B2Package including an underfill material in a portion of an area between the package and a substrate or another packageMICRON TECHNOLOGY INC·Filed 2013·Granted Jun 21, 2016·2 cites·29 claims
- 2361US2025329673A1Direct Wire Reveal PackageAPPLE INC·Filed 2024·Application pending·0 cites
- 2460US2024421126A1Chip Singulation Assisted Structures and Methods for Improving Bonding Interface QualityAPPLE INC·Filed 2024·Application pending·0 cites
- 2558US10953593B2Molding compound including a carbon nano-tube dispersionMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 23, 2021·0 cites·20 claims
- 2658US2019172821A1In-package photonics integration and assembly architectureINTEL CORP·Filed 2019·Application pending·0 cites
- 2757US2025046674A1Recess Island Lid Design for TIM Delamination Risk MitigationAPPLE INC·Filed 2023·Application pending·0 cites
- 2856US8451620B2Package including an underfill material in a portion of an area between the package and a substrate or another packageYIM MYUNG JIN·Filed 2009·Granted May 28, 2013·2 cites·32 claims
- 2953US2025391664A1Plasma Dicing for Multi-Tier Die for Die Strength Enhancement and Irregular Shaped DicingAPPLE INC·Filed 2025·Application pending·0 cites
- 3050US6514560B2Method for manufacturing conductive adhesive for high frequency flip chip package applicationsKOREA ADVANCED INST SCI & TECH·Filed 2002·Granted Feb 4, 2003·4 cites·10 claims
- 3150US2006035036A1Anisotropic conductive adhesive for fine pitch and COG packaged LCD moduleTELEPHUS INC·Filed 2004·Application pending·0 cites
- 3244US2010164083A1Protective thin film coating in chip packagingNUMONYX BV·Filed 2008·Application pending·0 cites
- 3344US2010123258A1Low Temperature Board Level Assembly Using Anisotropically Conductive MaterialsYIM MYUNG JIN·Filed 2008·Application pending·0 cites
- 3442US2007054419A1Wafer level chip size package for CMOS image sensor module and manufacturing method thereofPAIK KYUNG-WOOK·Filed 2006·Application pending·0 cites
- 3539US8344491B2Multi-die building block for stacked-die packageMICRON TECHNOLOGY INC·Filed 2008·Granted Jan 1, 2013·0 cites·21 claims
- 3639US2010148359A1Package on Package Assembly using Electrically Conductive Adhesive MaterialQUEVEDO NANETTE·Filed 2008·Application pending·0 cites
- 3738US2003008133A1Anisotropic conductive film and method of fabricating the same for ultra-fine pitch COG applicationKOREA ADVANCED INST SCI & TECH·Filed 2002·Application pending·0 cites
- 3836US10347615B2Method of fabricating an optical module that includes an electronic packageINTEL CORP·Filed 2015·Granted Jul 9, 2019·0 cites·10 claims
- 3936US2018041003A1Chip on chip (coc) package with interposerINTEL CORP·Filed 2016·Application pending·0 cites
- 4035US2010167466A1Semiconductor package substrate with metal bumpsADIMULA RAVIKUMAR·Filed 2008·Application pending·0 cites
- 4135US2018348434A1Photonic die package with edge lensINTEL CORP·Filed 2017·Application pending·0 cites
- 4234US2019324223A1Photonic engine platform utilizing embedded wafer level packaging integrationINTEL CORP·Filed 2016·Application pending·0 cites
- 4333US2017288780A1Optoelectronic transceiver assembliesINTEL CORP·Filed 2016·Application pending·0 cites
- 4431US8653675B2Package including at least one topological feature on an encapsulant material to resist out-of-plane deformationZHANG JAMES JIAN·Filed 2009·Granted Feb 18, 2014·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →